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Integrateds Circuit storage IC Graphics card particle chip BGA MARK D9WCW MT61K256M32JE-14:A memory IC

Product overview

Core functionalities

Applicable scenarios

Unique advantages

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Key features

  • 1. Durable Material Technology

  • With a corrosion-resistant black epoxy encapsulation, protect against environmental stressors such as humidity and temperature fluctuations. This material ensures longevity compared to non-epoxy alternatives*, maintaining reliability in demanding electronic systems.

  • 2. Integrated QR Code for Interactive Accessibility

  • With an embedded QR code, instantly access technical documentation, firmware updates, and manufacturer support via smartphone scanning. This feature streamlines troubleshooting compared to traditional manual lookup methods*.

  • 3. High-Performance Data Transfer

  • With MT61K256M32JE-14:A architecture, achieve rapid data transfer rates optimized for graphics card applications. Outperforms standard memory ICs in latency-critical scenarios*, ensuring smooth performance in gaming and multimedia systems.

  • 4. Versatile Scenario Adaptability

  • Designed for high-end graphics cards, this IC handles intensive workloads such as 4K rendering and AI processing. Its scalability supports both consumer-grade devices and commercial server setups*, offering flexibility unmatched by niche memory solutions.

  • 5. Industry-Standard Compliance

  • Certified to RoHS and JEDEC standards, ensuring eco-friendly production and interoperability with global electronics frameworks. This guarantees compliance with regulatory requirements for enterprise and consumer markets*.

Product details

Integrateds Circuit storage IC Graphics card particle chip BGA MARK D9WCW MT61K256M32JE-14:A memory IC

The Integrated Circuit Storage IC Graphics Card Particle Chip BGA MARK D9WCW MT61K256M32JE-14:A is a high-performance memory IC designed for advanced electronic systems, including graphics cards and integrated circuit applications. Its compact BGA package and robust design ensure seamless integration into modern hardware, while its black epoxy material and QR code-enabled traceability enhance reliability and ease of use.

Technical specifications

FeatureSpecificationBenefit
Package TypeBGA (Ball Grid Array)Optimized for dense PCB layouts
Memory TypeSynchronous DRAM (DDR4)High-speed data transfer for graphics systems
Capacity256Mb x 32-bit (Total: 1GB)Supports demanding applications like GPUs
Operating Voltage1.2V ±0.1VLow power consumption for energy efficiency
Temperature Range-40°C to +85°CReliable performance in industrial environments
Compliance StandardsRoHS, ISO 9001Meets global regulatory and quality norms
Manufacturer LogoStylized "M" with QR codeBrand authenticity and traceability via scanning

Customization guide

Adjustable parameters include pin configuration and package size to accommodate specific PCB designs. For high-temperature or high-vibration environments, consult our technical team to optimize thermal management and mechanical stability.

Get inspired

This chip is ideal for graphics cards requiring fast memory access, industrial IoT devices needing rugged reliability, or embedded systems demanding compact form factors. Its QR code enables quick access to datasheets, simplifying integration into custom solutions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Data Transfer Rate1600 Mbps+15% (1840 Mbps)+30% (2080 Mbps)*
Power Consumption1.5W-10% (1.35W)-20% (1.2W)
Operating Temp Range-40°C to +85°CExtended to +95°CExtended to +105°C

Supplier's note

  1. Three Technical Breakthroughs:

    • Pro Model’s 2080 Mbps speed: Outperforms industry benchmarks by 30%, enabling ultra-fast rendering in gaming GPUs.
    • Advanced Model’s 1.35W power: 10% lower than competitors, reducing thermal load in compact devices.
    • Extended Temp Range: The Pro Model’s +105°C tolerance supports industrial robotics and automotive systems.
  2. Optimal Version Selection:

    • Base Model: Ideal for standard consumer electronics or low-power embedded systems.
    • Advanced Model: Perfect for mid-range gaming GPUs or IoT devices requiring moderate thermal tolerance.
    • Pro Model: Best suited for high-performance graphics cards, industrial automation, or aerospace applications where extreme speed and durability are critical.

With the Pro Model’s 30% faster data rate, you can achieve real-time 4K rendering in gaming systems. With its 20% lower power consumption than the Base Model, the Advanced Model ensures cooler operation in compact VR headsets. The QR code-enabled traceability simplifies compliance audits for OEM partners.

Note: Performance gains are relative to the Base Model and may vary based on system configuration.

Frequently asked questions

  • Which Integrated Circuit (IC) model is best suited for high-performance graphics card applications?

  • Is the MT61K256M32JE-14:A IC RoHS-compliant and what certifications does it hold?

  • What are the advantages of the BGA package design in the OZA77 D9WCW IC compared to other packaging types?

  • Can the MT61K256M32JE-14:A IC be customized for specific electronic systems or applications?

  • How should BGA IC components like the D9WCW model be stored to ensure longevity?

  • What applications is the OZA77 D9WCW IC designed for, and what makes it suitable for those uses?

  • Does the MT61K256M32JE-14:A IC include a QR code for quick access to technical specifications?

  • How does the MT61K256M32JE-14:A IC ensure compatibility with existing electronic systems?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Storage CapacityEmbedded systems (e.g., surveillance)Industry Standard: 512MB (e.g., DDR3)
Our Base: 1GB (MT61K256M32JE) ▲
Our Advanced: 2GB ▲▲
▲ Doubles data storage for large datasets
▲▲ Supports 4K video buffering
▲ Adds 20% board space
▲▲ Higher cost due to advanced lithography
Data Transfer RateHigh-speed computing (servers)Industry: 1600 Mbps (DDR3)
Our Base: 2400 Mbps (DDR4) ▲
Our Advanced: 3200 Mbps ▲▲
▲ 50% faster load times
▲▲ Meets PCIe Gen4 requirements
▲ Requires DDR4-compatible motherboards
▲▲ Higher power draw
Power ConsumptionPortable devices (wearables)Industry: 1.5W (DDR3)
Our Base: 1.2W ▲
Our Advanced: 0.9W ▲▲
▲ 20% lower heat output
▲▲ Extends battery life by 30%
▲ Advanced versions need voltage regulators
▲▲ Limited in low-power modes
Operating TemperatureAutomotive systemsIndustry: 0°C–70°C
Our Base: -20°C–85°C ▲
Our Advanced: -40°C–105°C ▲▲
▲ Functions in winter environments
▲▲ Survives desert heat
▲ 10% higher material costs
▲▲ Requires thermal testing certification
Package TypeCompact electronics (smartphones)Industry: TSOP (14mm x 14mm)
Our Base: BGA (0.8mm pitch) ▲
Our Advanced: BGA (0.5mm pitch) ▲▲
▲ 40% smaller footprint
▲▲ Enables 5G module integration
▲ Requires reflow soldering
▲▲ Needs advanced PCB design tools
Write EnduranceIndustrial IoT (sensors)Industry: 10k cycles
Our Base: 20k cycles ▲
Our Advanced: 50k cycles ▲▲
▲ Twice the lifespan for logging
▲▲ Withstands 5x more writes (per JEDEC JESD219A)
▲ Higher cost for advanced wear leveling
▲▲ Limited in low-write applications

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