Spin Coaters | Semiconductor labs, R&D for thin films on small substrates (e.g., wafers, steel) | Coating thickness accuracy ±5 µm (ISO 25178), 4-inch substrate capacity, Vacuum pressure: 10⁻³ Torr (▲ Advanced: 10⁻⁵ Torr, ultra-high vacuum) | High precision, uniform coatings, ideal for small-batch production | Limited to small substrates, higher upfront cost |
Spray Coaters | Automotive manufacturing, large-scale industrial coating | Spray rate 5–10 L/min (ISO 12227), No vacuum capability | Fast application, large coverage area | Material waste, less precise for thin or complex coatings |
Dip Coaters | Small parts coating (wires, electrical components) | Immersion depth control ±1 mm (ISO 3047), Thickness dependent on withdrawal speed | Simple setup, cost-effective for small-scale operations | Thickness variability, not suitable for complex geometries |
Roll Coaters | Continuous production of flat materials (metal sheets, films) | Line speed 10–50 m/min (ISO 3884), Coating thickness 50–500 µm (▲ Advanced: up to 1000 µm) | High volume, consistent thickness, scalable for industrial use | Requires flat substrates, high initial investment |
Electrostatic Coaters | Automotive, appliances for complex shapes (e.g., car bodies, appliances) | Voltage 50 kV (IEC 60065), Transfer efficiency 85% (▲ Advanced: 95%, reduces overspray by 10%) | Wraps around parts, minimizes material waste | Conductive substrates required, safety risks for non-conductive materials |
Vacuum Coaters | Optics, semiconductor manufacturing for ultra-thin films | Vacuum pressure 10⁻⁶ Torr (ASTM E54), Coating thickness 10–1000 nm | High purity, ultra-thin layers (e.g., for optical coatings) | Expensive equipment, slow process, limited to lab-scale applications |