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  • IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen
  • IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen
  • IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen
  • IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen
  • IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen
  • IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen
IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen

IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen

  • >= 1 Pieces
    $40

Customization:

Customized logo（Min.Order: 10 pieces）
Customized packaging（Min.Order: 10 pieces）
Graphic customization（Min.Order: 10 pieces）
View product details

IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance HDI PCB Assembly: Designed for 6-layer High Density Interconnect (HDI) circuit boards using Rogers R04003 substrate, optimized for high-frequency applications and precision electronics.
  • IPC Quality Certified Manufacturing: Ensures strict adherence to industry standards for reliability, durability, and precision in complex electronic systems.

Key features

  • 1. Material Technology

    • With high-performance Rogers R04003 and FR-4 substrates, you can achieve superior signal integrity and thermal stability in high-frequency applications*

  • 2. Certification Standards

    • With IPC Quality and CE certifications, you can ensure compliance with global manufacturing and safety standards, guaranteeing reliability and market readiness.

  • 3. Performance Parameters

    • With a 6-layer HDI design, you can reduce board size by up to 40% compared to traditional multi-layer boards while maintaining performance*

  • 4. Scenario Solutions

    • Designed for high-reliability scenarios like automotive control systems and aerospace electronics, you can ensure seamless operation in extreme environmental conditions.

  • 5. Interactive Design

    • With advanced HDI microvia technology, you can integrate complex functionalities into compact devices without compromising signal integrity, enabling sleek and powerful electronics.

Product details

IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards ENIG PCB Shenzhen

The IPC Quality Certified Rogers R04003 PCB Assembly Factory 6 Layers HDI Circuit Boards with ENIG finish combines precision engineering and high-performance materials. Designed for applications requiring reliability and durability, this PCB assembly is certified to CE standards and optimized for complex electronic systems.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialRogers R04003 (high-frequency substrate) / FR-4 (standard)High-frequency RF devices, automotive control systems
Layer Count6-layer HDI (High Density Interconnect)Compact, high-density circuit designs
Surface FinishENIG (Electroless Nickel Immersion Gold)Corrosion-resistant assemblies for harsh environments
CertificationCE, IPC-A-610 Class 3Industrial, medical, and aerospace equipment

Customization guide

Adjust material composition (e.g., Rogers R04003 for high-frequency needs) or layer count to meet specific thermal/RF requirements. Custom trace routing and surface finish modifications are available for specialized applications.

Get inspired

With its 6-layer HDI design and ENIG finish, this PCB assembly enables sleek, high-performance electronics for IoT devices, 5G communication systems, and automotive control units.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Signal IntegrityFR-4 substrateRogers R04003 (+20%*)Rogers R04003 + TTI (+35%*)
Layer Count4-layer HDI6-layer HDI8-layer HDI
Thermal PerformanceStandard copper weightHeavy copper (+30%*)IMS substrate (+50%*)

Supplier's note

  1. Technical Breakthroughs:

    • Rogers R04003 Substrate: Delivers 20% better signal integrity than FR-4, critical for 5G and radar systems.
    • ENIG Surface Finish: Eliminates corrosion risks in humid environments, extending product lifespan by 40%.
    • IPC-A-610 Class 3 Compliance: Ensures zero defects in aerospace and medical devices.

  2. Version Selection Guide:

    • Base Model: Ideal for consumer electronics (e.g., smart home devices) where cost-efficiency is prioritized.
    • Advanced Model: Suited for industrial IoT and automotive systems requiring high-frequency performance.
    • Pro Model: Best for aerospace and defense applications demanding extreme thermal and signal stability.

*Comparative performance vs. industry benchmarks.

Frequently asked questions

  • Which IPC certified Rogers R04003 PCB assembly suits high-density applications?

  • What’s the difference between FR-4 and Rogers R04003 materials for PCB assemblies?

  • Can I customize layer counts or materials for my HDI PCB project?

  • Is the ENIG surface finish suitable for mass production PCBAs?

  • Does your 6-layer HDI PCB comply with CE certification requirements?

  • How do I store HDI PCBAs to prevent component damage?

  • What industries use your IPC certified Rogers R04003 PCBAs?

  • What affects lead times for custom Rogers R04003 HDI PCB assemblies?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionHigh-frequency devices (5G, aerospace)Rogers R04003 (Dk=3.55, Df=0.0025 @10GHz) ▲▲▲ (vs FR-4)Superior signal integrity for high-frequency applicationsHigher material cost (30–50% more than FR-4)
Certification StandardsGlobal compliance marketsCE + IPC-A-610 ▲ (Industry: CE only)Ensures reliability and broader market acceptanceHigher certification costs
Layer ConfigurationCompact electronics (smartphones, IoT)6-layer HDI ▲▲ (Industry: 4-layer standard)Enables dense component placement and miniaturizationComplex manufacturing requiring advanced equipment
Surface FinishCorrosion-sensitive environmentsENIG (Electroless Nickel Immersion Gold) ▲▲ (Industry: HASL)Enhanced solderability and resistance to oxidationCostlier than HASL (≈20% premium)
Signal IntegrityHigh-speed data transmission systems43 dBA noise reduction (quieter than refrigerator hum) ▲Minimizes electromagnetic interference for stable performanceRequires advanced design tools for optimal routing
Thermal ManagementHigh-power applications (servers, EVs)Thermal via technology ▲ (Industry: Standard vias)Efficient heat dissipation for reliable operation under loadAdds complexity to PCB layout and assembly

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