(Integrated Circuits) ATIC64 C1

Name: (Integrated Circuits) ATIC64 C1
Brand: Shenzhen Orwintech Electronic Co., Ltd.
SKU: 62352115929_1
Price: 0.70 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Density Electronics Integration: The ATIC64 C1 is a 28-pin dual in-line package (DIP) integrated circuit designed for standard electronic applications, enabling compact and efficient circuit design through surface mount technology (SMT).
Versatile Circuit Support: Supports both analog and digital signal processing, making it suitable for microcontroller units, data processing modules, and power management systems in electronic devices.

Key features

1. Material Technology

With a durable plastic/ceramic package, ensure reliable operation in high-temperature environments*

2. Performance Parameters

With surface mount technology (SMT), achieve up to 30% higher component density compared to through-hole mounting*

3. Scenario Solutions

With a 28-pin DIP design, you can integrate complex circuits for applications like microcontrollers or digital signal processing.

4. Interactive Design

With a customizable internal architecture, tailor functionality for specific tasks such as data processing or power management.

5. Certification Standards

With compliance to standard industry certifications, ensure safety and quality for electronic systems.

Product details

The ATIC64 C1 is a 28-pin dual in-line package (DIP) integrated circuit (IC) designed for surface-mount technology (SMT) applications. Built with high-quality semiconductor materials and a durable plastic/ceramic package, it offers reliable performance in standard electronic systems. Its compact SMT footprint enables efficient PCB layout, while the 28-pin configuration balances pin density and size for versatile use in microcontrollers, DSPs, and other digital/analog circuits.

Technical specifications

Feature	Specification	Application Scenario
Surface Mount Design	SMT-compatible, no through-hole mounting	High-density PCB assembly
Pin Configuration	28-pin DIP (two rows of 14 pins)	Digital/analog circuits, signal processing
Material	Plastic/ceramic package, silicon core	Harsh thermal or mechanical environments
Certification	Meets industry-standard reliability specs	Industrial, consumer electronics

Customization guide

Adjustable pin configurations and internal circuitry design to meet specialized PCB layout needs or functional requirements (e.g., power management, signal conditioning).

Get inspired

The ATIC64 C1’s modular design and SMT compatibility make it ideal for compact electronics. Whether you’re building a microcontroller unit or a DSP module, this IC delivers reliable performance in a space-saving package.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Operating Temperature	-40°C to +85°C	+15% wider range	+30% wider range*
Power Consumption	1.5W max	10% lower	20% lower
Frequency Stability	±5% tolerance	±3% tolerance	±1% tolerance

Supplier's note

Technical Breakthroughs:
- SMT Design: Enables 20% denser PCB layouts compared to through-hole alternatives.
- 28-Pin DIP: Balances pin count and size, reducing board space by 15% versus larger packages.
- Material Durability: Ceramic variants withstand 30% higher thermal shock than plastic-only packages.
Version Selection Guide:
- Base Model: Ideal for standard applications (e.g., consumer electronics) requiring cost-effective performance.
- Advanced Model: Suitable for industrial IoT or automotive systems needing 15% improved thermal tolerance.
- Pro Model: Best for high-precision applications (e.g., aerospace, medical devices) where ±1% frequency stability and ultra-low power consumption are critical.

Example benefit: With the Pro Model’s expanded temperature range, you can ensure reliable operation in extreme environments like industrial automation systems. Pair its ceramic package with low power consumption to reduce cooling requirements and extend system lifespan.

Frequently asked questions

Which 28-pin DIP IC is best suited for high-density PCB assembly?
Is the ATIC64 C1’s material suitable for high-temperature environments?
Can the ATIC64 C1 be customized for specific functions?
What applications are standard for the ATIC64 C1 28-pin DIP?
How does SMT improve assembly compared to through-hole mounting?
What are the advantages of a 28-pin DIP over smaller packages?
Does the ATIC64 C1 require special handling during soldering?
How does the ATIC64 C1 compare to ceramic vs. plastic IC packages?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Industry Standard 28-Pin DIP IC	General electronics, prototyping	Plastic package, operates at -40°C to +85°C (▲ baseline), 28 pins, 150°C max junction temp	Cost-effective, widely compatible with PCBs, easy to handle manually	Limited thermal performance, bulky footprint compared to SMT alternatives
Our Base (ATIC64 C1)	Industrial control, consumer electronics	Plastic package with ▲15% enhanced thermal (▲170°C junction temp), -40°C to +105°C range	Improved reliability over Industry Standard, retains affordability	Slightly higher cost than Industry Standard, limited customization options
Our Advanced (ATIC64 C1 Advanced)	Aerospace, high-reliability systems	Ceramic package (▲▲), -55°C to +125°C range (▲▲45°C improvement), lead-free SMT, customizable pinout	Extreme thermal stability, radiation resistance, tailored for harsh environments	High cost (▲▲200% markup vs Base), requires specialized assembly tools
QFN Package IC	Mobile devices, high-density boards	Leadless, exposed thermal pad (▲30% better thermal than DIP), compact footprint	Compact design, superior thermal for dense PCBs	Difficult to solder manually, non-user-friendly for prototyping
BGA Package IC	High-pin-count devices (e.g., GPUs)	Ball grid array (▲50% smaller footprint than DIP), ultra-high pin density	Maximized space efficiency, ideal for miniaturized systems	Non-reworkable, requires automated assembly, costly for low-volume production
Ceramic DIP IC (Competitor)	Military, extreme environments	Ceramic package (▲▲), operates at -60°C to +150°C (▲▲60°C improvement)	Unmatched durability in harsh conditions, radiation tolerance	Bulky, prohibitively expensive, limited availability