Lcd Chip Senk13 Cb

Name: Lcd Chip Senk13 Cb
Brand: Shenzhen Jiahuahuiming Trade Co., Ltd.
SKU: 1600817424230_1
Price: 0.01 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

LCD Driving & Signal Management: The SENK13 CB is an integrated circuit designed to drive LCD panels, managing signal processing and power distribution for clear display performance.
Surface-Mount Design (SMD): Optimized for compact electronic systems, enabling easy installation in printed circuit boards (PCBs) through surface-mount technology.

Key features

1. Material Technology

With a durable metal alloy construction, ensure reliable performance in harsh industrial environments. ~30% more resistant to corrosion than plastic-based alternatives*.

2. Interactive Design

With a surface-mount design (SMD), you can achieve seamless integration into compact electronic devices, reducing assembly time by up to 25%* compared to through-hole components.

3. Performance Parameters

With optimized signal processing capabilities, you can achieve faster display response times compared to traditional LCD controllers*, ensuring crisp and lag-free visuals.

4. Scenario Solutions

Designed for versatile applications, you can deploy this chip in both consumer electronics (e.g., smartphones) and commercial displays (e.g., digital signage), ensuring broad adaptability.

5. Certification Standards

With compliance to industry standards like RoHS and ISO certifications, you can ensure environmental responsibility and safety in manufacturing processes*.

Product details

The Samsung SENK13-CB LCD chip (PPC25200) is a compact surface-mount integrated circuit designed for versatile electronic applications. Engineered with a metallic alloy casing and SMD form factor, this component offers durability and efficient space utilization in PCB designs.

Technical specifications

Feature	Specification	Application Scenario
Material	Metal alloy	High-stress environments requiring thermal and mechanical stability
Form Factor	Small rectangular (SMD SO package)	Space-constrained electronics (e.g., handheld devices)
Mounting Type	Surface-Mount Technology (SMD)	Automated assembly in mass production
Certification	RoHS compliant	EU and global regulated electronics manufacturing

Customization guide

While the SENK13-CB is a standardized component, its SMD design allows seamless integration into custom PCB layouts. Engineers can optimize circuit density by leveraging its compact footprint to meet space or weight constraints.

Get inspired

With its robust metal alloy construction and SMD compatibility, this chip is ideal for applications requiring reliable performance in compact devices like industrial sensors, consumer electronics, or automotive control systems.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Power Efficiency	85% efficiency	+15% (98.5%)	+30% (100%*)
Thermal Dissipation	5W max	7.5W (+50%)	10W (+100%)
Compatibility	Standard IC buses	High-speed interfaces	Multi-protocol support

Supplier's note

Technical Breakthroughs:
- SMD Form Factor: Enables 20% faster assembly than through-hole components.
- Metal Alloy Casing: Provides 3x better thermal conductivity than plastic alternatives.
- RoHS Compliance: Meets EU environmental standards without sacrificing performance.
Version Selection Guide:
- Base Model: Suitable for basic LCD control in cost-sensitive consumer devices.
- Advanced Model: Ideal for industrial IoT systems requiring higher thermal tolerance.
- Pro Model: Best for high-performance applications like automotive dashboards, where multi-protocol support and peak efficiency are critical.

With the Pro Model’s 100% power efficiency, you can reduce energy waste in 24/7 operational systems. Its metal alloy casing ensures reliability even in harsh environments, making it a top choice for mission-critical electronics.

*Note: The Pro Model’s 100% efficiency is a theoretical maximum under optimal conditions.

Frequently asked questions

Which SMD LCD chip is best suited for compact electronics applications?
Is the SENK13-CB LCD chip compliant with industry standards for integrated circuits?
Why choose SMD mounting over through-hole for LCD chips like the SENK13-CB?
Can the SENK13-CB LCD chip be customized for specialized applications?
What applications are best suited for the SENK13-CB integrated circuit?
How does the SENK13-CB’s SMD design improve circuit board reliability?
Is the SENK13-CB compatible with standard PCB manufacturing processes?
What factors ensure the longevity of the SENK13-CB LCD chip?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Power Consumption	Battery-operated devices (e.g., wearables)	Industry: 2W	Base: 1.5W (▲17%)	Advanced: 1.2W (▲20% from Base) (meets EN 50598)
Operating Temperature	Industrial/automotive environments	Industry: -20°C to 70°C	Base: -30°C to 85°C (▲10°C/▲15°C)	Advanced: -40°C to 105°C (▲20°C/▲35°C) (IEC 60068-2-1)
Signal Processing Speed	High-speed data applications (e.g., servers)	Industry: 100MHz	Base: 150MHz (▲50%)	Advanced: 200MHz (▲33% from Base) (JEDEC JESD22)
Package Dimensions	Compact devices (e.g., smartphones)	Industry: 6mm × 4mm	Base: 5mm × 3mm (▲20% smaller)	Advanced: 4.5mm × 2.8mm (▲40% smaller) (IEC 61187)
Compliance Standards	Global markets requiring certifications	Industry: RoHS	Base: RoHS + ISO 9001 (▲1 standard)	Advanced: RoHS + ISO 9001 + ISO 14001 (▲2 standards)
Electromagnetic Interference (EMI)	Medical devices needing low EMI	Industry: 45 dB	Base: 40 dB (▲11%)	Advanced: 35 dB (▲12.5% from Base) (CISPR 25)