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  • High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste
  • High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste
  • High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste
  • High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste
  • High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste
  • High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste
High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste

High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste

  • 100 - 4999 Grams
    $22
  • 5000 - 9999 Grams
    $19
  • >= 10000 Grams
    $18.50

Customization:

Customized packaging（Min.Order: 20000 pieces）
View product details

High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Reliability Silver Sintering Paste: Designed for achieving exceptional joint strength and super thermal conductivity in soldering applications, particularly for copper alloys.
  • Nano Sintered Technology: Ensures precise bonding with minimal thermal resistance, ideal for high-performance electronic and industrial components.
  • RoHS Compliance: Meets environmental standards, ensuring safe use in regulated manufacturing environments.

Key features

  • 1. Material Technology: Nano Silver Sintered Paste

    • With nano silver (Ag) particles, you can achieve super thermal conductivity and joint strength that outperform traditional silver pastes*. The fine particle structure ensures uniform sintering, delivering durable connections even in high-temperature environments.

  • 2. Interactive Design: Airtight Container with Textured Cap

    • With an airtight, textured cap design, you can ensure precise application and prevent contamination during storage. The durable plastic container withstands chemical exposure, maintaining paste integrity for consistent performance.

  • 3. Performance Parameters: Superior Thermal Conductivity

    • With super thermal conductivity, you can maintain efficient heat dissipation in high-power electronics and industrial applications. The paste’s formulation ensures reliable operation under extreme thermal stress.

  • 4. Scenario Solutions: Copper Alloy Compatibility for Electronics & Industrial Use

    • Designed for copper alloys, this paste allows you to create robust joints in electronics assembly, automotive components, and industrial machinery. Its pressure-resistant properties ensure long-term reliability in demanding environments.

  • 5. Certification Standards: RoHS Compliance for Global Use

    • With RoHS certification, you can meet strict environmental and safety standards for global electronics manufacturing. The paste avoids restricted hazardous substances, aligning with eco-conscious production practices.

Product details

High Reliability Silver Sintering Paste Pressured Excellent Joint Strength Super Thermal Conductivity Nano Sintered Paste

The High Reliability Silver Sintering Paste is a nano-sintered adhesive designed for copper alloy applications, offering exceptional joint strength, thermal conductivity, and pressure resistance. Certified to RoHS standards, it ensures compliance with global environmental regulations while delivering robust performance in electronics, industrial machinery, and high-temperature environments.

Technical specifications

FeatureSpecificationBenefit
MaterialSilver (Ag) nano-sintered pasteSuperior thermal/electrical conductivity
CertificationRoHS compliantSafe for global electronics manufacturing
FormHigh-viscosity pastePrevents premature settling in vertical joints
Joint Strength35 MPa (under 200°C sintering)Withstands mechanical stress in harsh environments
Thermal Conductivity85 W/m·K (at 25°C)30% higher than standard solder pastes
Operating Temp.-50°C to 300°CReliable in extreme thermal cycles

Customization guide

Adjustable parameters:

  • Viscosity: Tailored for thin-layer coating or thick-section filling.
  • Curing Profile: Optimized for rapid sintering (15-30 mins) or extended curing cycles.
  • Particle Size: Nano (<50 nm) or micro (50-100 nm) for varying surface adhesion needs.

Get inspired

Engineered for precision in electronics assembly and industrial bonding, this paste ensures durable joints in applications like power semiconductors, heat sinks, and copper alloy connectors. Its nano-sintered structure minimizes porosity, enhancing long-term reliability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Joint Strength35 MPa+20% (42 MPa)+35% (47 MPa)*
Thermal Conductivity85 W/m·K95 W/m·K105 W/m·K
Operating Temp.-50°C to 300°C-50°C to 350°C-50°C to 400°C
Curing Speed30 mins20 mins15 mins

Supplier's note

  1. Technical Breakthroughs:

    • Nano-sintered particles: Achieve 30% higher thermal conductivity than conventional pastes.
    • RoHS compliance: Enables use in EU/US electronics without regulatory barriers.
    • Pressure resistance: Withstands 47 MPa joint strength in Pro Model, ideal for aerospace or automotive components.

  2. Optimal Version Selection:

    • Base Model: Suitable for standard electronics assembly (e.g., PCB connectors).
    • Advanced Model: Preferred for high-power devices (e.g., LED heat sinks) needing faster curing.
    • Pro Model: Designed for extreme environments (e.g., aerospace engines) with ultra-high thermal demands.

With its nano-sintered silver formulation, the Pro Model’s 105 W/m·K thermal conductivity enables safe handling of high-power semiconductors. Pair this with its 400°C tolerance, and you achieve seamless heat dissipation in automotive inverters. For hobbyists, the Base Model’s 30-minute curing aligns with DIY repair workflows.

Note: The Pro Model’s 47 MPa joint strength exceeds industry benchmarks by 15%, ensuring durability in vibration-heavy applications.

Frequently asked questions

  • Which silver sintering paste model is best for copper alloy applications?

  • How should I store silver sintering paste to maintain its properties?

  • Why choose silver sintering paste over lead-based solders for electronics?

  • Can this silver paste be customized for different curing times?

  • Is the silver sintering paste RoHS compliant for EU applications?

  • What applications benefit most from this paste’s super thermal conductivity?

  • Are there usage tips for achieving maximum joint strength?

  • Does the silver sintering paste maintain durability under thermal cycling?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Silver Sintering Paste (Our Advanced)High-reliability electronics, aerospace, automotiveThermal Conductivity: 200 W/m·K (▲ from Base: 150 W/m·K)▲ Superior heat dissipation (e.g., for power electronics)Higher cost vs. traditional solders
Lead-Free Solder PasteRoHS-compliant electronics assemblyMelting Point: 217–220°C (J-STD-006 compliant)Environmentally friendly, cost-effective for mass productionLower thermal conductivity (80 W/m·K) limits high-heat applications
Epoxy AdhesiveGeneral bonding in consumer electronicsCured Hardness: 85 Shore D (ASTM D2240)Versatile bonding for non-conductive materials, easy applicationPoor thermal conductivity (0.2 W/m·K) for high-temperature use
Conductive AdhesiveElectrical connections in PCBsResistivity: 10⁻⁵ Ω·cm (IEC 60093)No need for soldering, flexible for delicate componentsLower mechanical strength (10 MPa) vs. sintering pastes
Brazing FluxHigh-temperature industrial jointsMelting Point: 600°C (ASTM B328)Strong joints for heavy-duty applicationsRequires high-temperature furnaces (≥ 700°C), slower process
Indium SolderHigh-temperature semiconductor bondingMelting Point: 156.6°C (IEC 61190-1)Excellent thermal fatigue resistance for cycling tempsHigh cost (5x silver), limited availability

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