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High Precision 4 layers Ro5880 PCB circuit board Fabrication

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Frequency Performance: The 4-layer Ro5880 PCB is engineered for precision in high-frequency applications, leveraging Ro5880's low-loss characteristics to ensure optimal signal integrity and minimal interference.
  • Multi-Layer Design: The 4-layer structure enables complex circuit configurations, separating power, ground, and signal layers to enhance performance in dense electronic systems.

Key features

  • 1. High-Frequency Material Technology

  • With Ro5880 high-frequency substrate, achieve superior signal integrity and thermal stability compared to traditional FR-4 materials*. The advanced dielectric properties of Ro5880 ensure reliable performance in high-speed applications.

  • 2. Symmetrical 4-Layer Design

  • With a symmetrical 4-layer architecture, reduce signal interference and ensure balanced electrical performance across all directions*. This design minimizes crosstalk and optimizes impedance control for complex circuit requirements.

  • 3. Enhanced Performance Capacity

  • With a 4-layer structure, support high-density component placement and complex circuit configurations, boosting performance by up to 30% compared to 2-layer PCBs*. The multilayer design accommodates advanced functionalities like high-frequency signal routing.

  • 4. High-Frequency Application Readiness

  • Optimized for high-frequency applications, enable reliable operation in telecommunications, radar systems, and aerospace equipment*. The Ro5880 substrate and gold-plated traces ensure stability in demanding environments.

  • 5. Industry-Standard Compliance

  • Certified to IPC-6012 Class 3 standards, ensure compliance with high-reliability commercial and industrial specifications*. The PCB meets rigorous quality and durability requirements for mission-critical systems.

Product details

High Precision 4 layers Ro5880 PCB circuit board Fabrication

The High Precision 4-Layer Ro5880 PCB is engineered for high-frequency applications, combining advanced material science with precise manufacturing. Built with Rogers Ro5880 substrate, this multilayer PCB offers exceptional signal integrity and thermal stability, making it ideal for 5G, radar systems, and high-speed digital circuits.

Technical specifications

FeatureSpecificationBenefit
MaterialRogers Ro5880 PTFE-based substrateLow dielectric loss for high-frequency performance
Layers4-layerEnables complex circuit routing and isolation
Surface FinishImmersion Gold (ENIG)Superior conductivity and corrosion resistance
DesignSymmetrical multilayer structureReduces crosstalk and ensures signal consistency
AssemblySMT-compatible with 0.2mm pitch supportSupports dense component placement for compact designs
Thermal PerformanceTg: 280°C, Dk: 6.18 ±0.05@10GHzHandles high-power applications without warping

Customization guide

Adjust trace widths (minimum 4mil) or layer count (up to 6 layers) to meet specific impedance requirements. Opt for thicker copper weights (up to 3oz) for high-current applications.

Get inspired

With Ro5880’s low-loss properties, you can achieve seamless signal transmission in 5G base stations. The symmetrical design ensures reliable performance in automotive radar systems, while immersion gold plating extends lifespan in corrosive environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Signal Integrity (dB)-1.2@10GHz-0.8@10GHz (+33%)-0.5@10GHz (+100%)*
Layer Count4-layer6-layer8-layer
Thermal Conductivity0.85 W/m·K1.2 W/m·K (+41%)1.5 W/m·K (+76%)
Operating FrequencyUp to 20GHzUp to 30GHzUp to 40GHz

Supplier's note

  1. Technical Breakthroughs:

    • Ro5880 Substrate: Reduces signal loss by 20% compared to FR-4, enabling GHz-range applications.
    • Symmetrical Stackup: Cuts crosstalk by 50% in high-density designs.
    • Immersion Gold Finish: Extends operational lifespan by 3x in harsh environments.
  2. Version Selection Guidance:

    • Pro Model: Ideal for aerospace and medical imaging systems requiring 40GHz+ performance. Its 8-layer design and 1.5 W/m·K thermal conductivity handle extreme power densities.
    • Advanced Model: Best for industrial IoT and automotive radar (up to 30GHz), balancing cost and performance.
    • Base Model: Suitable for standard 5G small cells or test equipment where 20GHz suffices.

*Performance gains vs. industry benchmarks (IPC-6012E compliant).

Frequently asked questions

  • Which 4-layer PCB model is best suited for high-frequency applications?

  • What materials are used in your 4-layer Ro5880 PCB fabrication?

  • How do I maintain the gold-plated traces on my multilayer PCB?

  • Is the Ro5880 PCB FDA-approved for medical devices?

  • Can I customize the layer configuration of a 4-layer Ro5880 PCB?

  • What advantages does a 4-layer Ro5880 PCB offer over 2-layer PCBs?

  • How does the surface finish of a Ro5880 PCB compare to ENIG?

  • Is the 4-layer Ro5880 PCB compatible with SMT assembly?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionHigh-frequency RF, aerospace systemsIndustry Standard: FR-4 (Dk 4.4 ±0.2 @1GHz)
Our Base: FR-4 (same)
Our Advanced: Ro5880 (Dk 6.15 ±0.05 @10GHz)▲▲
▲▲ Advanced: Reduced signal distortion in GHz frequencies (meets IEEE C37.51)▲▲ Advanced: 30% higher cost vs Base (ASTM D638 tensile test compliant)
Layer Count & DesignComplex embedded systems, IoT devicesIndustry Standard: 4-layer (±10% impedance tolerance)
Our Base: 4-layer (±7% tolerance)
Our Advanced: 4-layer optimized stackup (±3% tolerance)▲▲
▲▲ Advanced: 70% lower crosstalk in high-speed traces (per TDR analysis)▲▲ Advanced: Requires advanced CAD tools for design (IPC-2221 compliant)
Surface FinishFine-pitch components, automotiveIndustry Standard: HASL (lead-free, 20µm thickness)
Our Base: ENIG (3µm Ni/0.05µm Au)
Our Advanced: Immersion Gold + OSP▲
Base: 50% better solderability for BGA packages (J-STD-001 certified)▲▲ Advanced: 20% higher cost vs Base (ASTM B568 plating specs)
Thermal PerformancePower electronics, LED driversIndustry Standard: Thermal conductivity 1.4 W/mK (FR-4)
Our Base: Same as Standard
Our Advanced: 1.6 W/mK (Ro5880)▲
Advanced: 14% better heat dissipation (ASTM E1461 verified)Advanced: 25% heavier material (IPC-4101 compliance)
Signal Integrity5G base stations, radar systemsIndustry Standard: Crosstalk >-30 dB @1 GHz
Our Base: -35 dB▲
Our Advanced: -40 dB▲▲
▲▲ Advanced: 40% lower jitter in 28Gbps signals (per IBIS modeling)▲▲ Advanced: Requires tighter manufacturing tolerances (IPC-A-600 Class 3)
Customization OptionsMilitary, medical devicesIndustry Standard: Fixed stackup
Our Base: Trace width down to 0.15mm▲
Our Advanced: Full material/impedance tuning▲▲
▲▲ Advanced: Supports 0.05mm trace widths (ISO 17100 certified)▲▲ Advanced: 30% longer lead time (IPC-6012H compliance)

Product reviews

⭐ Customer Reviews and Testimonials

Authentic User Feedback

🔬 Aerospace Engineer Reviews

⭐⭐⭐⭐⭐ Dr. Alan Whitaker - Aerospace Systems Engineer
"We integrated the 4-layer Ro5880 PCB into our phased array radar prototypes, and the signal integrity at 18GHz has been outstanding. The symmetrical stackup drastically reduced crosstalk, and thermal stability during extended high-power runs is impressive. No delamination even after 6 months of environmental cycling."

Purchase Date: February 2025 | Usage Period: 5 months


📡 5G Infrastructure Developer Reviews

⭐⭐⭐⭐⭐ Lena Park - RF Design Lead, Telecom Solutions Inc.
"This PCB is a game-changer for our 5G small cell base stations. The Ro5880 substrate delivers consistent performance up to 20GHz, exactly as specified. We’ve seen a 33% reduction in insertion loss compared to our previous FR-4 designs. SMT assembly was flawless—tight pitch components aligned perfectly."

Purchase Date: November 2024 | Usage Period: 7 months


🏥 Medical Imaging Technician Reviews

⭐⭐⭐⭐☆ Dr. Marcus Liu - Biomedical Engineering Lab
"Used in a prototype MRI signal processing module. The gold-plated traces have held up well under repeated thermal cycles, and we’ve observed minimal signal distortion. FDA compliance was a key factor in our selection. Minor note: design tools needed calibration for impedance control, but support provided excellent guidance."

Purchase Date: January 2025 | Usage Period: 6 months


🚘 Automotive Radar Developer Reviews

⭐⭐⭐⭐⭐ Javier Mendez - Senior Hardware Engineer, AutoSens Tech
"Deployed in our 77GHz automotive radar development platform (using Pro Model with 8-layer upgrade). The low dielectric loss of Ro5880 is critical for maintaining phase coherence. We’re seeing sub-0.5dB signal loss at 30GHz, which is exceptional. Highly recommend for any high-frequency ADAS applications."

Purchase Date: April 2024 | Usage Period: 8 months


🏭 Industrial IoT Project Manager Reviews

⭐⭐⭐⭐☆ Fiona Chen - IoT Systems Integrator
"We’re using the Advanced Model in industrial sensor gateways exposed to high EMI and temperature swings. The 1.2 W/m·K thermal conductivity keeps components cool, and the ENIG finish resists oxidation in humid factory environments. Lead time was longer than expected (~4 weeks), but quality justifies the wait."

Purchase Date: September 2024 | Usage Period: 4 months


📊 Rating Statistics

Average Rating: 4.9/5 ⭐ (89 Reviews)

Detailed Rating Distribution:

  • ⭐⭐⭐⭐⭐ (5-star): 74 reviews (83.1%)
  • ⭐⭐⭐⭐☆ (4-star): 13 reviews (14.6%)
  • ⭐⭐⭐☆☆ (3-star): 2 reviews (2.2%)
  • ⭐⭐☆☆☆ (2-star): 0 reviews (0%)
  • ⭐☆☆☆☆ (1-star): 0 reviews (0%)

🏆 Industry Expert Recommendations

RF Engineering Expert Recommendation

Dr. Elena Torres - RF & Microwave Consultant (IEEE Fellow)
"For high-frequency designs above 10GHz, material choice is non-negotiable. The Ro5880-based 4-layer PCB here offers a compelling balance of performance and manufacturability. Its Dk stability at 6.18±0.05 ensures predictable impedance control, and the symmetrical design mitigates skew in differential pairs. Ideal for radar and mmWave applications."

High-Speed Digital Design Specialist Recommendation

Rajiv Patel - Principal PCB Architect, NexLogic Technologies
"Having evaluated dozens of high-frequency laminates, I can say this 4-layer Ro5880 solution stands out for SMT compatibility and thermal resilience. The 0.2mm pitch support allows for dense BGA routing, and the Tg of 280°C prevents warpage during reflow. A solid choice for next-gen communication hardware."


💬 Latest User Reviews

Recent 30-Day Review Highlights:

⭐⭐⭐⭐⭐ "Unmatched Signal Clarity" - Daniel Kim (Radar Systems Lab)

Posted: 2 days ago

"Using in a defense-grade tracking system. Signal-to-noise ratio improved significantly. Support team helped optimize trace widths for 50Ω impedance. Will be reordering for next phase."

⭐⭐⭐⭐⭐ "Reliable in Harsh Conditions" - Sofia Alvarez (Oil & Gas Monitoring)

Posted: 1 week ago

"Deployed in remote sensor nodes with extreme temperature swings. No failures in 5 months. Gold plating prevents corrosion even in salty coastal air."

⭐⭐⭐⭐☆ "Great for Prototyping" - Tom Reynolds (University Research)

Posted: 3 weeks ago

"Perfect for student projects involving GHz-range circuits. Clear documentation and consistent material specs make it ideal for academic use. Slight premium price, but worth it."


🎯 Reviews by Use Case Category

🛰️ Aerospace & Defense (28 Reviews)

  • Average Rating: 5.0/5
  • Most Praised Features:
  • Signal integrity at high frequencies (96% mentioned)
  • Thermal resistance (93% mentioned)
  • IPC-6012 Class 3 compliance (89% mentioned)

📶 Telecommunications (33 Reviews)

  • Average Rating: 4.9/5
  • Most Praised Features:
  • Low dielectric loss (94% mentioned)
  • SMT compatibility (91% mentioned)
  • Consistent Dk across batches (88% mentioned)

🏥 Medical & Scientific Instruments (19 Reviews)

  • Average Rating: 4.8/5
  • Most Praised Features:
  • FDA/RoHS compliance (95% mentioned)
  • Long-term reliability (87% mentioned)
  • Gold plating durability (82% mentioned)

🚗 Automotive & ADAS (9 Reviews)

  • Average Rating: 4.9/5
  • Most Praised Features:
  • Performance at 24–30GHz (100% mentioned)
  • Symmetrical layer design (94% mentioned)
  • Custom impedance support (89% mentioned)

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