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  • AAT1176B LCD Screen Chip IC Electronic Components AAT1176
  • AAT1176B LCD Screen Chip IC Electronic Components AAT1176
  • AAT1176B LCD Screen Chip IC Electronic Components AAT1176
  • AAT1176B LCD Screen Chip IC Electronic Components AAT1176
  • AAT1176B LCD Screen Chip IC Electronic Components AAT1176
  • AAT1176B LCD Screen Chip IC Electronic Components AAT1176
AAT1176B LCD Screen Chip IC Electronic Components AAT1176

AAT1176B LCD Screen Chip IC Electronic Components AAT1176

$0.40-$1.20/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 50000 pieces）
View product details

AAT1176B LCD Screen Chip IC Electronic Components AAT1176

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • LCD Panel Drive: The AAT1176B LCD Screen Chip IC is designed to power and control liquid crystal display (LCD) panels, enabling high-resolution image rendering and backlight management.
  • Integrated Circuit (IC) Performance: Optimized for surface mount technology (SMT), this IC integrates advanced driver circuits to ensure stable operation in compact electronic assemblies.

Key features

  • 1. Advanced Material Technology

    • With a ceramic substrate and metal lid in the QFN package, ensure efficient heat dissipation for high-performance applications*

  • 2. Surface Mount Compatibility

    • With surface mount technology (SMT), enable seamless integration into automated manufacturing processes*

  • 3. Enhanced Thermal Performance

    • With optimized thermal conductivity, support continuous operation in demanding environments like automotive systems*

  • 4. Space-Saving Design

    • With a leadless QFN package, fit into compact devices such as portable electronics and medical equipment*

  • 5. Customizable Functionalities

    • With programmable ICs and microcontrollers, adapt to diverse applications like industrial control and consumer electronics*

Product details

AAT1176B LCD Screen Chip IC Electronic Components AAT1176

The AAT1176B LCD Screen Chip IC is a high-performance integrated circuit designed for precision applications in electronic systems. Its QFN (Quad Flat No-Lead) package with a ceramic substrate and metal lid ensures superior thermal management and space efficiency, making it ideal for LCD screens, automotive electronics, and industrial control systems.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeQFN (Quad Flat No-Lead)Space-constrained environments
MaterialCeramic substrate with metal lidHigh-heat applications (e.g., automotive)
Mounting TypeSurface Mount Technology (SMT)Automated manufacturing assembly lines
Thermal ConductivityHigh thermal conductivity (ceramic substrate)Heat-sensitive components
Space EfficiencyLeadless design, compact footprintPortable devices and embedded systems

Customization guide

Adjustable parameters include operating voltage range and frequency tolerance to meet specific power requirements or environmental conditions. For specialized applications, the IC can be customized with memory configurations or microcontroller architectures (e.g., ARM-based) to enhance functionality.

Get inspired

With its QFN package and ceramic substrate, the AAT1176B delivers reliable performance in compact, high-heat environments. Ideal for LCD screens in wearable devices or automotive dashboards, this IC combines precision with durability for modern electronics.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal PerformanceStandard+15%+30%*
Space EfficiencyCompact20% smaller30% smaller
Operating Temp Range-40°C to +85°C-45°C to +90°C-50°C to +105°C
Memory Capacity16MB32MB64MB

Supplier's note

  1. Three Technical Breakthroughs:

    • Ceramic Substrate: Enables 30% better thermal conductivity than traditional plastic packages, critical for high-power applications.
    • Leadless Design: Reduces footprint by 25% compared to TQFP packages, ideal for miniaturized devices.
    • SMT Compatibility: Streamlines automated assembly, reducing production costs by 15% versus through-hole alternatives.

  2. Version Selection Guidance:

    • Pro Model: Engineers working in harsh environments (e.g., automotive, aerospace) benefit from its expanded temperature range and triple-industry-standard chemical resistance.
    • Advanced Model: Best for mid-tier applications like consumer electronics, balancing cost and performance.
    • Base Model: Suitable for basic LCD screen control in cost-sensitive projects.

*Pro Model’s thermal performance exceeds industry benchmarks by 30%, ensuring stable operation in extreme conditions.

Frequently asked questions

  • Which AAT1176B model is best suited for space-constrained portable devices?

  • How do I ensure proper thermal management for the AAT1176B in high-heat environments?

  • What materials make the AAT1176B suitable for high-reliability applications?

  • Can the AAT1176B be customized for specific microcontroller functions?

  • Is the AAT1176B RoHS-compliant and certified for medical devices?

  • How do I clean and store the AAT1176B to prevent damage?

  • Why choose the AAT1176B over traditional DIP packages for LCD screens?

  • Does the AAT1176B support high-speed data processing for industrial systems?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeCompact devices, high-density boardsQFN (5x5mm) ▲▲ (40% smaller than DIP) vs Industry DIP (14x14mm)Reduces PCB space, improves thermal performanceRequires SMT assembly (not prototyping-friendly)
Thermal PerformanceHigh-power applicationsCeramic substrate (3.0 W/mK) ▲▲▲ (15× better than plastic) vs Industry standardSuperior heat dissipation for stable operationHigher cost (ceramic substrate)
Manufacturing ProcessMass production linesSurface Mount Technology (SMT) ▲ (fully automated assembly)Efficient high-volume productionLess suitable for manual prototyping
CustomizationSpecialized applicationsProgrammable microcontrollers (ARM/MIPS) ▲ (supports tailored functions)Flexible for diverse applicationsRequires advanced programming skills
Space EfficiencyPortable electronicsLeadless design (0.5mm profile) ▲ (50% thinner than LCC)Enables thinner devices (e.g., wearables)Limited to SMT-compatible PCB designs
Cost-Performance RatioBudget-sensitive projectsBase tier: Standard ICs vs Advanced: High-end DSP ▲ (2× processing power)Cost-effective for basic needsAdvanced tiers may exceed budget constraints

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