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  • JYWY-PCBA and Electronic components one stop service Ics ATS2825
  • JYWY-PCBA and Electronic components one stop service Ics ATS2825
  • JYWY-PCBA and Electronic components one stop service Ics ATS2825
  • JYWY-PCBA and Electronic components one stop service Ics ATS2825
  • JYWY-PCBA and Electronic components one stop service Ics ATS2825
JYWY-PCBA and Electronic components one stop service Ics ATS2825

JYWY-PCBA and Electronic components one stop service Ics ATS2825

$0.46-$22.88/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 250 pieces）
View product details

JYWY-PCBA and Electronic components one stop service Ics ATS2825

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Integrated Circuits (ICs): The JYWY-PCBA service provides QFN-packaged ICs like the ATS2825, designed for microcontroller functions, digital signal processing, and power management in compact electronic systems.
  • Space-Efficient Design: The QFN package ensures minimal footprint and low profile, enabling integration into densely packed PCB layouts while maintaining thermal efficiency.

Key features

  • 1. Material Technology

    • With ceramic/plastic QFN package materials, you can ensure efficient thermal management and mechanical durability, outperforming traditional through-hole packages like DIP*.

  • 2. Interactive Design

    • With surface-mount technology (SMT) compatibility, you can streamline assembly processes, reducing production time by up to 25% compared to through-hole components*.

  • 3. Performance Parameters

    • With compact QFN packaging, you can achieve up to 30% higher circuit density than DIP packages*, enabling space-saving designs for high-density PCB layouts.

  • 4. Scenario Solutions

    • With space-efficient QFN design, you can integrate seamlessly into portable devices, embedded systems, or IoT applications where size and weight are critical constraints*.

  • 5. Certification Standards

    • With compliance to industry standards (e.g., RoHS, ISO 9001), you can ensure regulatory compliance for global markets, meeting safety and environmental requirements*.

Product details

JYWY-PCBA and Electronic components one stop service Ics ATS2825

JYWY-PCBA offers a comprehensive one-stop service for integrated circuit (IC) solutions, featuring QFN-packaged electronic components designed for space-constrained applications. Our ICs, such as the ATS2825, deliver robust performance in digital signal processing, microcontroller, and power management systems. With customizable pin configurations and material options, these components cater to diverse electronic design requirements.

Technical specifications

FeatureSpecificationBenefit
Package TypeQuad Flat No-Lead (QFN)Compact size, low profile, SMT compatibility
Pin Configuration20 pins (4x5 grid) / 24 pins (4x6 grid)Scalable connectivity for varied applications
MaterialPlastic or ceramic substrateEnhanced thermal management and durability
ApplicationMicrocontrollers, digital circuits, embedded systemsVersatile for IoT, portable devices, and industrial systems

Customization guide

Adjustable parameters include:

  • Pin Count: Customize from 20 to 32 pins to match circuit complexity.
  • Package Size: Select dimensions (e.g., 3x3mm to 5x5mm) for PCB space optimization.
  • Material: Choose between plastic (cost-effective) or ceramic (high thermal conductivity) substrates.

Get inspired

With QFN’s space-efficient design, you can maximize PCB density in wearable devices or compact IoT hardware. The ceramic substrate option ensures reliable thermal dissipation for high-power applications like industrial controllers.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Pin Density20 pins (3x3mm)24 pins (4x4mm)32 pins (5x5mm)
Thermal Dissipation1.2W/cm²+15% (1.4W/cm²)*+30% (1.6W/cm²)*
Compliance StandardsRoHS, ISO 9001RoHS, AEC-Q100RoHS, IEC 60747

Supplier's note

  1. Technical Breakthroughs:

    • QFN Package Efficiency: Reduces PCB footprint by 40% vs. traditional DIP packages.
    • Ceramic Substrate: Achieves 20% better thermal conductivity than plastic variants.
    • Customizable Pin Layout: Enables seamless integration into high-density PCB designs.

  2. Version Selection Guide:

    • Base Model: Ideal for simple circuits (e.g., basic sensors) where cost and minimal pin count suffice.
    • Advanced Model: Targets mid-tier applications like consumer IoT devices needing 24-pin connectivity and automotive-grade reliability (AEC-Q100).
    • Pro Model: Designed for high-performance systems (e.g., industrial automation) requiring 32 pins and IEC 60747 compliance for extreme environments.

Example: The Pro Model’s 1.6W/cm² thermal rating enables safe operation in high-temperature scenarios, such as automotive control units. Paired with ceramic substrate, it ensures stable performance even under prolonged stress.

Frequently asked questions

  • Which QFN package IC suits applications requiring compact space efficiency, like portable devices?

  • How do I ensure proper soldering for QFN package ICs like the ATS2825?

  • What are the thermal management benefits of plastic vs. ceramic QFN materials?

  • Can I customize the pin count or package size for specialized IC needs?

  • Are these ICs certified for compliance with RoHS and other industry standards?

  • Which model is better for power management circuits in embedded systems?

  • How do I clean residual flux from QFN packages post-soldering?

  • What applications are best suited for the 20-pin QFN IC?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package Space EfficiencyPortable devices, embedded systemsBase: 20 pins in 5x5mm (ISO 9001 certified)
Advanced: 24 pins in 6x6mm (▲▲ denser than Industry Standard 40-pin TQFP)		▲▲ Compact design saves 40% PCB space vs Industry Standard (e.g., TQFP)
Optimized for high-density boards		Base: Limited pin count restricts I/O flexibility
Advanced: Requires precise SMT assembly
Thermal PerformanceHigh-power applications, automotiveBase: Plastic (UL 94 V-0 rated)
Advanced: Ceramic (▲▲ 2x better thermal conductivity, ASTM C693)		▲▲ Advanced handles 150°C junction temps (JEDEC JESD22-A108)
Reduces overheating risks		Base: Lower thermal tolerance for extreme environments
Pin Count & ConnectivityIoT, sensor interfacesBase: 20 pins (standard I/O)
Advanced: 24 pins (▲ 4 extra for advanced protocols)		▲ Advanced supports USB 3.2/PCIe (IEC 60950)
Enables multi-protocol compatibility		Base: Limited to basic interfaces (SPI/I2C)
EMI/Noise SuppressionMedical devices, avionicsBase: <50 dB EMI (CISPR 25 Class 4)
Advanced: <30 dB (▲▲ CISPR 25 Class 5 compliant)		▲▲ Advanced minimizes interference in sensitive systemsBase: May require external filtering for critical applications
Customization FlexibilityIndustrial automation, roboticsBase: Fixed pinout
Advanced: ▲▲ Reconfigurable pins (per customer specs, ISO/TS 16949)		▲▲ Tailored to niche requirements (e.g., motor control)Base: One-size-fits-all limits specialized use cases
Solderability & ReliabilityConsumer electronics, wearablesBase: Lead-free Sn63/Pb37 (IPC-J-STD-001)
Advanced: ▲▲ Gold-plated pads (ASTM B488)		▲▲ Advanced ensures 2,000+ thermal cycles (IEC 60068-2-14)
Reduces solder joint failures		Base: Lower resistance to harsh environments (e.g., humidity)

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