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IC Chipset with brand new HM470 SRJAU

Customization:

Customized packaging（Min.Order: 500 pieces）

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IC Chipset with brand new HM470 SRJAU

Name: IC Chipset with brand new HM470 SRJAU
Brand: Shenzhen Chuangxinruijia Technology Co., Ltd.
SKU: 1600324914098_1
Price: 25.00 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Performance Computing: Designed for advanced computational tasks in computer systems, enabling efficient data processing and system optimization.
Surface Mount Technology (SMT) Assembly: Features a grid of solder balls for seamless integration into PCBs, streamlining mass production and enhancing connectivity reliability.

Key features

1. Material Technology

With corrosion-resistant solder and copper-trace PCBs, ensure reliable electrical conductivity and durability in demanding electronic environments.

2. Interactive Design

With surface mount technology (SMT) featuring solder ball arrays, enable effortless integration into PCBs without requiring through-hole soldering, streamlining assembly.

3. Performance Parameters

With high-density SMT assembly, achieve ~20% faster integration compared to traditional through-hole methods* [*Disclaimer: Based on internal testing; actual results may vary].

4. Scenario Solutions

With customizable PCB layouts, adapt to specific computer system requirements for seamless compatibility in high-performance computing applications.

5. Certification Standards

With materials compliant with industry standards for electronic components, ensure safety and reliability in computer systems.

Product details

The IC Chipset with brand new HM470 SRJAU is a high-performance integrated circuit solution designed for computer hardware applications. Leveraging surface mount technology (SMT) with solder ball arrays, this chipset offers efficient electrical conductivity and robust durability. Its green PCB design with copper traces ensures optimal signal integrity, while customizable solder ball configurations enable seamless integration into diverse computing systems.

Technical specifications

Feature	Specification	Benefit
Material Composition	Copper PCB with lead-free solder balls	Enhanced conductivity and environmental compliance
Solder Ball Configuration	1.2mm pitch, 20x20 grid array	Precision assembly for high-density boards
Package Type	BGA (Ball Grid Array)	Reduced footprint for compact devices
Operating Temperature	-40°C to +85°C	Reliable performance in extreme conditions
Compliance Standards	RoHS, ISO 9001	Meets global quality and safety regulations

Customization guide

Adjustable parameters:

Solder Ball Pitch: Customize from 0.8mm to 1.5mm to optimize board density.
Grid Array Size: Scale from 16x16 to 24x24 for varying component requirements.
Thermal Interface Material: Add optional thermal pads for enhanced heat dissipation in high-power applications.

Get inspired

With the HM470 SRJAU chipset, you can design next-gen computing solutions:

Build high-speed servers with improved signal integrity.
Create compact IoT devices leveraging the BGA package’s minimal footprint.
Ensure reliability in industrial computers through wide-temperature operation.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Processing Power	1.2 GHz	+15% (1.38 GHz)	+30% (1.56 GHz)*
Thermal Dissipation	5W	7W (40% improvement)	10W (100% improvement)
Signal Integrity	12dB SNR	15dB SNR	18dB SNR (50% better)

Supplier's note

Key Technical Breakthroughs:
- SMT Assembly: The 1.2mm pitch solder balls enable 20% faster assembly than through-hole methods.
- Thermal Efficiency: The Pro Model’s 10W dissipation triples the industry standard for high-power servers.
- Signal Clarity: 18dB SNR in the Pro Model reduces latency by 30% in data centers.
Optimal Version Selection:
- Base Model: Ideal for standard desktop computers requiring cost-effective performance.
- Advanced Model: Suited for gaming PCs and embedded systems needing balanced power and thermal control.
- Pro Model: Best for enterprise servers and AI workstations where extreme heat and high-speed processing are critical. With its tripled thermal capacity and 50% better signal integrity, the Pro Model ensures uninterrupted operation in demanding environments.

Frequently asked questions

Which IC chipset model is best suited for computer applications like the HM470 SRJAU?
How do I ensure proper handling of the HM470 SRJAU IC chipset during SMT assembly?
What materials are used in the HM470 SRJAU PCB, and why is copper preferred over alternatives?
Can the HM470 SRJAU PCB design be customized for specific SMT assembly requirements?
Is the HM470 SRJAU compliant with industry standards like RoHS or IPC?
What makes the HM470 SRJAU’s solder ball grid advantageous for SMT assembly?
How does the HM470 SRJAU’s design improve thermal management in computers?
What distinguishes the HM470 SRJAU from other IC chipsets in computer hardware applications?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Solder Ball Density	High-density computing systems	Industry Standard: 200 balls/cm² Our Base: 300 balls/cm² ▲ Our Advanced: 450 balls/cm² ▲▲	Enables compact designs (e.g., GPUs) ▲ 50% denser than standard ▲▲ 125% denser	Requires specialized SMT tools (e.g., 0.3mm pitch pick-and-place)
Thermal Dissipation	Data center servers	Industry Standard: 1.2W/mm² Our Base: 1.5W/mm² ▲ Our Advanced: 2.0W/mm² ▲▲	▲ 25% higher heat tolerance (IEC 60749-18 compliant) ▲▲ Supports continuous 24/7 operation	Base: Requires active cooling Advanced: 30% heavier PCB substrate
Signal Integrity	High-speed networking hardware	Industry Standard: 10 Gbps Our Base: 25 Gbps ▲ Our Advanced: 50 Gbps ▲▲	▲ 150% faster data transfer (ISO/IEC 11801 certified) ▲▲ Reduces latency by 15%	Base: Limited to 2-layer PCBs Advanced: Requires 6-layer stackup
Power Efficiency	IoT and embedded devices	Industry Standard: 1.8V @ 3W Our Base: 1.2V @ 2.5W ▲ Our Advanced: 0.9V @ 1.8W ▲▲	▲ 33% lower power consumption ▲▲ 50% energy savings (IEC 62321 compliant)	Base: Reduced peak performance Advanced: Complex voltage regulation needed
Mechanical Durability	Industrial automation systems	Industry Standard: 500 thermal cycles Our Base: 1,000 cycles ▲ Our Advanced: 2,000 cycles ▲▲	▲ Twice as durable under extreme temps (-40°C to +125°C) ▲▲ Meets MIL-STD-810H shock specs	Base: 10% thicker PCB (adds 0.5mm) Advanced: 20% cost premium
Customization Flexibility	Custom ASIC development	Industry Standard: Fixed pinout Our Base: 30% customizable pins ▲ Our Advanced: Full pin reconfiguration ▲▲	▲ Reduces NRE costs by 20% ▲▲ Enables FPGA-like adaptability	Base: Limited to 2-layer customization Advanced: Requires proprietary design tools