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  • Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing
  • Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing
  • Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing
  • Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing
  • Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing
  • Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing
Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing

Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing

  • 1 - 9 Sets
    $42,000
  • >= 10 Sets
    $38,000

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
View product details

Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • BGA Rework & Reballing: Precision infrared heating system for desoldering and reballing of BGA components on motherboards and mobile devices.
  • TIG Welding Integration: High-precision TIG welding mode ensures durable, fine solder joints for complex electronics repair.
  • CCD Camera Alignment: Real-time visual guidance and component positioning for accurate placement during rework.

Key features

  • 1. Precision CCD Camera System for Accurate Alignment

    • With high-resolution CCD camera sensors, achieve sub-micron-level component positioning, ensuring 20% higher accuracy than standard rework systems*. This technology minimizes misalignment errors during BGA reballing, critical for delicate motherboard repairs.

  • 2. Intuitive Touchscreen Interface with Pre-Set Programs

    • With a 10.1" touchscreen and pre-configured repair modes (e.g., "Mobile Phone Quick Fix," "Motherboard Precision Mode"), reduce setup time by up to 30% compared to manual dial-based systems*. Easily switch between repair scenarios with a single touch.

  • 3. Advanced TIG Welding for High-Speed Precision

    • With dual infrared/TIG hybrid welding capability, achieve solder joint integrity 40% faster than pure infrared systems* while maintaining ±5µm precision for fine-pitch BGA components. Ideal for both rapid commercial repairs and intricate mobile device work.

  • 4. Dual-Use Design for Commercial & Mobile Repair Scenarios

    • With adjustable thermal profiles and automatic reballing functionality, efficiently handle high-volume motherboard repairs while maintaining precision for delicate mobile phone components*. Unlike single-purpose devices, this machine adapts to diverse repair demands.

  • 5. Comprehensive Safety & Environmental Certifications

    • With CE, RoHS, and ISO 13849-1 certifications, ensure compliance with global safety and environmental standards, exceeding requirements of uncertified competitors*. This guarantees safe operation in professional repair environments.

Product details

Infrared BGA Rework Station Reballing Machine with CCD Camera System for Motherboards Repairing Automatic Mobile Phone Repairing

The Infrared BGA Rework Station Reballing Machine with CCD Camera System is a precision tool designed for automated repair of motherboards and mobile phone components. Equipped with advanced infrared heating and a high-resolution CCD camera system, it ensures accurate BGA reballing and rework while supporting TIG welding for versatile applications.

Technical specifications

FeatureSpecificationBenefit
Machine TypeWelding robot + manipulatorStreamlined automation for complex repairs
Welding ModeTIG (Tungsten Inert Gas)High-precision welding for delicate circuits
CCD Camera System10MP resolution with auto-focusingMicron-level alignment for BGA placement
Infrared HeatingAdjustable 200–500°C temperature rangeUniform thermal control for solder reflow
Automation LevelSemi-automatic with programmable presetsReduces operator error and cycle time

Customization guide

Adjustable parameters include heating temperature curves, CCD zoom magnification, and TIG current settings to accommodate specialized components (e.g., fine-pitch BGA or heat-sensitive PCBs).

Get inspired

With its CCD-guided precision and infrared thermal management, this machine enables efficient motherboard repair for electronics technicians, reducing downtime in smartphone and device servicing.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Heating Accuracy±3°C±2°C (+20%)±1.5°C (+50%)
Positioning Precision10µm5µm (+50%)2µm (+80%)
Automation FeaturesBasic presetsFull auto-calibrationAI defect detection
Cycle Time120 sec/unit90 sec/unit (-25%)60 sec/unit (-50%)

Supplier's note

  1. Technical Breakthroughs:

    • The CCD camera system enables micron-level alignment, reducing misplacement errors by 40%.
    • Infrared heating zones provide 25% faster thermal stability compared to conventional systems.
    • TIG welding integration expands repair capabilities for hybrid PCB assemblies.

  2. Optimal Version Selection:

    • Base Model: Ideal for small workshops handling low-volume repairs (e.g., 10–20 units/day).
    • Advanced Model: Suited for medium-scale repair centers requiring faster cycle times (-25%) and higher precision.
    • Pro Model: Recommended for high-volume manufacturers needing AI-driven defect detection and ultra-fast 60-sec cycles. With its ±1.5°C heating accuracy, the Pro ensures consistent solder joints even on fine-pitch BGAs.

Frequently asked questions

  • Which BGA rework station model is best for small electronics repair shops?

  • How do I clean and maintain the CCD camera system for optimal accuracy?

  • What materials are used in the rework station’s heating components for durability?

  • Can the reballing machine be customized for specific PCB sizes or repair needs?

  • Is the welding manipulator CE-certified for industrial use?

  • How do I maintain the infrared heating system to prevent overheating?

  • Does the machine support automatic reballing for mobile phone motherboards?

  • What welding modes does the manipulator support besides TIG welding?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Manual BGA Rework StationsSmall-scale repairs, prototypingManual operation, ±0.5mm alignment (ISO 10360 standard)Lower cost, flexible for small jobs (▲)Labor-intensive, higher error rates (▲), limited precision (▲)
Semi-Automated BGAMedium-volume productionPartial automation, ±0.2mm accuracy (ISO 10360), TIG welding (AWS G2.1)Moderate cost, better precision than manual (▲▲), faster throughput (▲▲)Requires manual input (▲), less consistent than fully automated (▲)
Fully Automated BGAHigh-volume manufacturingFull automation, ±0.05mm precision (ISO 10360), robotic arm (ISO 9283), CCD cameraHigh throughput (▲▲▲), minimal errors (▲▲▲), consistent quality (▲▲▲)High cost (▲▲▲), complex setup (▲▲▲), maintenance-heavy (▲▲)
Robotic Welding SystemsHeavy industrial weldingRobotic arms with TIG (AWS G2.1), ±0.1mm repeatability (ISO 9283)High precision for large parts (▲▲), versatile (▲▲)Not optimized for BGA (▲), requires customization (▲)
Traditional TIG MachinesGeneral metal weldingManual TIG operation (AWS G2.1), temperature up to 2000°CCost-effective for basic welding (▲), material versatility (▲)Not suitable for electronics (▲▲), requires skilled operator (▲▲)
Hybrid BGA SystemsMid-range productionCombines manual/automated, ±0.3mm accuracy (ISO 10360), partial CCD (720p)Balance between cost and automation (▲▲), moderate precision (▲)Limited scalability (▲▲), less precise than fully automated (▲▲)

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