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ICE3A1565 DIP8 new OriginalBOM Inventory Supporting Service ICE3A1565 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit (IC) Functionality: The ICE3A1565 is an 8-lead surface-mount integrated circuit (SMD) designed for compact and reliable electronic applications, enabling efficient connectivity and functionality in various circuits.
  • Standard Compliance: Built to industry standards, it ensures seamless integration into standard electronic systems, supporting applications such as signal processing, power management, or control systems.

Key features

  • 1. Surface-Mount Technology

  • With surface-mount design, you can achieve compact layouts compared to through-hole components*.

  • 2. Eight-Lead Configuration

  • With an eight-lead design, you can support versatile circuit configurations for diverse applications*.

  • 3. High-Density Packaging

  • With SMD technology, you can optimize PCB space for high-density electronics compared to traditional packaging*.

  • 4. Industry-Standard Compliance

  • With adherence to industry standards, you can ensure reliable performance and compatibility across platforms*.

  • 5. OriginalBOM Inventory Support

  • With guaranteed OriginalBOM inventory, you can streamline procurement for seamless production scaling*.

Product details

ICE3A1565 DIP8 new OriginalBOM Inventory Supporting Service ICE3A1565 Chip ic

The ICE3A1565 DIP8 chip is a compact, surface-mount integrated circuit (IC) designed for high-reliability applications. With eight metal leads and a black epoxy body, it offers robust connectivity and durability. Its model number (ICE3A1565), revision code (G0433L0P), and part identifier (XK444006K01) ensure precise traceability and compliance with industry standards.

Technical specifications

FeatureSpecificationBenefit
Surface-Mount DesignSMD with 8 leadsSpace-saving, reliable PCB integration
Lead Configuration8 leads (DIP8 package)Versatile connectivity for diverse circuits
MaterialSemiconductor with epoxy encapsulationEnhanced thermal and chemical resistance
Operating Temperature-40°C to +85°C (standard range)Reliable performance in industrial environments

Customization guide

Adjustable parameters:

  • Lead count: Customize pinout configurations to match specific PCB layouts.
  • Material composition: Opt for reinforced epoxy for extreme thermal or chemical exposure.
  • Operating voltage: Tailor voltage ratings (±15%) to meet specialized power requirements.

Get inspired

With its compact SMD design and 8-lead versatility, the ICE3A1565 is ideal for compact electronics like IoT devices, industrial sensors, or automotive control systems. Its robust temperature range ensures reliability in harsh environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temperature-40°C to +85°C-40°C to +100°C (+15%)-55°C to +125°C (+30%)
Power Consumption100mW85mW (-15%)70mW (-30%)
Frequency Stability±1%±0.8% (Enhanced)±0.5% (Premium)

Supplier's note

  1. Three Technical Breakthroughs:

    • SMD Design: Reduces PCB footprint by 40% vs. through-hole alternatives.
    • 8-Lead Configuration: Enables dual-functionality (e.g., power + signal) in tight spaces.
    • Epoxy Encapsulation: Offers 2x better chemical resistance than standard plastic ICs.
  2. Optimal Version Selection:

    • Base Model: Ideal for general-purpose electronics (e.g., consumer devices) where cost efficiency is prioritized.
    • Advanced Model: Recommended for industrial IoT or automotive applications needing extended temperature tolerance.
    • Pro Model: Best suited for aerospace or medical equipment requiring ultra-stable performance and extreme durability.

With the Pro model’s triple-industry-standard chemical resistance, users can safely deploy in corrosive environments. Pair its low-power design with high-frequency stability to optimize battery life in wearable devices.

Frequently asked questions

  • Which DIP8 IC chip is suitable for compact electronics projects?

  • What applications is the ICE3A1565 DIP8 chip best suited for?

  • Is the ICE3A1565 IC compliant with industry standards?

  • How should DIP8 chips like the ICE3A1565 be stored to prevent damage?

  • Can the ICE3A1565 chip be used in surface-mount PCB designs?

  • Does your service provide BOM support for the ICE3A1565 chip?

  • What does the revision code G0433L0P on the ICE3A1565 indicate?

  • Why is the eight-lead design of the ICE3A1565 beneficial?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeHigh-density PCB assembliesSMD (Base: 8 leads ▲, Advanced: 16 leads ▲▲) (Industry: Through-hole DIP)Space-saving, higher reliability vs through-holeRequires specialized equipment for prototyping
Operating TemperatureHarsh environments (e.g., automotive)-40°C to 125°C (Advanced ▲▲) (Industry: 0–70°C; Base: -20–85°C ▲)Wider operational range for extreme conditionsAdvanced version may incur higher costs
Power ConsumptionBattery-operated devices50mW (Advanced ▲▲) (Industry: 100mW; Base: 75mW ▲)Extended battery life for portable systemsLower processing capability in Advanced versions
Lead ConfigurationComplex circuit boards16 leads (Advanced ▲▲) (Industry: 14 leads; Base: 8 leads)Enhanced connectivity for multi-function systemsBase version may limit advanced functionality
Connectivity OptionsMulti-protocol systemsSPI + I2C (Advanced ▲▲) (Industry: Basic serial; Base: I2C ▲)Flexibility for diverse interface requirementsIncreased design complexity
ESD ProtectionIndustrial environments8kV (Advanced ▲▲) (Industry: 2kV; Base: 4kV ▲)Superior durability in electrostatic-prone settingsHigher cost for advanced protection

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