(Integrated Circuits) CXD9883AM

Name: (Integrated Circuits) CXD9883AM
Brand: Shenzhen Orwintech Electronic Co., Ltd.
SKU: 62344963467_1
Price: 0.10 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Density Connectivity: Equipped with a 32-pin surface-mount technology (SMT) package, enabling seamless integration into compact electronic devices requiring multiple connections, such as microcontrollers, memory modules, and digital circuits.
Versatile Performance: Designed to handle tasks like data processing, signal conditioning, and power management, ensuring reliable functionality across diverse electronic systems.

Key features

1. Material Technology

With a corrosion-resistant metal pin design and durable plastic housing, you can ensure reliable performance in diverse electronic environments. The tin-based alloy pins enhance conductivity while resisting oxidation, outperforming lower-quality metal alternatives*.

2. Interactive Design

With a 32-pin surface-mount technology (SMT) package, you can achieve seamless integration into compact devices, offering 40% higher pin density than traditional through-hole components*. This streamlined design simplifies high-density circuit board assembly for modern electronics.

3. Performance Parameters

With high-density SMT compatibility, you can optimize space utilization on printed circuit boards (PCBs), enabling sleeker device designs compared to bulkier through-hole alternatives*. The package supports stable operation across standard voltage/current ranges for consistent functionality.

4. Scenario Solutions

With adaptability for applications ranging from consumer electronics to industrial control systems, you can deploy the CXD9883AM in scenarios requiring multi-functional connectivity, such as microcontrollers or memory modules. Its versatility matches or exceeds industry benchmarks for multi-connection ICs*.

5. Certification Standards

With compliance to industry-standard manufacturing protocols, you can ensure reliability and safety for widespread use. Specific certifications (e.g., RoHS compliance) are subject to the manufacturer’s confirmation*.

Product details

The CXD9883AM integrated circuits are high-performance 32-pin surface-mount technology (SMT) components designed for compact, reliable integration into electronic systems. Their plastic housing and metal pins ensure durability, while the SMT package enables efficient high-density assembly. Ideal for applications requiring multi-connection capabilities, these ICs balance functionality and space efficiency in consumer electronics, industrial control systems, and digital circuitry.

Technical specifications

Feature	Specification	Application Scenario
Package Type	32-pin SMT	High-density PCB assembly
Material	Plastic body, tin-silver-copper pins	Harsh environments with thermal stress
Operating Voltage	3.3V to 5V	Microcontroller interfaces
Temperature Range	-40°C to +85°C	Industrial automation systems
Certification	RoHS compliant	Global regulatory-compliant devices

Customization guide

Adjustable parameters include:

Pin configuration (within 32-pin limit) to meet specific connectivity needs.
Material finishes (e.g., gold-plated pins) for enhanced conductivity in corrosive environments.
Custom voltage tolerances for specialized power management applications.

Get inspired

With the CXD9883AM’s streamlined SMT design, you can achieve dense circuit layouts while maintaining signal integrity. Its robust materials and wide temperature range make it a versatile choice for everything from wearable tech to industrial IoT devices.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Thermal Performance	85°C max	+15% (98°C)	+30% (110°C)
Power Efficiency	Standard	Low-power mode	Ultra-low standby
Certifications	RoHS	RoHS + AEC-Q100	RoHS + MIL-STD-883

Supplier's note

Technical Breakthroughs:
- The SMT package reduces PCB space by 20% compared to through-hole alternatives.
- 32-pin configuration enables complex multi-functional circuits without compromising density.
- Tin-silver-copper pins offer 30% better conductivity than tin-lead alloys.
Optimal Version Selection:
- Base Model: Ideal for consumer electronics (e.g., smart home devices) requiring basic performance and cost efficiency.
- Advanced Model: Suitable for automotive or medical devices needing AEC-Q100-grade reliability and low power consumption.
- Pro Model: Best for industrial and aerospace applications where extreme temperatures (up to 110°C) and military-grade durability are critical. With the Pro’s MIL-STD-883 certification, you can ensure seamless operation in harsh environments like oil rigs or aerospace systems.

Frequently asked questions

Which integrated circuits are suitable for high-density PCB assemblies in consumer electronics?
How does the 32-pin SMT package of the CXD9883AM benefit electronic designs?
What materials are used in the CXD9883AM IC package, and why are they advantageous?
Is the CXD9883AM compliant with industry standards like RoHS or JEDEC?
Can the CXD9883AM be customized for specific PCB layouts or applications?
What applications is the CXD9883AM best suited for due to its voltage/current specifications?
How does the CXD9883AM ensure long-term reliability in industrial control systems?
What makes the CXD9883AM a better choice than ceramic-packaged ICs for cost-sensitive projects?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Surface-Mount Packaging	High-density PCB assembly in consumer electronics	Industry Standard: 28-pin QFN (ISO 9001) Our Base: 32-pin QFN (ISO 9001) Our Advanced: 32-pin QFN with heat slug (ISO 9001) ▲	▲ Advanced: Enhanced heat dissipation for stable performance in compact spaces	Larger footprint may require PCB redesign for legacy systems
Pin Configuration	Microcontroller or memory IC applications	Industry Standard: 24-32 pins (IEC 61187) Our Base: 32 pins (IEC 61187) Our Advanced: 32 pins with staggered layout ▲ (IEC 61187)	▲ Advanced: Optimized pin layout reduces signal interference	Requires advanced PCB design tools for full utilization
Thermal Performance	High-power industrial systems	Industry Standard: 150°C max (JEDEC JESD51-2) Our Base: 150°C ▲ Our Advanced: 170°C (JEDEC JESD51-2) ▲▲	▲▲ Advanced: Operates in extreme environments (e.g., automotive)	Base may need heatsinks for sustained high-temperature use
Voltage Range	Automotive or industrial systems	Industry Standard: 3.3V–5V (IEC 60068) Our Base: 2.5V–5.5V ▲ (IEC 60068) Our Advanced: 1.8V–5.5V ▲▲ (IEC 60068)	▲▲ Advanced: Compatible with low-power IoT and high-voltage systems	Base requires careful power management for edge cases
Material Composition	Harsh environments (chemical exposure)	Industry Standard: Plastic body + tin-lead pins (ASTM F1949) Our Base: Plastic + tin-silver-copper ▲ (ASTM F1949) Our Advanced: RoHS-compliant silver-plated ▲▲ (ASTM F1949)	▲▲ Advanced: Corrosion-resistant and fully RoHS-compliant	Base may have limited compliance with regional regulations
Functional Density	Space-constrained IoT devices	Industry Standard: 10+ integrated functions (IEC 61131) Our Base: 15 functions ▲ (IEC 61131) Our Advanced: 20+ functions ▲▲ (IEC 61131)	▲▲ Advanced: Reduces component count and board complexity	Base may require external ICs for advanced functionalities