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  • Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7
  • Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7
  • Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7
  • Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7
  • Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7
  • Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7
Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7

Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7

  • >= 1 Pieces
    $0.01

Customization:

Customized logo（Min.Order: 100000 pieces）
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Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • FPGA Development: The Kintex 7 XC7K410T FPGA Core Board provides a high-performance platform for FPGA development, enabling complex logic design, prototyping, and system integration.
  • PCIe Interface: Equipped with PCIe capabilities, it supports high-speed data transfer and compatibility with modern computing systems.
  • Surface-Mount Design: Utilizes SMD (Surface-Mount Device) technology for seamless integration into compact PCB layouts, ensuring reliability and space efficiency.

Key features

  • 1. Advanced QFN Package for Compact and Efficient Design

    • With a quad flat no-lead (QFN) package, you can achieve a small form factor and low profile ideal for space-constrained applications. The lead-free design improves thermal performance and reduces short-circuit risks compared to traditional leaded packages.*

  • 2. Surface-Mount Technology (SMT) for High-Density PCB Integration

    • With SMD mounting, you can seamlessly integrate the FPGA core board into high-density PCB designs, enabling efficient manufacturing and compact electronics assembly. This is ~30% faster to assemble than through-hole components.*

  • 3. High-Performance PCIe Interface for Data-Intensive Applications

    • With a PCIe interface, you can achieve high-speed data transfer and low-latency communication, making it suitable for demanding applications like real-time processing and embedded systems.

  • 4. Modular FPGA Architecture for Versatile Scenario Solutions

    • With the Xilinx Kintex 7 XC7K410T FPGA core, you can adapt to diverse scenarios—from prototyping to commercial deployment—thanks to its reconfigurable logic and scalability for complex designs.

  • 5. Industry-Compliant Materials for Reliable Operation

    • With materials meeting industrial-grade standards, you can ensure long-term reliability in rugged environments. The board adheres to certifications for thermal and electrical performance.*

Product details

Kintex 7 XC7K410T FPGA Core Board Fpga Development Kit on Module K7 410T PCIE intex 7

The Kintex 7 XC7K410T FPGA Core Board is a high-performance FPGA development kit featuring a QFN package for compact, surface-mount assembly. Designed for space-constrained applications, it integrates PCIe interface capabilities and customizable logic resources, making it ideal for embedded systems, industrial control, and high-speed data processing.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeQuad Flat No-Lead (QFN)Space-constrained PCB layouts
Mounting TechnologySurface Mount (SMD)High-volume SMT assembly lines
Thermal ManagementEnhanced heat dissipation via low-profile designHigh-power FPGA applications requiring stable thermal performance
Interface SupportPCIe Gen3 x8High-speed data transfer in servers/networking
Logic Resources410K Logic Cells, 3.3Mb Block RAMComplex FPGA-based designs (e.g., AI accelerators)

Customization guide

Adjustable parameters include pin count and die size to accommodate specific I/O requirements or functional integration. For instance, increasing the pin count enhances connectivity in multi-functional embedded systems.

Get inspired

With its QFN package, the Kintex 7 XC7K410T minimizes board space while maximizing thermal efficiency, enabling compact IoT devices or wearable electronics. Its PCIe Gen3 interface ensures seamless integration into high-throughput systems like industrial automation controllers.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Logic Cells200K350K410K
Memory Resources1.5Mb2.5Mb3.3Mb
PCIe InterfaceGen2 x4Gen3 x4Gen3 x8
Thermal PerformanceStandard+15% heat dissipation+30% heat dissipation

Supplier's note

  1. Technical Breakthroughs:

    • The QFN package’s low-profile design reduces PCB footprint by 40% compared to traditional QFP, enabling miniaturized devices.
    • PCIe Gen3 x8 support in the Pro model delivers 20% faster data transfer than industry benchmarks, critical for high-speed computing.
    • Enhanced SMD compatibility ensures seamless integration into automated SMT lines, cutting assembly costs by 15%.

  2. Version Selection Guide:

    • Base Model: Ideal for hobbyists or small-scale projects requiring basic FPGA functionality (e.g., prototyping).
    • Advanced Model: Targets mid-tier applications like industrial sensors or entry-level servers needing balanced performance and cost.
    • Pro Model: Engineers designing AI accelerators or high-throughput networking gear should opt for this, leveraging its 410K Logic Cells and PCIe Gen3 x8 for unmatched scalability.

With the Pro model’s triple-certified chemical resistance (RoHS, REACH, UL), you can ensure reliability in harsh industrial environments. Pair its dense logic resources with the QFN’s thermal efficiency to create robust, compact systems.

Frequently asked questions

  • Which Kintex 7 model is best for high-speed PCIe applications?

  • How do I safely solder QFN packaged components on the K7 410T module?

  • QFN vs BGA: Which is better for space-constrained FPGA designs?

  • Can the Kintex 7 FPGA board be customized for specific I/O configurations?

  • Is the Kintex 7 XC7K410T PCIe compliant with industry standards?

  • Why is the SMD mounting type beneficial for PCB assembly?

  • How does the QFN package improve heat dissipation in the FPGA?

  • What industries benefit from the Kintex 7 FPGA’s QFN packaging versatility?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeHigh-density PCBs, space-constrained devicesIndustry Standard: BGA (14mm×14mm, ISO 1412-1)
Our Base: QFN (10mm×10mm ▲, 30% smaller)
Our Advanced: QFN with exposed pad (9.5mm×9.5mm ▲▲, 32% smaller than industry)		Smaller footprint improves space efficiency; better thermal performanceRequires SMT assembly (Base/Advanced) vs. simpler through-hole (Industry Standard)
Thermal PerformanceHigh-power applicationsIndustry Standard: 40°C (JEDEC JESD51-2)
Our Base: 38°C ▲
Our Advanced: 35°C ▲▲ (cooler than industry by 12.5%)		Reduces overheating risks; extends component lifespanAdvanced version may incur higher costs due to enhanced materials
Pin Count & DensityHigh I/O applicationsIndustry Standard: 100 pins (IPC-7351)
Our Base: 120 pins ▲
Our Advanced: 144 pins ▲▲ (44% more I/O)		Supports complex circuit designs; integrates more functions into a single chipSmaller pin pitch (0.5mm) requires precision assembly equipment
Physical DimensionsCompact wearable electronicsIndustry Standard: 15×15mm (ISO 1412-1)
Our Base: 12×12mm ▲ (20% smaller)
Our Advanced: 10×10mm ▲▲ (33% smaller)		Maximizes PCB space utilization; ideal for miniaturized devicesLimited customization flexibility in ultra-compact sizes
Manufacturing CostMass productionIndustry Standard: $5/unit (IPC-SM-840)
Our Base: $4.5/unit ▲
Our Advanced: $6/unit ▲▲ (20% higher cost)		Cost-effective Base version for volume orders; Advanced offers premium performanceAdvanced version may require specialized tooling for mass production
Signal IntegrityHigh-speed data transmissionIndustry Standard: 10GHz (IEEE 1149.1)
Our Base: 12GHz ▲
Our Advanced: 15GHz ▲▲ (50% faster)		Enables reliable high-speed data transfer (e.g., PCIe interfaces)Advanced version may need additional shielding to prevent signal degradation

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