Laptop CPUs | Laptops, Ultrabooks, Mobile Workstations | Power Consumption: 3W (low power for extended battery life) ▲▲ Socket Type: Socket P (backward compatible with legacy systems) | Energy efficiency ▲▲, compact design, CE certification (meets EU safety standards) | Lower performance vs desktop CPUs, limited upgradability |
Desktop CPUs | Gaming PCs, Workstations, Servers | TDP: 95W (high performance for intensive tasks) ▲▲▲ Socket Type: LGA 1151 (modular design) | Superior multitasking, overclocking capability, ECC memory support (error correction) | High power consumption, larger form factor, heat management required |
Server CPUs | Data Centers, Cloud Infrastructure | Core Count: 16 cores (parallel processing for 200+ concurrent tasks) ▲▲▲ TDP: 150W (high throughput) | ECC memory compatibility, RAS features (reliability, availability, serviceability), 30MB cache (fast data access) | High cost, requires robust cooling, not suited for consumer devices |
Mobile Processors | Smartphones, Tablets | Power Consumption: 5W (ultra-low for all-day battery life) ▲▲ Architecture: ARM (optimized for mobile efficiency) | 5nm fabrication (smaller footprint), integrated GPU, 5G compatibility | Limited multitasking, lower performance for heavy workloads |
Embedded CPUs | IoT Devices, Industrial Systems | Power Consumption: 1W (ruggedized for extreme environments) ▲ Temperature Range: -40°C to 85°C (industrial-grade) | Extended lifecycle support, low power draw, E-mark certification (EMC compliance) | Minimal processing power, limited software compatibility |
Workstation CPUs | CAD, Rendering, Scientific Computing | Core Count: 24 cores (parallel processing for complex simulations) ▲▲▲ Cache: 30MB (reduces latency) | AVX-512 instructions (advanced vector processing), PCIe 4.0 support, 4.5GHz max turbo (peak performance) | High cost, requires specialized cooling, not portable |