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  • ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic
  • ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic
  • ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic
  • ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic
  • ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic
  • ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic
ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic

ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic

  • 10 - 29 Pieces
    $3
  • 30 - 99 Pieces
    $2
  • >= 100 Pieces
    $0.50
View product details

ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit: The ISPLSI 1048-70LQ is designed for efficient electronic processing, serving as a core component in various electronic devices.
  • High-Density Mounting: Utilizing a quad flat no-lead (QFN) package, this IC is ideal for applications requiring compact, space-efficient solutions.

Key features

  • 1. Advanced Material Technology

    • With a QFN package, you benefit from a reliable metal lid that enhances thermal conductivity, ensuring efficient heat dissipation in high-performance environments.

  • 2. Space-Saving Interactive Design

    • With a compact and thin QFN package, optimize space in dense PCB layouts, reducing the risk of shorts and enhancing component reliability.

  • 3. Superior Performance Parameters

    • With surface mount technology, achieve efficient assembly and high-density mounting, offering improved reliability and performance over traditional through-hole components.

  • 4. Flexible Scenario Solutions

    • With customizable QFN packages, tailor material and size to fit specific design requirements, providing versatility for various electronic applications.

  • 5. Compliance with Certification Standards

    • With customizable thermal management solutions, meet thermal performance standards critical for high-performance electronic components.

Product details

ISPLSI 1048-70LQ Electronic Components mencap 120-PQFP (28x28) IC microchip chip Integrated Circuits original ic

The ISPLSI 1048-70LQ is a high-performance integrated circuit, housed in a 120-pin QFN package, ideal for space-constrained applications. This original IC is designed for seamless integration into high-density PCB layouts, making it a perfect choice for advanced electronic systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeQuad Flat No-lead (QFN)High-density mounting, space-efficient
MaterialPlastic/Ceramic with Metal LidEnhanced thermal conductivity
Mounting StyleSurface Mount Technology (SMT)Efficient and reliable assembly
ApplicationIntegrated CircuitVersatile use in various electronic devices

Customization guide

With customizable materials and sizes, you can tailor the QFN package to meet specific design and thermal management requirements, ensuring optimal performance for your unique applications.

Get inspired

Explore the possibilities with our ISPLSI 1048-70LQ ICs, designed to enhance the efficiency of your electronic systems. Whether for consumer electronics or industrial control, this component offers reliability and performance.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal EfficiencyStandard+15%+30%*
Mounting DensityStandardEnhancedPremium

Supplier's note

Recent advancements in QFN packaging have achieved significant breakthroughs in thermal management, reducing heat-related failures by 30%. For applications demanding high reliability, the Pro Model's enhanced thermal efficiency is unmatched, ensuring safe operation in high-performance environments. When choosing the right model, consider the complexity of your PCB layout and the thermal demands of your application to select the optimal version for your needs.

Frequently asked questions

  • Which model of ISPLSI 1048-70LQ integrated circuits is suitable for high-density PCB applications?

  • How can I ensure proper maintenance and care for my ISPLSI 1048-70LQ electronic components?

  • What are the advantages of using the QFN package for integrated circuits compared to other materials?

  • Can I customize the ISPLSI 1048-70LQ integrated circuits for specific thermal management needs?

  • Is the ISPLSI 1048-70LQ material suitable for industrial control systems?

  • Are customization services available for the ISPLSI 1048-70LQ to fit specific PCB layouts?

  • How does surface mount technology enhance the efficiency of ISPLSI 1048-70LQ integrated circuits?

  • What makes the ISPLSI 1048-70LQ integrated circuits a unique solution for consumer electronics?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Integrated CircuitsHigh-density PCB layoutsQFN package with metal lid (enhanced heat dissipation)Space-efficient (suitable for compact designs)Potentially higher cost due to packaging materials
Surface Mount TechnologyModern electronics assemblySurface mount components (smaller and efficient)Allows for more components per PCB areaRequires precise assembly techniques
Customization SolutionsSpecific design requirementsMaterial and size customization optionsFlexibility in PCB layout and component placementMay require additional design resources
Thermal ManagementHigh-performance electronicsThermal vias in metal lid (improved heat dissipation)Enhances reliability and performanceIncreased complexity in design
Specialized ICsConsumer electronics, industrial useISPLSI 1048-70LQ model (standard, original)Proven reliability in integrated circuit applicationsLimited to specific applications
High-Density PackagingSpace-constrained applicationsQFN package style (small and thin)Reduces risk of shorts, improves reliabilityMay be challenging to repair or replace

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