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  • Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips
  • Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips
  • Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips
  • Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips
  • Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips
  • Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips
Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips

Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips

$50.00-$500.00/ Piece|1 Piece/Pieces(Min. Order)
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Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • ASIC Specialization: The BM1746AA is an Application-Specific Integrated Circuit (ASIC) designed for high-performance networking and computing tasks in the Z15 machine. It optimizes data processing, encryption, and network management functions.
  • SMD Mounting: Surface-Mount Design (SMD) enables seamless integration into compact electronic systems, ensuring reliability and efficient space utilization.

Key features

  • 1. Advanced SMD Mounting Technology

    • With Surface-Mounted Device (SMD) technology, you can achieve compact and space-efficient integration into network computer systems like the Z15 machine. This design reduces footprint compared to through-hole mounting methods*.

  • 2. Specialized High-Performance Computing Capabilities

    • With the BM1746AA ASIC chip’s optimized architecture, you can process complex network computations faster than generic IC solutions*. The chip’s design ensures seamless compatibility with high-demand applications.

  • 3. Durable FR-4 PCB Material

    • With a corrosion-resistant FR-4 PCB base, you can ensure long-term reliability in industrial or commercial environments. This material outperforms lower-grade substrates in thermal and mechanical stability*.

  • 4. Customizable Connectivity via Perimeter Solder Pads

    • With a grid of perimeter solder pads, you can easily adapt the PCB to diverse connectivity needs, enabling rapid prototyping or system upgrades compared to fixed-pin designs*.

  • 5. Continuous Operation for Commercial Workloads

    • With robust thermal management and commercial-grade endurance, you can support uninterrupted operation in network computing systems, unlike consumer-grade ICs designed for intermittent use*.

Product details

Income calculator asic IC chip BM1746 SMD BM1746AA for network computer Z15 machine chips

The BM1746AA ASIC IC chip is a specialized integrated circuit designed for high-performance computing in network computers and industrial machines. Engineered with Surface-Mount Device (SMD) technology, this chip offers robust computational capabilities and seamless integration into compact hardware systems like the Z15 machine.

Technical specifications

FeatureSpecificationBenefit
IC ModelBM1746AAHigh-performance ASIC for network computing
Mounting TypeSMD (Surface-Mount Device)Enables compact, space-efficient assembly
MaterialFR-4 epoxy laminateDurable and heat-resistant PCB substrate
Solder Pad LayoutPerimeter grid configurationFlexible connectivity for modular designs
ApplicationNetwork computers, industrial machinesOptimized for high-throughput data tasks

Customization guide

Adjustable parameters include:

  • IC chip configuration to match specific compute workloads (e.g., data center scaling).
  • Solder pad spacing/density to accommodate custom connectivity needs.
  • Thermal interface materials for enhanced heat dissipation in high-power scenarios.

Get inspired

The BM1746AA’s SMD design and ASIC architecture make it ideal for embedding into network infrastructure or industrial control systems. Its compact form factor and robust thermal management enable reliable operation in demanding environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Compute Performance1.2 TFLOPS+15% (1.38 TFLOPS)+30% (1.56 TFLOPS)*
Thermal Dissipation5W/cm²Enhanced (6W/cm²)Premium (8W/cm²)
Power Efficiency12W @ 100% load10W (-17% power use)8W (-33% power use)

Supplier's note

  1. Key Technical Breakthroughs:

    • BM1746AA ASIC Core: Delivers 20% faster data processing than legacy ASICs, enabling real-time analytics in network systems.
    • Advanced Thermal Design: The Pro Model’s 8W/cm² thermal rating exceeds industry benchmarks by 30%, ensuring stability under sustained workloads.
    • Low-Power Architecture: The Pro Model reduces power consumption by 33% compared to competitors, lowering operational costs.

  2. Optimal Version Selection:

    • Base Model: Ideal for small-scale network devices or low-power embedded systems.
    • Advanced Model: Suitable for mid-tier servers or industrial IoT gateways requiring moderate compute and thermal performance.
    • Pro Model: Designed for high-performance applications like data centers or edge computing systems. With its triple-industry-standard thermal resistance, the Pro Model ensures reliability in 24/7 operation. For example, paired with its ultra-low power consumption, it enables energy-efficient AI inference in smart factories.

Frequently asked questions

  • Which BM1746AA model is best suited for network computers like the Z15 machine?

  • Is the BM1746AA IC chip compatible with Z15 network computer systems?

  • What certifications or technical validations does the BM1746AA chip meet?

  • Why choose SMD mounting for the BM1746AA IC chip?

  • Can the BM1746AA PCB be customized for specific applications?

  • What applications benefit most from the BM1746AA’s specialized capabilities?

  • How do I ensure proper installation of SMD BM1746AA chips?

  • What distinguishes the BM1746AA from other ASIC chips in network computing?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing PowerHigh-Performance ComputingIndustry: 2 GHz (IEEE 1234); Our Base: 2.5 GHz (▲); Our Advanced: 3 GHz (▲▲)▲▲ 50% faster than industry standardHigher power consumption
Thermal PerformanceData CentersIndustry: 15W; Our Base: 12W (▲); Our Advanced: 10W (▲▲)▲▲ 33% lower thermal dissipationRequires precise thermal management
Power EfficiencyEnergy-Sensitive DevicesIndustry: 5 J/op; Our Base: 3 J (▲); Our Advanced: 2 J (▲▲)▲▲ 60% lower energy useComplex power management required
Package TypeCompact ElectronicsIndustry: Through-hole (IPC-7351); Our Base: SMD (▲); Advanced: SMD+ (▲▲)▲▲ 40% smaller footprintNeeds precise assembly equipment
CompatibilityMulti-Device NetworksIndustry: Limited; Our Base: Z15 (▲); Advanced: Z15/Z16 (▲▲)▲▲ Supports future-proof hardwareHigher R&D investment
DurabilityHarsh EnvironmentsIndustry: -20°C–70°C; Base: -30°C–85°C (▲); Advanced: -40°C–90°C (▲▲)▲▲ Operates in extreme conditionsHigher material costs

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