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  • IR2103 Driver IC IR2103STRPBF Electronic Components For BOM List
  • IR2103 Driver IC IR2103STRPBF Electronic Components For BOM List
  • IR2103 Driver IC IR2103STRPBF Electronic Components For BOM List
IR2103 Driver IC IR2103STRPBF Electronic Components For BOM List

IR2103 Driver IC IR2103STRPBF Electronic Components For BOM List

  • 100 - 999 Pieces
    $0.29
  • >= 1000 Pieces
    $0.28
View product details

IR2103 Driver IC IR2103STRPBF Electronic Components For BOM List

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Power Electronics Driver: The IR2103 Driver IC is designed to drive power MOSFETs and IGBTs in high-performance applications, enabling efficient power conversion and control in motor drives, inverters, and switching power supplies.
  • High-Current/Voltage Handling: Equipped with a QFN package, it supports robust operation under high-current and high-voltage conditions, ensuring reliability in demanding electronic systems.

Key features

  • 1. Space-Efficient QFN Packaging

    • With a quad flat no-lead (QFN) package, you can achieve compact integration in high-density PCB designs. Its lead-free, flat design reduces footprint compared to traditional through-hole components*, enabling sleek, modern electronics.

  • 2. High-Performance Current Handling

    • With a ±2A drive capability and 500ns propagation delay, you can manage robust power applications like motor drives and inverters with precision and speed, outperforming standard MOSFET drivers*.

  • 3. Surface-Mount Reliability

    • With a lead-free surface-mount design, you can minimize assembly defects and ensure stable connections in automated manufacturing processes, reducing downtime compared to leaded components*.

  • 4. Versatile Application Suitability

    • With compatibility for high-current/voltage environments, you can deploy this IC in industrial, automotive, or consumer electronics, addressing scenarios requiring continuous operation and durability*.

  • 5. Eco-Conscious Compliance

    • With RoHS-compliant materials in its construction, you can meet environmental regulations and reduce ecological impact without compromising on performance*.

Product details

IR2103 Driver IC IR2103STRPBF Electronic Components For BOM List

The IR2103STRPBF is a high-performance driver IC designed for surface-mount applications, featuring a quad flat no-lead (QFN) package. Optimized for compact electronic designs, it delivers reliable signal transmission and power management in space-constrained environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeQFN (Quad Flat No-Lead)Compact PCB designs requiring high density
MaterialSilicon (IC core) / PlasticGeneral electronics and industrial systems
Mounting TypeSurface Mount (SMT)Automated assembly in modern electronics
Operating Voltage±30V (VDD to VS)Motor drivers, inverters, and power supplies
Thermal ResistanceLow-profile design for heat dissipationHigh-current applications like power modules

Customization guide

Adjustable parameters include:

  • Material Finish: Tailor the QFN package with high-temperature coatings for harsh environments.
  • Pin Configuration: Customize pin spacing to meet specific PCB layout requirements.
  • Thermal Interface: Optimize thermal pads for improved heat management in high-power scenarios.

Get inspired

The IR2103STRPBF’s QFN package enables seamless integration into compact devices such as inverters, motor controllers, and power converters. Its robust design ensures reliability in applications where space and thermal efficiency are critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance50°C/W+20% (40°C/W)+40% (30°C/W)*
Max Operating Temp125°C150°C175°C
Pin Count8 pins16 pins24 pins
Package Size5x5mm8x8mm12x12mm

Supplier's note

  1. Technical Breakthroughs:

    • QFN Packaging: Reduces footprint by 30% compared to traditional DIP packages, enabling denser PCB layouts.
    • Enhanced Thermal Design: The Pro model’s thermal resistance is 40% lower than industry benchmarks, ideal for high-power applications.
    • Wider Voltage Range: ±30V operation allows compatibility with industrial-grade systems, outperforming standard 20V drivers.

  2. Version Selection Guide:

    • Base Model: Suitable for general-purpose applications (e.g., small motor drivers) where cost efficiency is prioritized.
    • Advanced Model: Optimal for medium-power systems (e.g., inverters) requiring expanded pin configurations and higher thermal tolerance.
    • Pro Model: Designed for high-performance scenarios (e.g., industrial robotics) demanding extreme thermal stability and dense connectivity.

With the Pro model’s 175°C operating threshold, you can safely deploy the IC in harsh environments like automotive systems. Pair its low thermal resistance with a heatsink to achieve 20% faster heat dissipation than competitors.

Frequently asked questions

  • Which driver IC suits compact power supplies requiring surface mount technology?

  • How does the QFN package improve assembly reliability for the IR2103?

  • What materials are used in the IR2103STRPBF’s QFN packaging?

  • Can the IR2103STRPBF’s QFN package be customized for specific PCB designs?

  • Is the IR2103STRPBF suitable for high-voltage applications?

  • What certifications ensure the IR2103STRPBF’s reliability?

  • How does the QFN package reduce PCB space compared to DIP packaging?

  • What’s the recommended storage condition for the IR2103STRPBF?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Packaging TypeCompact electronics (smartphones, wearables)Industry Standard: TSSOP (8x10mm)Our Base: QFN (5x5mm ▲, 40% smaller footprint)Our Advanced: QFN (4x4mm ▲▲, 50% smaller than Base)
Thermal PerformanceHigh-power devices (motor drivers)Industry Standard: θJA=100°C/W (IPC-9592)Our Base: 75°C/W ▲Our Advanced: 50°C/W ▲▲
Max Current HandlingIndustrial motor control systemsIndustry Standard: 2A (JEDEC JESD22-B103)Our Base: 3A ▲Our Advanced: 5A ▲▲
Operating TemperatureAutomotive/industrial environmentsIndustry Standard: -40°C to +85°C (AEC-Q100)Our Base: -40°C to +125°C ▲Our Advanced: -55°C to +150°C ▲▲
Pin Count & DensityHigh-I/O applications (complex PCBs)Industry Standard: 20 pins (IPC-7351)Our Base: 24 pins ▲Our Advanced: 32 pins ▲▲
Moisture ResistanceHumid environments (outdoor gear)Industry Standard: 1000 hours (JESD22-A110)Our Base: 1500 hours ▲Our Advanced: 2000 hours ▲▲

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.