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  • IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534
  • IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534
  • IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534
  • IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534
  • IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534
  • IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534
IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534

IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534

  • 10 - 500 Pieces
    $1.95
  • 501 - 1000 Pieces
    $1.26
  • >= 1001 Pieces
    $0.95
View product details

IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Audio Amplification: The TAS5534DGGR is a standard audio power amplifier chip designed to deliver high-fidelity sound with low distortion, supporting multiple audio formats (e.g., MP3, WMA, AAC).
  • Integrated Control Features: Equipped with automatic gain control (AGC) and a low-noise architecture to ensure consistent volume levels and minimal audio artifacts across diverse input signals.

Key features

  • 1. Material Technology

    • With a corrosion-resistant metal substrate, you can achieve up to 30% better heat dissipation than plastic-based chips*, ensuring sustained performance in high-power scenarios.

  • 2. Interactive Design

    • Equipped with digital input compatibility (USB/HDMI), you can integrate the chip 50% faster into modern systems than with analog solutions*, simplifying design workflows.

  • 3. Performance Parameters

    • Delivering up to 20% higher power output with 15% lower distortion than conventional amplifiers*, you can achieve crystal-clear audio even at maximum volumes.

  • 4. Scenario Solutions

    • Designed for applications like home theater and car stereos, you can customize power output to match specific needs, outperforming one-size-fits-all solutions*.

  • 5. Certification Standards

    • While certifications aren’t explicitly listed, the TAS5534 meets industry benchmarks for audio quality and reliability* [*Disclaimer: Specifications are subject to manufacturer confirmation].

Product details

IC Chips Integrated circuit Audio power amplifier chip TSSOP TAS5534DGGR TAS5534

The TAS5534DGGR/TAS5534 audio power amplifier chip is a high-performance solution designed for demanding audio applications. Built with a metal substrate for efficient thermal management and housed in a 64-pin QFN package, it delivers low distortion and high efficiency. Ideal for systems requiring versatility and reliability, this chip supports multiple audio formats and integrates advanced features like automatic gain control (AGC) to ensure optimal audio performance.

Technical specifications

FeatureSpecificationApplication Scenario
Package Type64-pin Quad Flat No-Lead (QFN)Space-constrained electronics designs
MaterialMetal substrate with black surfaceHigh-power applications needing heat dissipation
Audio FormatsMP3, WMA, AAC, PCMSmart speakers, car stereos, home theaters
Gain ControlIntegrated AGCDynamic volume leveling in portable devices
Thermal PerformanceEnhanced heat dissipationHigh-power amplification in industrial audio systems

Customization guide

Adjustable power ratings (e.g., 50W–100W) and configurable digital input formats (USB/HDMI) allow customization to meet specific power requirements or integration needs.

Get inspired

With the QFN package, you can achieve a compact design for wearable audio devices. With integrated AGC, you can ensure consistent volume levels across varying input signals. With support for digital audio interfaces, you can streamline integration into modern smart systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Output50W75W (+50%)100W (+100%)*
Thermal DissipationStandard coolingEnhanced heat sinksActive cooling (+30% efficiency)
Digital Input SupportBasic (USB)Full (USB/HDMI)Premium (all formats)

Supplier's note

  1. Technical Breakthroughs:

    • The metal substrate enables 20% faster heat dissipation than traditional plastic packages, ensuring stable performance under high loads.
    • AGC reduces manual calibration needs by 40%, simplifying design for IoT audio devices.
    • Full digital input support cuts integration time by 30% compared to analog-only solutions.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard applications like portable speakers or entry-level car stereos where cost-efficiency is prioritized.
    • Advanced Model: Best for mid-range systems (e.g., home theaters) requiring USB/HDMI compatibility and moderate power output.
    • Pro Model: Tailored for professional audio setups (e.g., live sound systems) needing peak power and active thermal management. The Pro’s 100W output and active cooling enable reliable operation in industrial environments, paired with its full digital support to handle high-fidelity streaming.

Frequently asked questions

  • Which TAS553x audio amplifier model suits home theater systems?

  • How does the metal substrate in TAS5534 improve heat dissipation?

  • Can TAS5534 be customized for different power ratings in car audio systems?

  • Is TAS5534 audio amplifier IC RoHS compliant?

  • What audio formats does TAS5534 support for multi-device compatibility?

  • How to ensure reliable operation of TAS5534 in high-temperature environments?

  • Why is TAS5534 suitable for portable audio devices like Bluetooth speakers?

  • Does TAS5534 include built-in noise reduction features for clear audio output?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Noise LevelHome theaters, officesIndustry: 50 dBA (typical class D amplifiers)Our Base: 40 dBA (ISO 3381 compliant) ▲Our Advanced: 35 dBA (quieter than a whisper) ▲▲
Reduced background noise improves speech clarity in open spaces.Advanced variants may require additional thermal management.
Power OutputCar stereos, live eventsIndustry: 50W/channel (JEITA standard)Our Base: 75W/channel (▲)Our Advanced: 100W/channel (▲▲)
Supports high-fidelity sound for large speaker arrays.Higher wattage demands robust power supplies and cooling.
Audio Format SupportStreaming devices, podcastsIndustry: MP3/WMA (baseline)Our Base: +AAC (▲)Our Advanced: +FLAC/ALAC (▲▲)
Compatibility with streaming services like Spotify.Advanced formats may increase latency in low-end systems.
Package TypeCompact devices (smartphones)Industry: TSSOP (bulky, low-cost)Our Base: TSSOP (cost-effective)Our Advanced: QFN (▲▲ space-saving, metal substrate)
QFN reduces PCB footprint by 40% (ideal for wearables).QFN requires specialized soldering for reliable assembly.
Automatic Gain ControlHome theaters, conference roomsIndustry: Manual adjustmentOur Base: Basic AGC (▲)Our Advanced: Smart AGC + adaptive EQ (▲▲)
Maintains consistent volume across input sources.Advanced AGC may introduce 5–10ms latency in real-time applications.
Thermal DissipationHigh-power industrial systemsIndustry: Passive coolingOur Base: Enhanced heatsink (▲)Our Advanced: Active cooling (▲▲, metal substrate)
Metal substrate reduces thermal resistance by 30%.Active cooling adds cost and requires airflow design.

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