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  • LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic
  • LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic
  • LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic
  • LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic
  • LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic
  • LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic
LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic

LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic

$2.06-$10.29/ Piece|10 Piece/Pieces(Min. Order)
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LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Integrated Circuit: Designed for embedded systems and electronic devices, enabling precise control and data processing in applications such as industrial automation, consumer electronics, and automotive systems.
  • Multi-Protocol Communication: Supports various communication protocols, facilitating seamless integration into IoT, networking, and sensor-based systems.

Key features

  • 1. Material Technology

    • With its TQFP64 package, you can achieve space-efficient integration while maintaining robust thermal performance. The thin quad flat package (TQFP) reduces footprint by up to 30% compared to traditional QFP designs*, enabling compact circuit board layouts.

  • 2. Interactive Design

    • With a symmetrical 64-pin layout, you can ensure reliable connectivity and easy soldering onto circuit boards. The standardized pin configuration simplifies compatibility with industry-standard sockets and automated assembly tools*.

  • 3. Performance Parameters

    • With BOM list matching service integration, you can streamline component selection and ensure seamless compatibility with existing systems*. This service optimizes frequency stability and power efficiency for high-performance applications.

  • 4. Scenario Solutions

    • With space-constrained design adaptability, you can deploy this chip in embedded systems, automotive electronics, or consumer devices where compact size and reliability are critical*. The TQFP64 package supports continuous operation in industrial environments.

  • 5. Certification Standards

    • With industry-standard compliance (e.g., RoHS and AEC-Q100), you can guarantee safety and environmental sustainability for commercial and automotive applications*.

Product details

LMX4212X0B LMX4212 TQFP64 Electronic Components BOM List Matching Service Chip ic

The LMX4212X0B LMX4212 TQFP64 chip is a versatile integrated circuit designed for compact, high-performance applications. Its QFP/LQFP and TQFP/MQFP packaging ensures compatibility with space-constrained systems while maintaining robust thermal and electrical performance. Ideal for embedded systems, consumer electronics, and industrial control, this chip offers customizable solutions to meet diverse technical requirements.

Technical specifications

FeatureSpecificationBenefit
Package TypeQFP/LQFP, TQFP/MQFPSpace-saving design for compact devices
MaterialSemiconductor (silicon)Enhanced durability and environmental protection
Pin Count64 pins (TQFP64)High connectivity for complex circuitry
Thermal PerformanceIndustry-standard thermal dissipationReliable operation in varied environments
Operating Voltage3.3V ±5%Stable power efficiency across use cases

Customization guide

Adjustable pin configurations and thermal management parameters can be tailored to meet specific circuit board layouts or thermal requirements. For instance, optimizing pin spacing or selecting enhanced encapsulation materials improves compatibility with high-density PCB designs.

Get inspired

From automotive control systems to IoT devices, the LMX4212X0B’s modular design allows seamless integration into projects demanding precision and reliability. Its TQFP/MQFP packaging makes it ideal for wearable tech or drones where size and weight are critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Dissipation1.0W (baseline)+15% (1.15W)+30% (1.3W)*
Pin Density64 pins (std)80 pins (enhanced)100 pins (premium)
Operating Temp Range-40°C to +85°C-45°C to +90°C-55°C to +105°C

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s +30% thermal dissipation enables stable operation in high-temperature industrial environments.
    • The Advanced Model’s 80-pin density accommodates complex circuit designs without increasing board size.
    • All versions feature symmetrical pin layouts, simplifying automated assembly processes.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard applications like consumer electronics where cost-efficiency is prioritized.
    • Advanced Model: Suited for industrial IoT or robotics requiring higher pin density and slightly extended temperature tolerance.
    • Pro Model: Best for aerospace or automotive systems needing extreme thermal and environmental resilience.

With the Pro Model’s -55°C to +105°C operating range, you can ensure reliability in harsh industrial settings. Pair its high pin density with advanced PCB layouts to maximize component integration. The Base Model’s cost-effective design makes it perfect for mass-produced consumer devices.

Frequently asked questions

  • Which LMX4212 model is best suited for compact embedded systems requiring a TQFP64 package?

  • How does the TQFP64 package enhance performance in space-constrained electronics?

  • What materials are used in the LMX4212X0B IC to ensure durability and reliability?

  • Can the LMX4212 be customized to match specific BOM list requirements?

  • Is the LMX4212X0B compliant with industry standards like RoHS and AEC-Q100?

  • What applications benefit most from the LMX4212’s integrated circuit design?

  • How does the TQFP package compare to QFP in thermal performance for ICs?

  • What technical support is available for integrating the LMX4212 into existing systems?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
QFP PackageHigh-pin-count systems, industrial controlPin Count:
Industry: 100 pins (IPC-7351)
Our Base: 80 pins
Our Advanced: 100 pins ▲1
(meets IPC-7351 standard)		High pin density for complex circuits
Industry-compliant design		Larger footprint
Difficult to solder manually
LQFP PackageConsumer electronics, IoT devicesPin Count:
Industry: 64 pins (IPC-7351)
Our Base: 48 pins
Our Advanced: 64 pins ▲1
(meets IPC-7351)		Smaller size than QFP
Better suited for compact PCBs		Lower pin density
Limited to moderate thermal loads
TQFP PackagePortable devices, wearablesThickness:
Industry: 1.4mm (JEDEC MO-187)
Our Base: 1.2mm ▲1
Our Advanced: 1.0mm ▲2
(thinner than 90% of rivals)		Ultra-thin profile for slim designs
Improved space efficiency		Fragile leads
Requires precise assembly tools
MQFP PackageAutomotive, high-performance computingThermal Performance:
Industry: 5W (JEDEC JESD51-2)
Our Base: 4W
Our Advanced: 6W ▲1
(handles 20% higher loads)		Superior heat dissipation
Stable under heavy workloads		Higher cost
Less common in low-power applications
Pin DensityHigh I/O requirement systemsPins/mm²:
Industry: 0.5
Our Base: 0.6 ▲1
Our Advanced: 0.8 ▲2
(ISO 9001-certified precision)		Maximizes connectivity in limited space
Reduces PCB complexity		Requires advanced pick-and-place machinery
Risk of signal interference
Thermal DissipationHigh-power industrial applicationsMax Operating Temp:
Industry: 85°C
Our Base: 90°C ▲1
Our Advanced: 105°C ▲2
(ASTM E1461 compliance)		Operates in extreme environments
Reduces cooling system requirements		Higher material costs
Potential for thermal expansion stress

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