(IC COMPONENTS) BGY

Name: (IC COMPONENTS) BGY
Brand: Shenzhen Winsome Electronic Technology Co., Ltd
SKU: 1601415606399_1
Price: 0.56 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

Semiconductor Packaging Solutions: The BGY IC components provide a range of semiconductor packages (e.g., SOT-23, SOT523, TO-220) designed to encase transistors, diodes, and integrated circuits. These packages ensure reliable electrical performance while protecting sensitive components.
Power Adaptability: Supports applications from low-power (e.g., SOT-23/SOT323) to high-power (e.g., TO263/TO268, ZIP) requirements, enabling versatility across electronic systems.

Key features

1. Corrosion-Resistant Material Technology

With a hermetic ZIP package constructed from corrosion-resistant materials, ensure reliable performance in harsh industrial environments. This design outperforms non-hermetic alternatives by maintaining integrity under extreme temperatures and humidity*.

2. Modular Lead Configuration Design

The SOT-23/SOT523/SOT89 package series features adaptive lead configurations, enabling seamless integration into low- to high-power circuits. This flexibility surpasses single-configuration packages for multi-application setups*.

3. High-Power Handling Performance

Equipped with TO-263/TO-268 packages, deliver 30% higher current capacity than SOT-23 variants, ensuring stable operation in high-load industrial systems*.

4. Scenario-Adaptive Application Solutions

Optimized for both residential and commercial use: SOT-23 packages support low-power home electronics, while FTO-220/ITO-220 variants enable continuous operation in commercial-grade equipment.

5. Eco-Friendly Certification Compliance

Manufactured with RoHS-compliant materials and REACH-certified soldering alloys, meeting global environmental and safety standards for sustainable electronics manufacturing.

Product details

The BGY transistor series offers versatile semiconductor packages tailored for diverse electronic applications, from compact low-power designs to robust high-power systems. Each package type—such as SOT-23, SOT523, and ZIP—is engineered to balance performance, thermal efficiency, and space constraints.

Technical specifications

Feature	Specification	Application Scenario
SOT-23	2.9x1.3mm, plastic, 3 leads	Low-power circuits (e.g., signal amplifiers)
SOT523	1.8x1.25mm, RoHS-compliant, 3 leads	Miniature IoT sensors and wearables
SOT89	4.9x3.9mm, 4 leads, 1.5W max power	Mid-power audio amplifiers
TO263/TO268	12x6mm, metal-clad, 3 leads, 50W max	High-power motor drivers
ZIP	Hermetic, 8x5mm, 8 leads, -55°C to +150°C	Industrial control systems requiring extreme reliability

Customization guide

Adjustable parameters:

Package size (e.g., SOT-23 to TO263) to match power requirements.
Material (plastic vs. hermetic) for thermal/chemical resistance.
Lead configuration (3–8 leads) to optimize PCB layout.

Get inspired

Choose the right package to unlock performance gains:

SOT523 enables ultra-compact designs for wearable devices.
ZIP ensures longevity in harsh industrial environments.
TO263 handles high currents for automotive or industrial systems.

Choose your model

Parameter	Base Model (SOT-23)	Advanced Model (SOT89)	Pro Model (ZIP)
Max Power Handling	0.5W	1.5W	50W*
Thermal Resistance	150°C/W	80°C/W	25°C/W
Operating Temp Range	-40°C to +150°C	-55°C to +175°C	-65°C to +200°C

Supplier's note

Technical Breakthroughs:
- The ZIP Pro Model achieves 25°C/W thermal resistance, 50% better than industry benchmarks, enabling stable operation in extreme environments.
- SOT89 uses a dual-layer thermal pad, reducing heat buildup by 30% compared to legacy SOT packages.
- All models comply with RoHS and AEC-Q101, ensuring automotive-grade reliability.
Optimal Version Selection:
- Base Model (SOT-23): Ideal for low-power consumer electronics (e.g., remote controls).
- Advanced Model (SOT89): Suitable for mid-range applications like audio systems or HVAC controllers.
- Pro Model (ZIP): Mandatory for high-reliability scenarios (e.g., aerospace, oil drilling equipment).

With the ZIP Pro’s 50W capacity, you can power industrial actuators without thermal throttling. The SOT523’s miniaturized design lets you integrate transistors into smartwatch PCBs. Pair the SOT89’s thermal pad with aluminum heatsinks to double its effective power handling.

Frequently asked questions

Which semiconductor package is best for low-power applications in compact devices?
What BGY transistor package is suitable for high-power applications?
How do SOT-23 and SOT523 packages differ in the BGY product line?
Which BGY package is ideal for high-temperature environments?
What package in the BGY series offers four leads for enhanced power handling?
Is the BGY transistor package RoHS compliant?
Can the BGY semiconductor components be customized for specific lead configurations?
What BGY package is recommended for integrated circuits requiring multiple leads?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
SOT-23	Low-power consumer electronics, wearables	Max Power: 0.5W (▲)	Compact (3×3 mm), cost-effective (▲▲)	Limited power handling (▲▲▲), unsuitable for high-temperature applications
SOT523	IoT sensors, portable devices	Current Rating: 0.3A (▲)	Similar to SOT-23 but 20% smaller footprint (▲▲)	Lower thermal dissipation (▲▲▲) compared to SOT89
SOT89	Industrial controls, automotive systems	Power Handling: 2W (▲▲)	Handles 2A current (▲▲▲), 4 leads for better heat dissipation	Larger size (▲▲) than SOT-23/SOT523
TO263/TO268	Power supplies, motor drivers	Voltage Rating: 200V (▲▲▲)	Can handle 10A current (▲▲▲▲), robust for high-power (▲▲▲)	Bulky (▲▲▲), higher cost (▲▲▲)
ZIP	Aerospace, medical equipment	Hermetic Seal (▲▲▲▲)	Withstands 150°C (▲▲▲), 20W power (▲▲▲▲)	Expensive (▲▲▲▲), complex assembly (▲▲▲)
TO-220	Amplifiers, power regulators	Thermal Resistance: 2°C/W (▲▲▲)	Industry standard for 15W applications (▲▲▲), easy heatsinking	Bulky (▲▲▲), limited in miniaturized designs (▲▲▲)