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  • Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables
  • Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables
  • Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables
  • Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables
  • Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables
  • Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables
Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables

Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables

  • 1 - 9 Sets
    $70
  • >= 10 Sets
    $50
View product details

Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Reballing & Reflow Soldering: The BGA Rework Station Kit enables accurate reballing of circuit boards using adjustable soldering stations and universal reballing stencils, supporting delicate component repairs and assembly.
  • Multi-Component Compatibility: Equipped with Sn63Pb37 leaded solder balls and solder paste, the kit handles diverse electronic components and board sizes, ensuring reliable solder joints for both small-scale repairs and large-scale manufacturing.

Key features

  • 1. Material Technology

    • With Sn63Pb37 leaded solder balls, ensure strong and reliable connections in BGA rework processes. The metal reballing stencils provide precise alignment for solder ball placement, outperforming plastic alternatives prone to warping*.

  • 2. Interactive Design

    • With the adjustable soldering station’s temperature and pressure controls, customize settings for delicate components, offering superior precision compared to fixed-temperature models*.

  • 3. Performance Parameters

    • With multi-sized reballing stencils included, accommodate diverse component sizes and pitches, expanding compatibility beyond single-stencil kits*.

  • 4. Scenario Solutions

    • With universal reballing stencils and planting tables, streamline BGA rework for both home repairs and commercial-scale operations, reducing downtime in electronics maintenance*.

  • 5. Certification Standards

    • With Sn63Pb37 alloy compliant with industry standards for leaded solder applications, ensure reliable performance and safety in critical electronics assembly tasks*.

Product details

Hot Sale Reballing Machine BGA Rework Station Kit Universal Reballing Stencil + Leaded Solder Ballsl + Planting Tables

The Hot Sale Reballing Machine BGA Rework Station Kit is a comprehensive solution for precision reballing and BGA rework. This kit includes a versatile soldering station, customizable reballing stencils, Sn63Pb37 leaded solder balls, high-quality solder paste, and heat-resistant tape. Designed for electronics repair and assembly professionals, it ensures accuracy, repeatability, and adaptability for diverse applications.

Technical specifications

FeatureSpecificationApplication Scenario
Soldering StationAdjustable temperature (200°C–450°C)Precise reflow soldering of delicate BGA components
Reballing StencilsMetal alloy, 0.1mm–0.5mm aperture sizesCustomized ball placement for varied chip sizes
Solder BallsSn63Pb37, 0.3mm–0.8mm diametersHigh-temperature stability in reballing processes
Solder PasteRoHS compliant, 63Sn/37Pb alloyReflow soldering of surface-mount components
Heat-Resistant Tape耐温 up to 350°C, non-conductiveProtecting sensitive areas during high-heat rework

Customization guide

Adjustable temperature and pressure settings on the soldering station allow customization for specific component tolerances. Reballing stencils can be paired with solder balls of varying diameters to meet precise placement needs for different BGA packages.

Get inspired

With the universal reballing stencil and Sn63Pb37 solder balls, you can efficiently restore damaged BGA chips or upgrade components in electronics repair. The heat-resistant tape ensures safe handling of delicate circuits during high-temperature rework.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Temperature Range200°C–400°C200°C–450°C200°C–500°C*
Precision Control±5°C±3°C±1°C
Automation FeaturesManual operationSemi-automaticFully automated
Stencils Included5 standard sizes10 customizable sizes20+ pre-loaded designs

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s ±1°C precision control ensures minimal thermal shock for high-density BGA assemblies.
    • Sn63Pb37 solder balls provide 20% better wetting compared to standard alloys, reducing voids in joints.
    • The Advanced Model’s semi-automatic stencil alignment reduces setup time by 30% versus manual systems.

  2. Version Selection Guide:

    • Base Model: Ideal for small-scale repair shops handling routine BGA rework (e.g., smartphone repairs).
    • Advanced Model: Suited for mid-volume production or labs requiring precision (e.g., IoT device assembly).
    • Pro Model: Best for high-volume manufacturing or R&D facilities needing automation and extreme accuracy (e.g., semiconductor testing).

With the Pro Model’s 500°C max temperature, you can handle advanced lead-free solders, enabling compliance with RoHS 3 standards.

Frequently asked questions

  • Which reballing machine model suits small electronics workshops?

  • How to clean the soldering station after reflow soldering tasks?

  • Sn63Pb37 vs SAC305 solder balls: Which is better for BGA rework?

  • Can I customize stencil sizes for unique component needs?

  • Is the solder paste in the kit RoHS-compliant?

  • Does the welding manipulator improve reballing efficiency?

  • Can I use third-party solder paste with this BGA rework station?

  • How does the reballing stencil ensure precise solder ball placement?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
BGA Rework Station KitBGA chip reballing, PCB repairAdjustable temp range (200°C–450°C ▲12.5% vs industry standard 200–400°C)
(ISO 9001 certified)
Precise temperature control for delicate components
Universal compatibility with stencils		Higher upfront cost compared to basic stations
Reballing StencilsPrecision solder ball placementMetal alloy construction (±0.01mm tolerance ▲50% vs industry ±0.02mm)
(ASTM E2855 compliant)		Ensures accurate ball alignment for fine-pitch componentsLimited to pre-designed stencil sizes; requires storage space
Solder Balls (Sn63Pb37)Reballing, high-reliability joints0.3mm diameter ▲25% smaller than industry standard 0.4mm
(J-STD-006 compliant)		Superior conductivity and joint integrity for dense boardsHigher cost than lead-free alternatives
Solder PasteReflow soldering, mass productionRosin flux core (viscosity 50–70 Poise ▲30% lower than industry 75 Poise)
(IPC-J-STD-005 certified)		Smooth printing for fine features; reduced bridgingShort shelf life (6 months) requires frequent replacement
Heat Resistant TapeComponent protection during soldering300°C continuous use ▲20% higher than industry standard 250°C
(UL 746C rated)		Safely insulates sensitive components during high-heat processesConsumable; frequent replacement needed for heavy use
Reflow OvenMass soldering, batch processingInfrared heating (±5°C uniformity ▲50% better than industry ±10°C)
(ASTM E2637 compliant)		Rapid, consistent heating for large-scale productionLarge footprint; energy-intensive operation

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.