(Intergrated Circuits) LM759CP

Name: (Intergrated Circuits) LM759CP
Brand: Shenzhen Winsome Electronic Technology Co., Ltd
SKU: 1601238489595_1
Price: 0.59 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

Power Management Solutions: Designed to handle a wide range of power applications, from low-power (SOT-23) to high-power (ZIP/SIP) requirements, ensuring efficient energy distribution.
Signal Amplification with Transistor Output: Optimized for precise signal processing and amplification, leveraging transistor-based output for reliable performance in electronic circuits.

Key features

1. Advanced Material Technology for Enhanced Durability

With a corrosion-resistant metal body and heat-dissipating package design (e.g., TO-263/TO-268), the LM759CP ensures reliable performance in high-temperature environments. This material technology extends lifespan compared to plastic-based ICs*.

2. Multi-Scenario Compatibility via Modular Design

With adaptable package configurations (SOT-23 to ZIP/SIP), the LM759CP supports both low-power and high-power applications. Its modular design simplifies integration into consumer electronics and industrial systems, offering 30% faster prototyping than traditional ICs*.

3. High-Performance Output for Diverse Applications

Featuring a transistor output type with optimized voltage handling (up to 30V), the LM759CP delivers 2x higher current capacity than standard SOT-23 packages*. This ensures stable operation in motor control and power management systems.

4. Eco-Friendly Certification for Global Compliance

Certified to RoHS and REACH standards, the LM759CP uses lead-free materials and environmentally responsible manufacturing. This meets stringent regulatory requirements for global markets*.

5. Compact Footprint for Space-Constrained Designs

The SOT-23/SOT523 package reduces board space by 40% compared to legacy TO-220 designs*, enabling sleeker product designs for wearable devices and IoT hardware.

Notes:

The product’s transistor output and package versatility (e.g., SOT-23 to ZIP) were emphasized to highlight adaptability across applications.

Product details

The LM759CP is a versatile integrated circuit designed for transistor-based output applications. Its compact semiconductor packages, such as SOT-23 and SOT523, ensure efficient power management and thermal dissipation, making it ideal for low-to-medium power electronics.

Technical specifications

Feature	Specification	Application Scenario
Package Type	SOT-23, SOT523, SOT89	Compact consumer electronics, sensors
Output Type	Transistor	Signal amplification, switching circuits
Operating Temperature	-40°C to +85°C	Industrial and automotive environments
Power Handling	0.5W (Base), up to 1.2W (Pro)	Low-power IoT devices to high-stress systems

Customization guide

Adjustable package type (e.g., SOT-23 for low-power, SOT89 for medium-power) to meet specific thermal and space constraints.

Get inspired

The LM759CP’s modular design enables seamless integration into smart home systems, wearable devices, and industrial control units, ensuring reliable performance across diverse applications.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Power Handling	0.5W	+15% (0.575W)	+30% (0.65W)*
Thermal Dissipation	50°C/W	65°C/W	80°C/W
Operating Voltage	3V–5V	3V–12V	3V–24V

Supplier's note

Technical Breakthroughs:
- SOT-23 Package Efficiency: 20% smaller footprint than traditional DIP packages, enabling compact designs.
- Enhanced Thermal Performance: Pro model’s 80°C/W rating exceeds industry benchmarks by 30%, ideal for high-heat environments.
- Wide Voltage Compatibility: Advanced/Pro models support up to 24V, expanding use cases for industrial automation.
Version Selection Guide:
- Base Model: Optimal for low-power consumer devices (e.g., remote controls, sensors).
- Advanced Model: Suitable for medium-power applications requiring extended voltage ranges (e.g., robotics, HVAC systems).
- Pro Model: Designed for high-stress scenarios like automotive electronics or industrial controls, where thermal and voltage resilience are critical.

With the Pro model’s 80°C/W thermal dissipation, you can ensure stable operation in harsh environments. Pair its 24V compatibility with ruggedized materials to maximize durability.

Frequently asked questions

Which semiconductor package is best for low-power applications like wearable devices?
Is the LM759CP transistor output IC RoHS-compliant for industrial use?
What’s the difference between SOT-23 and SOT523 packages for ICs?
Can the LM759CP be customized with different semiconductor packages?
How do I prevent static damage when handling semiconductor packages like LM759CP?
Which semiconductor package suits high-power applications for automotive systems?
What temperature range does the LM759CP transistor output IC support?
Which package minimizes footprint in space-constrained PCB designs?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
SOT-23	Small consumer electronics, IoT devices	3 leads, 0.5mm² footprint (JEDEC MO-118), 0.5W max power (IEC 60747-14)	Compact design, cost-effective, ideal for low-power applications	Limited power handling (▲0.5W), minimal thermal dissipation
SOT523	Wearables, sensors	▲4 leads, ▲0.8mm², ▲1.2W (ASTM D543)	▲ Improved power capacity over SOT-23, lightweight	Slightly larger footprint, not suited for high-power loads
SOT89	Motor drivers, small appliances	▲6 leads, ▲2.5mm², ▲3W (MIL-STD-883)	▲ Handles medium-power loads, better thermal stability	Bulky compared to smaller packages, higher cost
TO263/TO268	Automotive ECUs, industrial controls	▲3 leads, ▲12mm², ▲10W (ISO 17025), thermal resistance 50°C/W (IEC 60747-15)	▲ Superior thermal dissipation, robust for harsh environments	Bulky, heavier, requires more board space
ZIP	High-power LED drivers, power supplies	▲8 leads, ▲25mm², ▲25W (UL 1950), thermal resistance 20°C/W (IEC 60747-16)	▲ Highest power capacity in compact form, excellent thermal performance	Costly, complex assembly, limited flexibility in design
SIP	Server power modules, high-current apps	▲12 leads, ▲40mm², ▲50W (IEC 61760), thermal resistance 10°C/W (ISO 17025)	▲ Ultimate power handling and thermal efficiency, scalable for high loads	Most expensive, largest footprint, requires specialized mounting