Surface Finish | Consumer electronics, budget devices | Industry Standard: ENIG (3µm Ni/0.07µm Au) Our Base: Lead-free HASL (ASTM F1989) Our Advanced: Immersion Tin (5µm) ▲▲ | Base: Cost-effective, wide compatibility. Advanced: Superior solderability for fine-pitch components (e.g., 0.5mm pitch ICs) | Base: Slightly rougher surface for high-density boards. Advanced: 15% higher cost vs Base |
Material Thickness | Portable devices, wearable tech | Industry Standard: 1.6mm FR-4 (ISO 178 flexural strength 180MPa) Our Base: 1.6mm FR-4 ▲ Our Advanced: 1.0mm FR-4 ▲▲ | Advanced: 37% thinner for compact designs (e.g., fits in 10mm-thick enclosures) | Advanced: Requires stricter manufacturing tolerances (+5% cost) |
Noise Level | Office, educational settings | Industry Standard: 40 dBA (equivalent to quiet library) Our Base: 38 dBA ▲ Our Advanced: 35 dBA (quieter than a whisper) ▲▲ | Advanced: Ideal for noise-sensitive environments (e.g., hospitals) | Base/Advanced: Slight reduction in power efficiency due to noise-dampening components |
Component Tolerance | Precision devices (e.g., drawing tablets) | Industry Standard: 5% tolerance resistors/capacitors Our Base: 5% ▲ Our Advanced: 1% tolerance ▲▲ | Advanced: 80% lower error margin for color accuracy in LCD displays | Advanced: 25% higher BOM cost vs Base |
Connectivity Options | IoT integration, smart home systems | Industry Standard: USB 2.0 only Our Base: USB 2.0 + Bluetooth 5.0 ▲ Our Advanced: USB-C + Bluetooth 5.3 + Wi-Fi 6 ▲▲ | Advanced: Supports wireless file transfers (up to 921 Mbps) | Base/Advanced: Requires firmware updates for compatibility with legacy systems |
Physical Dimensions | Handheld gadgets, children’s devices | Industry Standard: 100x100mm PCB Our Base: 95x95mm ▲ Our Advanced: 85x85mm (fits in A5-sized tablets) ▲▲ | Advanced: 25% smaller footprint for portable use (e.g., children’s writing pads) | Advanced: Limited space for future component upgrades |