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  • LCD Screen Chip TL2322ML-C TL2322ML
  • LCD Screen Chip TL2322ML-C TL2322ML
  • LCD Screen Chip TL2322ML-C TL2322ML
  • LCD Screen Chip TL2322ML-C TL2322ML
  • LCD Screen Chip TL2322ML-C TL2322ML
  • LCD Screen Chip TL2322ML-C TL2322ML
LCD Screen Chip TL2322ML-C TL2322ML

LCD Screen Chip TL2322ML-C TL2322ML

$0.50-$2.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Packing（Min.Order: 5000 pieces）
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LCD Screen Chip TL2322ML-C TL2322ML

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • LCD Panel Drive: Drives LCD screens with high clarity and low power consumption, optimized for embedded systems and electronic devices.
  • Embedded Processing: Integrates a central processing unit (CPU), memory, and input/output (I/O) interfaces for data processing, communication, and control functions.
  • Customizable Firmware: Supports firmware programming to tailor functionality for specific applications, enabling adaptive performance in diverse scenarios.

Key features

  • 1. Material Technology

    • With semiconductor-grade silicon construction and QFN surface-mount packaging, ensure robust performance and easy integration into compact electronic devices.

  • 2. Interactive Design

    • With programmable firmware capabilities, customize functionalities to meet specific application requirements, offering unmatched flexibility compared to non-programmable ICs*.

  • 3. Performance Parameters

    • With optimized power efficiency, reduce energy consumption by up to 20% in battery-operated devices* [*Disclaimer: Based on internal testing; actual results may vary].

  • 4. Scenario Solutions

    • With multi-application adaptability, deploy seamlessly in both simple control systems and complex embedded systems, addressing diverse electronic needs.

  • 5. Certification Standards

    • With reliability standards inherent to QFN packaging, ensure long-term durability and performance in demanding environments, surpassing traditional leaded package designs*.

Product details

LCD Screen Chip TL2322ML-C TL2322ML

The LCD Screen Chip TL2322ML-C/T2322ML is a high-performance integrated circuit (IC) designed for embedded systems and electronic devices. Built with semiconductor-grade silicon and housed in a quad flat no-lead (QFN) package, it offers robust power efficiency, customizable firmware, and reliable performance. Its surface-mount design (SMD) ensures seamless integration into compact PCB layouts, making it ideal for battery-powered and space-constrained applications.

Technical specifications

FeatureSpecificationBenefit
Package TypeQFN (Quad Flat No-Lead)Enhanced thermal performance and reliability
Mounting MethodSurface-Mount (SMD)Easy PCB integration and miniaturization
MaterialSemiconductor SiliconHigh conductivity and durability
Power EfficiencyLow-power design (≤100mW)Prolongs battery life in IoT devices
CustomizationFirmware-programmableTailor functionality for specific use cases
Operating Temp.-40°C to +85°CReliable performance in extreme environments

Customization guide

Adjust firmware parameters to optimize power consumption (e.g., low-power modes for wearables) or I/O configurations (e.g., GPIO pin assignments for sensor integration).

Get inspired

Ideal for smart home devices, wearable tech, industrial control systems, and battery-operated gadgets. With its QFN package and SMD compatibility, it enables sleek, compact designs while maintaining robust performance.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed100MHz+15% (115MHz)+30% (130MHz)*
Memory Capacity16KB Flash32KB Flash64KB Flash
I/O Interfaces8 GPIO12 GPIO16 GPIO
Power Consumption100mW-15% (85mW)-30% (70mW)

Supplier's note

  1. Key Technical Breakthroughs:

    • QFN Package: Reduces thermal resistance by 20% compared to traditional QFP packages, enabling stable operation in high-heat environments.
    • Ultra-Low Power Mode: Consumes 30% less power than industry benchmarks in standby, extending battery life in IoT sensors.
    • Firmware Flexibility: Allows real-time updates, reducing downtime for firmware upgrades in industrial systems.

  2. Optimal Version Selection:

    • Base Model: Suitable for basic control systems (e.g., LED panels) where cost-efficiency is prioritized.
    • Advanced Model: Ideal for mid-tier applications like smart home hubs, leveraging 15% faster processing for multi-tasking.
    • Pro Model: Designed for high-performance needs (e.g., industrial automation), with triple the GPIO count and 30% lower power draw than competitors.

Example: The Pro version’s 130MHz processing speed and 64KB memory enable real-time data processing in factory automation systems. Paired with its QFN thermal efficiency, it ensures uninterrupted operation even under heavy workloads.

Frequently asked questions

  • Which LCD screen chip model is best suited for battery-operated devices?

  • How do I handle SMD-mounted TL2322ML chips during PCB assembly?

  • Why is silicon the preferred material for LCD driver chips like the TL2322ML?

  • Can the TL2322ML be customized for specific embedded system needs?

  • Is the TL2322ML-C TL2322ML compliant with industry safety standards?

  • What applications are the TL2322ML chips commonly used for?

  • How does the QFN package improve the TL2322ML’s reliability?

  • Does the TL2322ML reduce power consumption in always-on displays?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package Type (QFN vs Others)High-density PCB layouts, compact devices- Industry Standard: QFP (Quad Flat Package) with leads
- Our Base/Advanced: QFN (no leads, smaller footprint)
▲ 20% size reduction vs QFP		Smaller footprint, better thermal performance, space-saving designRequires precise soldering; less visible for manual inspection (▲ icon shows size improvement)
Power EfficiencyBattery-operated devices, IoT sensors- Industry Standard: 1.5W (typical)
- Our Base: 1.2W (▲20% improvement)
- Our Advanced: 1.0W (▲33% improvement)
(Lower than 1.5W industry avg)		Extended battery life, reduced heat generation, cost-effective energy useAdvanced versions may require specialized cooling in extreme scenarios (▲ icons show incremental efficiency gains)
Functional IntegrationEmbedded systems, multifunction devices- Industry Standard: Dedicated ICs for CPU/memory/I/O
- Our Base: Integrated CPU + 8MB memory + basic I/O
- Our Advanced: Enhanced CPU + 16MB memory + USB/CAN I/O
(Supports complex tasks without external chips)		Simplified design, reduced component count, faster prototypingAdvanced features may require advanced firmware expertise (▲ icon highlights expanded capabilities)
Customization FlexibilityCustom electronics, R&D projects- Industry Standard: Limited firmware options
- Our Base: Programmable via standard IDEs
- Our Advanced: Full SDK/API access + customizable firmware
(Supports tailored solutions)		Tailored performance for niche applications, faster time-to-marketAdvanced customization demands higher engineering skill (▲ icon denotes enhanced programmability)
Thermal PerformanceIndustrial machinery, automotive systems- Industry Standard: 85°C max operating temp
- Our Base: 105°C (▲24% improvement)
- Our Advanced: 125°C (▲47% improvement)
(Outperforms industrial-grade rivals)		Reliable in harsh environments, longer lifespan under stressAdvanced versions may incur higher costs (▲ icons show thermal tolerance jumps)
EMI Noise LevelSensitive electronic systems- Industry Standard: 45 dB EMI
- Our Base: 40 dB (▲11% quieter)
- Our Advanced: 35 dB (▲22% quieter)
(Quieter than a whisper at 1m)		Reduced interference with other components, smoother signal transmissionAdvanced versions may require additional shielding (▲ icons indicate noise reduction tiers)

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