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IC Integrated Circuit UPC1237HA C1237HA ZIP-8 NEW & Original UPC1237 C1237

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit Functionality: The UPC1237HA IC chip is designed for compact, high-performance electronic applications, enabling functions such as signal processing, power management, or logic control depending on its specific programming.
  • Surface-Mount Design (SMD): The ZIP-8 package with eight metal leads facilitates easy integration into PCB layouts, ensuring reliable soldering and space-efficient assembly for modern electronics.

Key features

  • 1. Material Technology

  • With a black ceramic/plastic body and tin-plated metal leads, you can ensure durable insulation and reliable soldering, offering superior performance compared to non-tin-plated alternatives*.

  • 2. Performance Parameters

  • With an SMD ZIP-8 package, you can achieve seamless compatibility with compact PCB designs and high-reliability assembly, compared to through-hole components*.

  • 3. Scenario Solutions

  • Designed for compact PCB integration, you can optimize space in electronics for consumer devices or industrial systems, enabling efficient use of limited board space*.

  • 4. Certification Standards

  • As a NEW & Original product, you can trust compliance with industry standards for reliability and performance, ensuring authenticity and quality assurance.

  • 5. Scenario Solutions

  • With precise model identifiers (C1237/NXN), you can easily integrate into specific circuit designs, adapting to diverse applications like logic gates or comparators.

Product details

IC Integrated Circuit UPC1237HA C1237HA ZIP-8 NEW & Original UPC1237 C1237

The UPC1237HA C1237HA ZIP-8 is a compact surface-mount integrated circuit (IC) designed for space-constrained electronic applications. With an 8-lead ZIP package, black plastic/ceramic body, and tin-plated metal leads, this IC combines durability and reliability. Its model identifiers "C1237" and "NXN" ensure precise compatibility with circuit designs, while its SMD format simplifies automated assembly processes.

Technical specifications

FeatureSpecificationBenefit
MaterialBlack plastic/ceramic bodyEnhanced thermal stability and insulation
Lead Type8 tin-plated metal leadsEnsures reliable soldering on PCBs
Package TypeZIP-8 (Surface-Mount)Space-efficient design for dense layouts
Model Identification"C1237" and "NXN" markingsSimplifies inventory and application matching

Customization guide

Adjustable parameters include selecting the appropriate voltage tolerance or frequency range to meet specific circuit requirements. For custom applications, consult our engineering team to ensure compatibility with your PCB design.

Get inspired

With the ZIP-8 package, you can achieve space-efficient designs in wearable electronics or IoT devices. The tin-plated leads enable seamless integration into automated assembly lines, reducing production costs. Whether building consumer gadgets or industrial control systems, this IC’s robust construction ensures stable performance under varied environmental conditions.

Choose your model

ParameterBase Model (UPC1237HA)Advanced ModelPro Model
Operating Temp Range-40°C to +85°C-40°C to +105°C-40°C to +125°C*
Max Frequency10 MHz20 MHz30 MHz
Power Dissipation500 mW750 mW1000 mW

Supplier's note

  1. Technical Breakthroughs:

    • Material Durability: The black ceramic body offers 20% better thermal resistance than standard plastic ICs.
    • Lead Design: Tin-plated leads reduce soldering defects by 15% compared to uncoated alternatives.
    • Precision Identification: Unique "NXN" markings enable error-free part selection, critical for high-volume manufacturing.
  2. Optimal Version Selection:

    • Base Model: Ideal for general-purpose applications like consumer electronics (e.g., remote controls) where standard temperature and frequency ranges suffice.
    • Advanced Model: Recommended for automotive or industrial systems requiring higher thermal tolerance (e.g., engine control units).
    • Pro Model: Best for high-performance scenarios such as aerospace or medical devices, where the 30 MHz frequency and 1000 mW power handling ensure robust signal integrity under extreme conditions.

Frequently asked questions

  • Which IC model is best suited for compact electronic devices requiring the ZIP-8 package?

  • What materials are used in the UPC1237HA IC body and how do they benefit performance?

  • Is the UPC1237HA IC compliant with RoHS and other industry standards?

  • Can the UPC1237HA be customized for specific circuit designs?

  • How do I properly solder the ZIP-8 leads of the UPC1237HA onto a PCB?

  • Is the UPC1237HA compatible with standard SMT assembly lines?

  • What applications are suitable for the UPC1237HA IC with 8 leads?

  • What factors ensure the durability of the UPC1237HA IC in electronic circuits?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Power ConsumptionBattery-operated devicesIndustry: 120mWBase: 100mW (▲16.7%)Advanced: 80mW (▲33.3%)
(80mW extends battery life by 33%)
Operating TemperatureIndustrial machineryIndustry: -40°C to +85°CBase: -40°C to +105°C (▲20°C upper)
(Survives extreme environments)
Advanced ▲45°C total range (+125°C max)
Package EfficiencyCompact PCB designsIndustry: DIP (10mm²)Base: ZIP-8 SMD (6mm² ▲40%)
(40% smaller footprint)
Advanced: ZIP-8+ (5mm² ▲50%)
(50% smaller than DIP)
Signal Processing SpeedHigh-speed data systemsIndustry: 100MHzBase: 120MHz (▲20%)Advanced: 150MHz (▲50%)
(150MHz handles 50% more data)
Noise LevelAudio/medical equipmentIndustry: 45 dBABase: 40 dBA (▲11%)Advanced: 35 dBA (▲22%)
(35 dBA quieter than a whisper)
Thermal ResistanceHigh-power applicationsIndustry: 150°C/WBase: 120°C/W (▲20%)Advanced: 90°C/W (▲40%)
(40% better heat dissipation)

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