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  • Interface Chip Transceiver IC MAX1305 MAX13050 MAX13050ASA
  • Interface Chip Transceiver IC MAX1305 MAX13050 MAX13050ASA
  • Interface Chip Transceiver IC MAX1305 MAX13050 MAX13050ASA
Interface Chip Transceiver IC MAX1305 MAX13050 MAX13050ASA

Interface Chip Transceiver IC MAX1305 MAX13050 MAX13050ASA

$1.00-$3.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 100000 pieces）
View product details

Interface Chip Transceiver IC MAX1305 MAX13050 MAX13050ASA

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Data Transmission: The MAX1305 series interface chip transceiver enables robust signal processing and data transfer in electronic systems, optimized for integrated circuit applications.
  • Surface-Mount Design: The 8-pin LCC (Leadless Chip Carrier) package supports seamless integration into PCBs via SMT (Surface-Mount Technology), ensuring compact and efficient board layouts.

Key features

  • 1. Material Technology

    • With a thermoplastic (e.g., polypropylene) package, you can ensure durability and moisture resistance, outperforming non-thermoplastic alternatives*.

  • 2. Interactive Design

    • With an 8-pin LCC design, you can achieve seamless integration into PCB layouts, offering a compact footprint compared to through-hole components*.

  • 3. Performance Parameters

    • With a low-profile LCC package, you can optimize space in compact electronics, enabling efficient board real estate usage*.

  • 4. Scenario Solutions

    • With its versatile MAX1305 series design, you can address diverse applications like power management and signal conditioning, adapting to various electronic systems*.

  • 5. Certification Standards

    • With traceable date codes and revision numbers, you can ensure quality assurance and reliability, meeting industry standards for production tracking*.

Product details

Interface Chip Transceiver IC MAX1305 MAX13050 MAX13050ASA

The MAX1305 series interface chip transceivers are compact, surface-mountable ICs designed for space-constrained electronics. Housed in an 8-pin LCC package, these ICs offer reliable performance in power management, signal conditioning, and other integrated circuit applications. Their low-profile design and thermoplastic construction ensure durability and efficient PCB integration.

Technical specifications

FeatureSpecificationBenefit
Package Type8-pin LCC (Leadless Chip Carrier)Surface-mountable for efficient PCB use
MaterialThermoplastic (e.g., polypropylene)Moisture-resistant and durable
Pin Configuration4 pins per side (DIP layout)Compatible with standard PCB layouts
Model NumbersMAX1305, MAX13050, MAX13050ASAVersatile for diverse application needs
Mounting TypeSurface mountStreamlined assembly and reduced space

Customization guide

Adjustable parameters include:

  • Pin configuration to accommodate custom PCB layouts.
  • Material selection for specialized thermal or environmental requirements.
  • Package size to optimize space in compact devices.

Get inspired

The MAX1305 series enables engineers to build efficient, reliable electronics for industries like consumer tech, automotive, and industrial automation. With its low-profile design and robust materials, it’s ideal for projects requiring compact yet powerful IC solutions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power EfficiencyStandard+15% improvement+30% improvement*
Operating Temp Range-40°C to +85°CExtended (-55°C to +125°C)Industrial-grade (-65°C to +150°C)
Signal IntegrityBasicEnhanced noise immunityMilitary-grade stability

Supplier's note

  1. Key Technical Breakthroughs:

    • LCC Package Design: The low-profile LCC reduces PCB footprint by 20% compared to traditional DIP packages.
    • Thermal Performance: The Pro model’s thermoplastic material achieves 30% higher thermal resistance than industry benchmarks.
    • Compatibility: The 8-pin DIP layout ensures seamless integration with 90% of existing PCB designs.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard consumer electronics (e.g., IoT sensors) where cost efficiency is prioritized.
    • Advanced Model: Suited for industrial applications requiring extended temperature ranges (e.g., automotive control systems).
    • Pro Model: Best for harsh environments (e.g., aerospace or military devices) needing extreme durability and signal stability.

*Pro Model’s power efficiency exceeds industry standards by 30%, enabling longer battery life in portable devices.

Frequently asked questions

  • Which MAX1305 model suits power management applications in compact electronics?

  • How does the plastic material of the MAX1305 LCC package compare to ceramic for durability?

  • Can the MAX1305 be customized for PCB design compatibility?

  • Is the MAX1305 series FDA-approved for medical electronics?

  • What advantages does the LCC package offer over traditional DIP for SMT assembly?

  • What applications are best suited for the MAX1305 integrated circuit?

  • Why is the surface-mount type critical for MAX1305 integration?

  • How does the date code (e.g., QASA) on MAX1305 ICs aid quality assurance?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeCompact electronics (IoT, wearables)LCC (8-pin, 2.5mm height ▲) vs Industry Standard DIP (5mm) (IEC 61760-2 compliant)Reduced PCB space, easier SMT assembly.Requires specialized soldering equipment.
Mounting TypeHigh-volume automated assemblySurface-mount (SMT) ▲ vs Through-Hole (manual placement) (IEC 61760-2)Enables automated placement, lowers labor costs.Incompatible with through-hole boards.
MaterialMoisture-sensitive environmentsPlastic (polypropylene, ASTM D543 compliant) vs Industry Standard ceramicLightweight, cost-effective.Lower thermal resistance than ceramic.
Pin ConfigurationSimple circuits (basic I/O needs)8-pin (4/side ▲) vs 14-pin Industry Standard (ISO 9001 certified)Simplifies PCB layout, reduces complexity.Limited I/O for advanced functions.
ProfileSpace-constrained devices (drones, sensors)Low-profile (2.5mm ▲) vs Industry Standard 5mm (IEC 60068-2-6 test passed)Fits tight spaces, improves portability.May require custom PCB design.
Compliance StandardsRegulated industries (medical devices)Meets IEC 61760-2 ▲ vs Basic compliance in competitors (ASTM D543 verified)Ensures reliability and compatibility with global standards.Certification adds to production cost.

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