All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier
Alibaba
Commercial Equipment & Machinery
Welding Equipment
Welding Wire Machines
  • High Speed Automatic TO56 Laser Packaging Gold Wire Bonder
  • High Speed Automatic TO56 Laser Packaging Gold Wire Bonder
  • High Speed Automatic TO56 Laser Packaging Gold Wire Bonder
  • High Speed Automatic TO56 Laser Packaging Gold Wire Bonder
  • High Speed Automatic TO56 Laser Packaging Gold Wire Bonder
  • High Speed Automatic TO56 Laser Packaging Gold Wire Bonder
High Speed Automatic TO56 Laser Packaging Gold Wire Bonder

High Speed Automatic TO56 Laser Packaging Gold Wire Bonder

  • >= 1 Sets
    $90,000

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
View product details

High Speed Automatic TO56 Laser Packaging Gold Wire Bonder

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Speed Automatic Bonding: Precision laser packaging for TO56 semiconductor components, enabling rapid and accurate gold wire bonding with millimeter-level accuracy.
  • Material Handling Expertise: Designed to process delicate materials like gold, ensuring durability and reliability in high-value manufacturing tasks.

Key features

  • 1. Material Technology

    • With a corrosion-resistant metal body and precision-engineered components, ensure durability and maintain accuracy even when handling delicate materials like gold.

  • 2. Interactive Design

    • With a touchscreen interface and multi-program presets, access customizable bonding settings for seamless operation across diverse tasks.

  • 3. Performance Parameters

    • With high-speed processing, achieve bonding cycles up to 20% faster than traditional models*, enabling efficient production in high-volume environments.

  • 4. Scenario Solutions

    • Designed for precision manufacturing scenarios, this bonder ensures quick and reliable gold wire bonding for semiconductor packaging or high-end electronics assembly.

  • 5. Certification Standards

    • Certified to meet precision manufacturing standards, ensuring reliability in high-stakes applications like aerospace or jewelry component testing.

Product details

High Speed Automatic TO56 Laser Packaging Gold Wire Bonder

The High Speed Automatic TO56 Laser Packaging Gold Wire Bonder is a precision-engineered machine designed for automated gold wire bonding in high-value manufacturing. Built with corrosion-resistant metallic components and advanced automation, it ensures millimeter-level accuracy and reliability for applications like semiconductor packaging, aerospace, and jewelry manufacturing.

Technical specifications

FeatureSpecificationApplication Scenario
Automation LevelFully automatic operationMass production of electronic components
Material CompatibilityGold wire (25µm–40µm diameter)Precision bonding in semiconductor devices
Precision±2µm accuracyMiniature circuit assembly
Control SystemTouch-screen programmable interfaceCustomizable process parameters
CertificationCE, ISO 9001Global industrial compliance

Customization guide

Adjustable parameters such as bonding force and wire feed speed allow customization to meet specific material requirements (e.g., thin gold wires for delicate electronics).

Get inspired

With millimeter-level precision and automated workflows, this bonder enables seamless integration into high-volume production lines. Its gold wire compatibility ensures durability in applications requiring corrosion resistance and conductivity.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Bonding Speed120 bonds/minute+15% (138 bonds/min)+30% (156 bonds/min)*
Precision Accuracy±3µm±2.5µm±2µm
Material CompatibilityStandard wiresGold & silverGold (25µm–40µm)

Supplier's note

  1. Technical Breakthroughs:

    • Automation: The touch-screen interface reduces manual intervention, improving efficiency by 20% compared to traditional models.
    • Precision: The Pro model’s ±2µm accuracy surpasses industry standards, enabling bonding in ultra-compact semiconductor packages.
    • Material Handling: Exclusive gold wire compatibility in the Pro version ensures reliability for high-value applications like aerospace and jewelry.

  2. Optimal Version Selection:

    • Base Model: Ideal for small-scale production requiring standard wire bonding (e.g., LED manufacturing).
    • Advanced Model: Suitable for medium-volume production needing silver/gold flexibility (e.g., automotive sensors).
    • Pro Model: Designed for high-value industries like semiconductor packaging, where gold’s conductivity and corrosion resistance are critical. With triple the precision of industry benchmarks, it ensures flawless bonding in nanoscale circuits.

*Comparative hint: The Pro Model’s speed is 20% faster than traditional gold wire bonders.

Frequently asked questions

  • Which High Speed Automatic TO56 Laser Packaging Gold Wire Bonder model is best for semiconductor manufacturing?

  • How do I maintain the gold wire bonder’s precision components?

  • Why choose gold wire over aluminum for packaging applications?

  • Can the TO56 bonder handle aerospace-grade materials?

  • What automation features make this bonder stand out?

  • Is the material used in the bonder’s build FDA-approved for medical devices?

  • How does the 1-year warranty cover the laser packaging system?

  • Can I customize the bonder for non-TO56 packaging formats?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Automation LevelHigh-volume semiconductor manufacturingIndustry Standard: Semi-automatic (operator setup required) (ISO 13849-1 PLa)
Our Base: Fully automatic (ISO 13849-1 PLc) ▲
Our Advanced: AI-assisted adjustments (ISO 13849-1 PLe) ▲▲		Reduces labor costs (Base/Advanced); enables real-time process optimization (Advanced)Higher initial investment (Advanced); requires training for AI features (Advanced)
PrecisionMicroelectronics assemblyIndustry Standard: ±0.01mm (ISO 10360)
Our Base: ±0.005mm (ISO 10360) ▲
Our Advanced: ±0.002mm (ISO 10360) ▲▲		Achieves micron-level accuracy for delicate components (Advanced); minimizes defectsHigher cost for precision sensors (Advanced)
Material CompatibilityGold wire bonding in aerospace/defenseIndustry Standard: Metals only (ASTM A370)
Our Base: Metals + Plastics (ASTM D638) ▲
Our Advanced: Metals, Plastics, Gold (ASTM F1949) ▲▲		Handles high-value materials like gold (Advanced); versatile for diverse applicationsRequires specialized calibration for exotic materials (Advanced)
Speed/Cycle TimeMass production linesIndustry Standard: 500 cycles/hour
Our Base: 800 cycles/hour (▲)
Our Advanced: 1,200 cycles/hour (▲▲)		Boosts throughput by 60% (Base) and 140% (Advanced) compared to industry normsHigher energy consumption (Advanced)
Durability (MTBF)24/7 industrial environmentsIndustry Standard: 10,000 hours (IEC 61326)
Our Base: 20,000 hours (▲)
Our Advanced: 30,000 hours (▲▲)		Reduces downtime by 50% (Base) and 66% (Advanced)Premium materials increase upfront cost (Advanced)
Warranty & SupportLong-term operational reliabilityIndustry Standard: 1 year
Our Base: 1 year (matches industry)
Our Advanced: 2 years (▲)		Extended warranty coverage (Advanced); lifetime technical support for critical industriesStandard warranty may require third-party repairs

Related searches

high quality dress a line dressesdoor to door logistics service discountedlog skidding plate log skidding archedfast charge new reciprocating low noisebaby lotion baby skin lightening lotion4K portable projector2024 summer kids beach slides shoesjump start amaron battery extern batterieportable digital breathalyzer5 axis cnc router for woodspider plush toy plush toy stuffeddescaler for coffee makers agriculture solutionsmarble stone metal acrylic cup bottlewholesale price rose hello kitty foamwomen pleated clothes

The Product Description is generated by third-party, and Alibaba.com is not liable for any risks related to inaccuracies or the infringement of third-party rights.

The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.