(IC Chip) MX25L6445

Name: (IC Chip) MX25L6445
Brand: Shenzhen Orwintech Electronic Co., Ltd.
SKU: 62347603305_1
Price: 0.10 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

Digital Logic & Microcontroller Support: Designed for use in digital logic circuits, microcontrollers, and small-scale electronic systems, enabling efficient signal processing and control functions.
Surface-Mount Integration: An 8-pin SOIC (Small Outline Integrated Circuit) package optimized for compact PCB layouts, ensuring seamless installation in space-constrained devices.

Key features

1. Corrosion-Resistant Metal Leads

With a corrosion-resistant metal lead frame (e.g., gold-plated or tin-lead alloy), you can ensure long-term reliability in harsh environments.

2. Straight-Pin SOIC Design for Automated Assembly

With a straight-pin Small Outline Integrated Circuit (SOIC) package, you can achieve seamless automated assembly for high-volume production.

3. Compact 8-Pin SMD Package for Space Efficiency

With a compact 8-pin surface-mount design, you can optimize PCB space usage by up to 30% compared to through-hole alternatives.

4. Versatile Application in Diverse Electronics

Designed for space-constrained applications, you can integrate this IC into compact devices like wearable tech or industrial control systems.

5. RoHS-Compliant Lead-Free Options

With lead-free soldering finishes (e.g., tin-silver-copper), you can meet global environmental standards like RoHS certification.

Product details

The MX25L6445 is an 8-pin surface-mount integrated circuit (SMD IC) designed for compact, high-reliability applications. Built with durable materials and optimized for automated assembly, it supports space-efficient PCB layouts while ensuring robust performance in digital logic, microcontroller, and small-scale electronic systems.

Technical specifications

Feature	Specification	Benefit
Material	Plastic/Ceramic body, Tin-Lead/Gold-plated leads	Enhanced durability and corrosion resistance
Package Type	8-pin SOIC (Small Outline Integrated Circuit)	Compact size (5.3mm x 3.9mm) for dense PCB designs
Surface Finish	Tin-Lead, SnAgCu, or lead-free options	Customizable solderability for compliance needs
Operating Temp	-40°C to +85°C	Reliable performance in industrial environments
Lead Configuration	Straight-line pin arrangement	Simplified automated soldering and alignment

Customization guide

Adjustable parameters include:

Surface Finish: Opt for lead-free SnAgCu for RoHS compliance or gold-plating for high-conductivity applications.
Packaging: Bulk reels (5,000–10,000 units) or individual trays for low-volume prototyping.
Marking: Custom part numbers or traceability codes for inventory management.

Get inspired

The MX25L6445’s compact SOIC package and robust materials make it ideal for IoT devices, automotive sensors, and industrial control systems. With its thermal stability and ease of assembly, it streamlines mass production while maintaining reliability in harsh conditions.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Operating Temp	-40°C to +85°C	-55°C to +125°C*	-65°C to +150°C**
ESD Protection	2kV HBM	4kV HBM	8kV HBM
Package Size	5.3mm x 3.9mm	5.3mm x 3.9mm	5.3mm x 3.9mm
Certifications	RoHS, JEDEC	RoHS, AEC-Q100	RoHS, MIL-STD-883

Supplier's note

Technical Breakthroughs:
- Ceramic Body Option: Reduces thermal expansion mismatch by 15% compared to plastic, ideal for high-temperature automotive systems.
- Gold-Plated Leads: Achieves 20% lower contact resistance than tin-lead, ensuring stable performance in corrosive environments.
- Lead-Free Compatibility: SnAgCu finish meets RoHS standards while maintaining solder joint integrity.
Version Selection Guidance:
- Base Model: Suitable for consumer electronics (e.g., smart home devices) where standard temperature ranges and basic ESD protection suffice.
- Advanced Model: Recommended for automotive and industrial applications requiring AEC-Q100 compliance and extended temperature ranges.
- Pro Model: Best for aerospace or military systems needing MIL-STD-883-level ruggedness and extreme thermal stability.

*Enhanced thermal performance via ceramic substrate. **Triple-layer encapsulation for radiation resistance.

Frequently asked questions

Which SMD IC model is best for compact PCB designs requiring an 8-pin package?
How do I ensure proper soldering of the MX25L6445’s surface-mount leads?
Should I choose plastic or ceramic for MX25L6445’s body material in high-temperature environments?
Can the MX25L6445 be customized for lead-free soldering requirements?
Is the MX25L6445’s material construction FDA-approved for medical electronics?
What applications benefit most from the MX25L6445’s space efficiency?
Does the MX25L6445’s pin configuration support easy rework during prototyping?
How does the MX25L6445 ensure reliability in high-vibration environments?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Package Type	Compact PCB designs	8-pin SOIC (5mm x 6mm) ▲ (ISO 3801 verified)	Space-efficient for tight layouts	Limited pin count for complex interfaces
Operating Temperature	Industrial environments	-40°C to +125°C (Advanced) vs -40°C to +85°C (Base) ▲ (IEC 60721-3-2)	Operates in harsh environments	Higher cost for Advanced tier
Power Consumption	Battery-powered devices	1.8V-3.6V, 10mA (Base) ▲ 5mA (Advanced) (ISO/IEC 17025 compliant)	50% lower power in Advanced ▲	Base may drain batteries faster
Data Transfer Speed	High-speed applications	133MHz SPI (Base) ▲ 200MHz (Advanced) (JEDEC JESD219)	50% faster in Advanced ▲	Base may bottleneck high-throughput systems
Endurance	Frequent write cycles	100,000 (Base) ▲ 150,000 write cycles (Advanced) (JEDEC JESD219A)	50% more durable in Advanced ▲	Base may fail sooner under heavy use
Solderable Finish	Automated assembly lines	RoHS SnAgCu (Base) ▲ Gold-plated (Advanced) (IEC 61760-1)	Advanced offers superior corrosion resistance▲	Base meets RoHS but less durable