LongTai Ectfe Architecture Heat Resistance Tensile Price Architectural Roof Membrane Semiconductor Releasing Etfe Film

Technical specifications

Customization guide

Adjustable parameters include:

• Thickness: Optimize for lightweight applications (e.g., 0.1mm for flexible electronics) or heavy-duty uses (e.g., 0.3mm for industrial insulation).
• Width/Length: Customize to fit specific machinery or project scales.
• Surface Coatings: Add UV resistance or anti-static layers for specialized environments.

Get inspired

With its heat resistance and transparency, this PE film is a game-changer for architectural roofing membranes, semiconductor release liners, or high-precision electronics. Its soft texture ensures seamless integration into automated production lines, while its durability reduces material waste.

Choose your model

Supplier's note

1. Technical Breakthroughs:

   • Material Innovation: PE ensures cost-effective chemical resistance compared to ETFE, reducing long-term maintenance costs.
   • Temperature Range: The Pro Model’s 120°C tolerance exceeds industry benchmarks, enabling use in high-heat semiconductor fabrication.
   • Tensile Strength: Advanced and Pro versions offer 15–30% higher strength than standard release films, minimizing tears during high-speed production.

2. Version Selection Guide:

   • Base Model: Ideal for standard consumer electronics assembly or low-heat packaging.
   • Advanced Model: Suited for automotive or HVAC industries needing moderate thermal and mechanical stress resistance.
   • Pro Model: Required for semiconductor manufacturing or aerospace applications where extreme temperatures and durability are critical.

With the Pro Model’s 120°C resistance, you can safely handle high-temperature semiconductor curing processes. Pair its enhanced tensile strength with anti-static coatings to eliminate production downtime caused by material failure.