Lab RTP Rapid Annealing Furnace with Heating Temperature Zone 400mm for Annealing After Ion Implantation and Electrode Alloying

Technical specifications

Customization guide

Adjustable temperature zones (up to 400mm) and vacuum levels allow customization to meet specific thermal and pressure requirements for varying substrate sizes and annealing processes.

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Achieve uniform heat distribution across large substrates with the 400mm heating zone, ensuring defect-free annealing for semiconductor wafers or metal sheets. The digital control system and vacuum chamber enable precise process replication, ideal for R&D and industrial applications.

Choose your model

Supplier's note

1. Technical Breakthroughs:

   • Ultra-High Vacuum (1e-7 Torr): Enables contamination-free annealing for sensitive materials like semiconductors.
   • Smart Auto Control System: Reduces operator error and ensures repeatable results via automated parameter adjustments.
   • 1300°C Max Temperature: Outperforms industry benchmarks by 30%, supporting high-temperature alloy treatments.

2. Version Selection Guide:

   • Base Model: Ideal for standard annealing tasks requiring up to 1000°C, suitable for small-scale labs or educational institutions.
   • Advanced Model: Best for R&D teams needing semi-automated control and higher vacuum levels (1e-5 Torr) for precision work.
   • Pro Model: Designed for industrial users requiring extreme temperatures (1300°C) and ultra-high vacuum (1e-7 Torr), enabling advanced material processing.

With the Pro Model’s 1300°C capability, you can anneal high-performance alloys 20% faster than industry-standard equipment. Pair this with its 1e-7 Torr vacuum to eliminate impurities, ensuring superior material integrity for aerospace or semiconductor applications.