Reverse Voltage Rating | Power supplies, voltage regulation | Industry Standard: 100V (IEC 60747-2) Our Base: 50V Our Advanced: 200V▲▲▲ | Advanced: Handles higher voltages for industrial applications. Base: Cost-effective for low-voltage circuits. | Base: Limited to low-power systems. Advanced: Larger package may reduce PCB space efficiency. |
Forward Current | LED drivers, signal rectification | Industry Standard: 1A (JEDEC JESD 22-A108) Our Base: 1A Our Advanced: 3A▲▲ | Advanced: Supports high-current loads in motor control. Base: Suitable for consumer electronics. | Advanced: Higher thermal dissipation requirements. Base: May overheat in high-load scenarios. |
Package Size | Compact devices (smartphones, IoT) | Industry Standard: 3.9×1.7mm (SOD-123) Our Base: 3.9×1.7mm Our Advanced: 5×3mm▲ | Base: Optimized for space-constrained PCBs. Advanced: Robust for industrial environments. | Advanced: Larger footprint limits miniaturization. Base: Less durable under mechanical stress. |
Operating Temperature | Automotive, industrial systems | Industry Standard: -55°C to +150°C (AEC-Q101) Our Base: -40°C to +125°C Our Advanced: -65°C to +175°C▲▲ | Advanced: Withstands extreme environments (e.g., engine control units). Base: Adequate for consumer-grade use. | Base: Risk of failure in high-temperature industrial settings. Advanced: Higher cost due to specialized materials. |
Reverse Recovery Time | High-frequency circuits (switching power) | Industry Standard: 50ns (JEDEC JESD 22-2002) Our Base: 80ns Our Advanced: 25ns▲▲▲ | Advanced: Reduces switching losses in fast-switching applications. Base: Slower recovery for low-frequency uses. | Base: Inefficient in high-frequency inverters. Advanced: Requires precise timing control. |
Thermal Resistance | Heat-sensitive applications (laptops) | Industry Standard: 120°C/W (JEDEC JESD 51-1) Our Base: 150°C/W Our Advanced: 80°C/W▲▲ | Advanced: Faster heat dissipation for stable operation. Base: Sufficient for low-power devices. | Base: Risk of thermal runaway in high-power setups. Advanced: Complex heat-sink design needed. |