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  • Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board
  • Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board
  • Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board
  • Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board
  • Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board
  • Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board
Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board

Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board

  • 2 - 4 Pieces
    $1,550
  • 5 - 9 Pieces
    $1,540
  • 10 - 19 Pieces
    $1,530
  • >= 20 Pieces
    $1,520

Customization:

Customized logo（Min.Order: 10 pieces）
Customized packaging（Min.Order: 10 pieces）
Graphic customization（Min.Order: 10 pieces）
View product details

Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Soldering/Desoldering: Designed for precise BGA (Ball Grid Array) rework, IC replacement, and chip board repair, enabling accurate soldering and desoldering of delicate electronic components.
  • Thermal Imaging & Microscopic Analysis: Integrates thermal imaging for real-time temperature monitoring during焊接 processes and microscopic imaging for detailed inspection of circuit boards and components.

Key features

  • 1. Corrosion-Resistant Material Technology

    • With a stainless steel alloy body, you can ensure long-term durability in high-temperature and chemically exposed workshop environments.

  • 2. Dual-Function Interactive Design

    • With an adjustable thermal imaging lens and split-screen interface, you can simultaneously monitor temperature gradients and microscopic board details for precise BGA rework.

  • 3. Precision Temperature Control

    • With ±1°C thermal accuracy, you can achieve flawless soldering/desoldering of delicate CPU/GPU chips without damaging sensitive components.

  • 4. Mobile Scenario Adaptability

    • Designed for on-site electronics repair, this portable unit offers 40% greater mobility than stationary rework stations*, enabling fieldwork in commercial or industrial settings.

  • 5. Multi-National Compliance Certifications

    • Certified with CE, FCC, and EU EPR standards, you can meet regulatory requirements for safe operation and sustainable disposal in European markets.

Product details

Laser Welding Machine TBKR2201 Cpu GPU Replace IC Soldering Desoldering Mobile Welding Laptop BGA Rework Station for Chip Board

The Laser Welding Machine TBKR2201 is a versatile BGA rework station designed for precision soldering, desoldering, and IC replacement on chip boards. Equipped with thermal imaging and microscopic capabilities, it combines durability and compliance with EU and international standards to meet high-demand electronics repair and manufacturing needs.

Technical specifications

FeatureSpecificationApplication Scenario
Thermal ImagingHigh-resolution thermal sensorDetecting hotspots in electronics repair
Microscopic Imaging50x adjustable magnification lensPrecision inspection of chip board flaws
Adjustable LensCustomizable magnification (20x–50x)Adapting to diverse repair tasks
Dual ScreensPrimary thermal display + secondary data screenSimultaneous thermal and data monitoring
MaterialAluminum alloy body with stainless steel componentsWithstanding industrial environments
CertificationsCE, FCC, EPR (France/Germany), WEEECompliance with EU and global regulations

Customization guide

Adjustable lens parameters (magnification and thermal sensitivity) to meet specific repair needs, such as varying board thickness or material thermal resistance.

Get inspired

Combine thermal analysis and microscopic precision to tackle complex electronics repairs. Ideal for manufacturers, engineers, and quality control teams requiring reliable, standards-compliant solutions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resolution160x120 pixels+15% (184x138)+30% (208x156)*
Magnification20x30x50x
PortabilityStandard wheelsEnhanced mobilityFully portable
Weight25 kg22 kg18 kg (20% lighter)

Supplier's note

  1. Technical Breakthroughs:

    • Triple-industry-standard thermal resistance: Safely handle high-temperature components.
    • Dual thermal/microscopic imaging: Simultaneously analyze thermal data and microscopic defects.
    • Lightweight alloy design: 20% lighter than traditional models for easier mobility.

  2. Version Selection Guide:

    • Pro Model: Engineers needing 50x magnification and ultra-portability for on-site repairs.
    • Advanced Model: Mid-range tasks requiring 30x magnification and improved mobility.
    • Base Model: Standard repair shops prioritizing cost-effectiveness without sacrificing core functionality.

Example: With the Pro Model’s 50x magnification, you can identify microscopic solder defects that would otherwise go undetected. Its lightweight design (20% lighter than traditional models) ensures ease of use in tight spaces.

Frequently asked questions

  • Which laser welding machine model is best for BGA rework on laptop chip boards?

  • How to clean the welding head of the TBKR2201 for optimal performance?

  • Is the TBKR2201 certified for EU standards like CE and WEEE?

  • Can the TBKR2201 be customized for specific IC soldering needs?

  • What components can the TBKR2201 handle besides CPUs and GPUs?

  • Does the TBKR2201 have safety features for precise laser control?

  • Is the TBKR2201 suitable for mobile welding applications?

  • How does laser welding compare to traditional methods for chip board repair?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Thermal Imaging AccuracyQuality control in manufacturingIndustry Standard: 0.1°C (ISO 10360)
Our Base: 0.08°C (▲20% improvement)
Our Advanced: 0.05°C (▲37.5% improvement over Base)		Advanced detects micro-hotspots critical for precision manufacturingBase may suffice for standard inspections; Advanced requires higher investment
Precision (Alignment)BGA rework on delicate electronicsIndustry Standard: ±0.01mm
Our Base: ±0.008mm (▲20%)
Our Advanced: ±0.005mm (▲60% improvement over Base)		Ensures minimal errors in high-precision tasksBase may be adequate for less critical applications; Advanced adds cost
Noise LevelOffice or shared workshop environmentsIndustry Standard: 50 dBA (louder than a dishwasher)
Our Base: 45 dBA (▲10% quieter)
Our Advanced: 40 dBA (quieter than a refrigerator)		Advanced ideal for noise-sensitive areasIndustry standard may disturb nearby workspaces
Weight/PortabilityOn-site repairs or mobile useIndustry Standard: 20kg
Our Base: 15kg (▲25% lighter)
Our Advanced: 12kg (▲ additional 20% lighter than Base)		Advanced easier to transportIndustry standard requires dedicated transport
Compliance CertificationsEU market entry and global complianceIndustry Standard: CE, FCC
Our Base: +EPR France
Our Advanced: +EPR Germany, WEEE		Advanced meets stricter EU regulationsBase lacks WEEE for full EU compliance; Advanced adds cost
Cooling EfficiencyHigh-volume soldering tasksIndustry Standard: 30min continuous use
Our Base: 45min (▲50%)
Our Advanced: 60min (▲100% improvement over Base)		Advanced handles prolonged use without overheatingIndustry standard may need frequent breaks

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