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  • Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC
  • Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC
  • Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC
  • Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC
  • Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC
  • Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC
Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC

Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC

$5.11-$8.39/ Piece|100 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 99999 pieces）
View product details

Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • 4-Port USB 3.1 Hub: Supports SuperSpeed data transfer rates of up to 5 Gbps, enabling high-performance connectivity for peripherals like external drives, cameras, and gaming devices.
  • Dual USB Compatibility: Backward-compatible with USB 2.0 and USB 3.0 standards, ensuring seamless integration with existing devices.
  • 3.3V Operation: Designed for low-power applications, ideal for battery-operated or energy-efficient systems.

Key features

  • 1. Material Technology

    • With Texas Instruments' 64-VQFN package technology, integrate the IC into compact electronics while ensuring robust operation across 0°C to 70°C environments*

  • 2. Interactive Design

    • With a 4-port USB 3.1 hub design, connect and manage multiple high-speed peripherals simultaneously, enhancing multi-device workflow efficiency*

  • 3. Performance Parameters

    • With 5-Gbps SuperSpeed USB 3.1 support, transfer files up to 10x faster than USB 2.0*

  • 4. Scenario Solutions

    • Optimized for both consumer devices (e.g., PCs) and commercial systems (e.g., servers), ensuring reliable operation in diverse environments*

  • 5. Certification Standards

    • Engineered to meet USB-IF certification standards, ensuring seamless interoperability with certified USB devices*

Product details

Jeking USB Interface IC 4-port SuperSpeed 5-Gbps USB 3.1 hub 64-VQFN 0 to 70 TUSB8041ARGC

The Jeking USB Interface IC (TUSB8041ARGC) is a 4-port SuperSpeed USB 3.1 hub supporting 5-Gbps data transfer in a compact 64-VQFN package. Designed for surface-mount technology (SMT), this Texas Instruments IC operates at 3.3V and withstands temperatures from 0°C to 70°C, ensuring reliability in consumer electronics and industrial applications.

Technical specifications

FeatureSpecificationBenefit
Interface SupportUSB 2.0 / USB 3.1 (5 Gbps)Backward-compatible, high-speed data transfer
Voltage3.3V supplyEnsures compatibility with low-power systems
Package Type64-VQFNCompact, SMT-friendly design for mass production
Operating Temp0°C to 70°CStable performance in diverse environments
ManufacturerTexas Instruments (TI)Trusted quality and long-term reliability

Customization guide

Adjustable voltage tolerance parameters to meet specialized power requirements. Custom pin configurations available for tailored interface compatibility.

Get inspired

With 5-Gbps transfer speeds, you can streamline large-file transfers in consumer devices. Its low-power design ensures efficient operation in battery-powered systems like smartphones or IoT gadgets.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Data Rate5 Gbps5 Gbps (optimized)5 Gbps (low-latency)
Power ConsumptionStandard-20% vs. industry-30% vs. industry
Thermal PerformanceBaseline+15% efficiency+30% efficiency*

Supplier's note

  1. Technical Breakthroughs:

    • High-Speed USB Support: Dual USB 2.0/3.1 compatibility enables seamless integration across legacy and modern systems.
    • Low-Power Design: 20% lower power consumption than traditional hubs reduces heat and extends battery life.
    • SMT Integration: The 64-VQFN package simplifies automated assembly, cutting production costs by 15%.

  2. Version Selection Guide:

    • Base Model: Ideal for standard consumer devices (e.g., keyboards, docks) requiring basic USB 3.1 functionality.
    • Advanced Model: Choose for IoT or medical devices needing energy efficiency (-20% power) without compromising speed.
    • Pro Model: Best for industrial automation or high-throughput systems (e.g., servers) where thermal stability (+30% efficiency) and low latency are critical.

*Pro Model’s thermal performance exceeds industry benchmarks by 30%, enabling continuous operation in harsh environments.

Frequently asked questions

  • Which USB controller IC suits high-speed data transfer in portable devices?

  • How to ensure proper cooling for the TUSB8041ARGC in space-constrained electronics?

  • Is the TUSB8041ARGC USB 3.1 compliant and RoHS certified?

  • Can the TUSB8041ARGC be customized for specific voltage or pin configurations?

  • What voltage range does the Jeking USB IC support for stable operation?

  • Which electronic devices are compatible with the 4-port SuperSpeed USB 3.1 hub?

  • Does the TUSB8041ARGC support simultaneous data transfer across all 4 ports?

  • How easy is it to integrate the 64-VQFN package into circuit boards?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
High-Speed USB SupportData-intensive devices5 Gbps (USB 3.1 Gen 1)▲
Backward compatible		Fast transfers, wide compatibilityRequires USB 3.0/3.1 ports/cables
Power EfficiencyPortable electronics<100 mW (USB 3.0 power specs)▲Low power draw, cooler operationLimited for high-power peripherals
Package Type (64-VQFN)Compact devices64-pin VQFN (small footprint)▲Space-saving, easy SMT assemblyNeeds precise soldering equipment
Voltage Compatibility3.3V systems3.3V supply voltage▲Matches common logic levelsIncompatible with 5V systems without conversion
Operating TemperatureStandard environments0°C to 70°C▲Reliable in typical conditionsNot suitable for extreme temps
Integration EaseMass-produced electronicsSurface-mount design▲Cost-effective in mass productionRequires automated assembly lines

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