Material Composition | Cost-sensitive electronics, consumer devices | Industry Standard: Ceramic (150°C max temp, ASTM E1461) ▲ Our Base: Plastic (120°C, ISO 9001) ▲ Our Advanced: Plastic+ (140°C, IEC 60093) | Lightweight, cost-effective; Advanced version balances durability and cost | Lower max temperature than ceramic; Advanced requires specialized molding |
Surface-Mount Design | Compact PCB assemblies | Industry Standard: SMD (ISO 9846 compliant) ▲ Our Base: SMD (same) ▲ Our Advanced: Enhanced SMD (gold-plated leads, IEC 61760) | Space-saving, easy assembly; Advanced improves conductivity | Requires precise soldering; Advanced adds cost for plating |
Current Handling | High-current power circuits | Industry Standard: 3A (IEC 60204) ▲ Our Base: 5A ▲ Our Advanced: 10A (UL 1950) | Base meets basic needs; Advanced handles heavy loads | Base may limit high-current applications; Advanced adds bulk |
Voltage Rating | High-voltage systems | Industry Standard: 20V (UL 1950) ▲ Our Base: 30V ▲ Our Advanced: 50V (IEC 60950) | Supports higher voltages; Advanced enables industrial use | Base may restrict high-voltage applications; Advanced requires thicker insulation |
Thermal Dissipation | Heat-sensitive environments | Industry Standard: 0.5W/cm² (ASTM E1461) ▲ Our Base: 0.7W/cm² ▲ Our Advanced: 1.0W/cm² (IPC-9592) | Reduces overheating risks; Advanced improves longevity | Base may underperform in extreme heat; Advanced adds thermal layers (cost) |
Packaging Density | Space-constrained devices | Industry Standard: 200 components/inch² (IPC-7351) ▲ Our Base: 250 ▲ Our Advanced: 300 (JEDEC MO-187) | Higher component density; Advanced optimizes board space | Base may not suit ultra-compact designs; Advanced needs advanced pick-and-place tech |