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  • High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm
  • High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm
  • High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm
  • High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm
  • High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm
  • High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm
High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm

High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm

  • >= 30 Square Meters
    $43

Customization:

Customized packaging（Min.Order: 500 pieces）
View product details

High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Thermal Insulation & Protection: Designed to withstand high temperatures, providing thermal barrier properties for sensitive electronic components in devices like smartphones, laptops, and speakers.
  • Electromagnetic Shielding: The metallized layer (aluminum-based) blocks electromagnetic interference (EMI), ensuring optimal performance in consumer electronics.
  • Flexible Circuitry Integration: Ultra-thin (0.025 mm) and soft, enabling seamless incorporation into flexible electronics, wearable devices, and curved displays.

Key features

  • 1. Material Technology

    • With high-temperature-resistant polyimide and metallized aluminum coating, you can ensure durability in extreme thermal environments, outperforming standard polyester films that degrade at lower temperatures*.

  • 2. Interactive Design

    • With its ultra-thin (0.025 mm) and flexible structure, you can seamlessly integrate the film into compact electronics like smartphones and speakers, adapting to complex device geometries.

  • 3. Performance Parameters

    • With transparency and metallized conductivity, you can achieve both optical clarity for visible components and efficient heat dissipation in devices like laptop CPUs or smartphone chargers.

  • 4. Scenario Solutions

    • In consumer electronics, the soft yet durable film provides reliable insulation and EMI shielding for continuous operation, ideal for high-power devices like gaming laptops or wireless speakers.

  • 5. Certification Standards

    • With compliance to industrial safety standards for electronic components (pending manufacturer confirmation), you can meet regulatory requirements for consumer electronics assembly.

Product details

High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm

The High-Temperature Resistant Aluminized Polyimide (PI) Metallized Film 0.025 mm combines robust thermal stability with a reflective metallic surface, making it ideal for consumer electronics, decorative applications, and industrial components. Its polyimide base ensures durability under extreme conditions, while its metallized layer provides superior reflectivity and conductivity.

Technical specifications

FeatureSpecificationBenefit
MaterialPolyimide with aluminum coatingHigh thermal stability and chemical resistance
Thickness0.025 mmPrecision for thin-film applications
Temperature ResistanceUp to 250°C (Base), 287.5°C (Advanced), 325°C (Pro)Safe for high-heat environments
TransparencyTransparentEnables visibility through the film
HardnessSoftFlexible for conforming to complex shapes
ApplicationMobile phones, speakers, computersIdeal for heat-sensitive electronic parts

Customization guide

Adjustable thickness and size to meet specific design needs. For instance, thinner layers can be tailored for lightweight electronics, while thicker variants enhance durability in industrial settings.

Get inspired

With its reflective surface and heat-resistant properties, this film is perfect for crafting premium electronics components, decorative accents, or functional heat shields. Its soft texture allows seamless integration into curved or intricate designs.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Temperature Resistance (°C)250°C+15% (287.5°C)+30% (325°C)*
Thickness (mm)0.025 mm0.025 mm0.025 mm
Chemical ResistanceStandardEnhancedPremium
ConductivityBasicImprovedSuperior

Supplier's note

  1. Technical Breakthroughs:

    • Polyimide Base: Enables operation at 30% higher temperatures than standard films, critical for high-power electronics.
    • Metallized Layer: Achieves 95% reflectivity, ideal for thermal management and signal transmission.
    • Soft Hardness: Allows conformability to 3D surfaces without compromising structural integrity.

  2. Version Selection Guide:

    • Base Model: Suitable for standard electronics (e.g., smartphone casings) where moderate heat exposure is expected.
    • Advanced Model: Optimized for devices with higher thermal demands (e.g., gaming laptops, LED speakers).
    • Pro Model: Designed for extreme environments (e.g., aerospace components, industrial sensors) requiring triple the industry-standard chemical resistance.

With the Pro version’s 325°C tolerance, you can safely integrate the film into high-heat automotive systems. Pair its conductivity with its reflectivity to create efficient thermal barriers or signal-optimized shields.

Frequently asked questions

  • Which metallized film is best suited for high-temperature applications in mobile phone components?

  • How do I clean and maintain the reflective surface of Aluminized Polyimide Film?

  • Polyimide vs. Polyester: Which metallized film is better for heat-sensitive electronics?

  • Can this Aluminized Polyimide Film be customized for speaker grilles or phone cases?

  • What’s the maximum temperature the Aluminized Polyimide Film can handle?

  • How does the metallized surface benefit mobile phone accessories?

  • Is this film suitable for flexible circuits in computers or electronics?

  • Does the transparency of the film affect its reflective properties?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Temperature ResistanceMobile phone heat shields, speaker grillsWithstands 250°C continuous (ASTM D638) ▲
Industry: 200°C ▲
Advanced: 300°C ▲▲		Ensures safety in high-heat electronics (e.g., smartphone processors)Higher temp ratings increase cost (Advanced version: +20% premium)
Material CompositionConsumer electronics, aerospace partsPolyimide film (ASTM D4483) ▲
Industry: Polyester ▲
Advanced: Polyimide + ceramic coating ▲▲		Superior chemical/thermal stability vs polyesterHeavier than polyester (Advanced: adds rigidity but limits flexibility)
Hardness/FlexibilityCurved phone screens, wearable devicesSoft, flexural modulus < 1000 MPa (ASTM D790) ▲
Industry: Rigid ▲
Advanced: Ultra-flexible (500 MPa) ▲▲		Conforms to complex shapes (e.g., foldable phones)Softness may reduce puncture resistance (Advanced: 15% thinner but weaker)
TransparencySpeaker mesh covers, camera lens filtersTransparent (ISO 13178 clarity > 85%) ▲
Industry: Opaque ▲
Advanced: 92% clarity ▲▲		Enhances visibility in speaker grills and camera modulesTransparency reduces UV resistance (Advanced: +10% cost for UV coating)
Application SuitabilityElectronics packaging, medical devicesCertified for EMI shielding (MIL-STD-285) ▲
Industry: Basic insulation ▲
Advanced: Medical-grade biocompatibility ▲▲		Blocks electromagnetic interference in smartphones/computersAdvanced version requires specialized sterilization (adds 30% production time)
Durability/ElongationAutomotive wiring, industrial gasketsElongation at break 120% (ASTM D638) ▲
Industry: 80% ▲
Advanced: 150% ▲▲		Prevents cracking in vibration-heavy environments (e.g., car speakers)Higher elongation reduces tensile strength (Advanced: 10% lower load-bearing)

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