Thermal Design Power (TDP) | High-Performance Workloads, Overclocking | Industry: 95W ▲ Our Base: 85W ▲ Our Advanced: 75W (meets JEDEC JESD51-2 standard) | Lower TDP reduces cooling requirements and energy costs. | Advanced tier may sacrifice peak performance for efficiency. |
Clock Speed (Processor Frequency) | Multitasking, General Computing | Industry: 3.0 GHz ▲ Our Base: 2.8 GHz ▲ Our Advanced: 3.2 GHz (Intel® Core™ i5 benchmark) | Higher clock speed boosts single-threaded tasks like gaming. | Base tier may lag in intensive applications. |
Socket Compatibility (LGA1366) | Desktop Builds with Intel 45nm Processors | Industry: LGA1366 ▲ Our Base: LGA1366 ▲ Our Advanced: LGA1366 + PCIe 3.0 Support | Backward compatibility ensures compatibility with legacy motherboards. | Limited to older standards; incompatible with modern chipsets. |
Material Quality (Ceramic Substrate) | High-Reliability Applications | Industry: Ceramic ▲ Our Base: Ceramic ▲ Our Advanced: Reinforced Ceramic (MIL-STD-810G) | Ceramic improves thermal conductivity and durability over plastic substrates. | Advanced tier adds cost without visible performance gains for basic use cases. |
Power Consumption | Energy-Conscious Environments | Industry: 95W ▲ Our Base: 85W ▲ Our Advanced: 75W (measured via IEEE 1366) | Advanced tier reduces energy bills by 20% compared to industry standards. | Lower power may throttle performance under sustained loads. |
Refurbished Condition | Budget Upgrades, Secondary Systems | Industry: New Units ▲ Our Base: Refurbished (95% original specs, ISO 9001) ▲ Advanced: Refurbished + 2-year warranty | Cost-effective alternative to new CPUs (up to 40% savings). | Potential for reduced lifespan vs. new units; no official overclocking support. |