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  • Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original
  • Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original
  • Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original
  • Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original
  • Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original
  • Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original
Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original

Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original

  • 10 - 99 Pieces
    $0.89
  • 100 - 999 Pieces
    $0.39
  • >= 1000 Pieces
    $0.10

Customization:

Customized packaging（Min.Order: 100 pieces）
View product details

Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • IC Programming & Testing: Designed to hold and provide electrical connections for integrated circuits (ICs) during programming, burn-in testing, and functional validation.
  • Multi-Package Compatibility: Supports a wide range of IC packages including TQFP, QFN, SOP, TSSOP, SSOP, BGA, DIP, TO252, and PLCC, ensuring versatility for diverse applications.

Key features

  • 1. Material Technology

    • With a durable metal-reinforced body and gold-plated contacts, you can achieve long-lasting reliability in harsh testing environments.

  • 2. Interactive Design

    • With a universal design supporting TQFP, QFN, SOP, and more, you can seamlessly adapt to diverse IC packages.

  • 3. Performance Parameters

    • With high-temperature resistance up to 150°C, you can perform rigorous burn-in tests for quality assurance.

  • 4. Scenario Solutions

    • Designed for both R&D labs and industrial production lines, you can ensure consistent performance across environments.

  • 5. Certification Standards

    • Complies with RoHS and ISO 9001 standards, ensuring safety and quality for global applications.

Product details

Low price IC Test and Burn-in Socket Programmer Adapter TQFP QFN SOP TSSOP SSOP BGA DIP TO252 PLCC Burn-in Socket Original

The Low Price IC Test and Burn-in Socket Programmer Adapter is a versatile tool for programming, testing, and burn-in processes of integrated circuits (ICs). Designed for standard applications, it supports multiple package types (TQFP, QFN, SOP, etc.) with durable construction and customizable contact arrangements.

Technical specifications

FeatureSpecificationBenefit
MaterialDurable plastic/metal body, gold-plated contactsEnsures longevity and reliable electrical connections
ContactsCustomizable pin arrangement (up to 200 pins)Adapts to diverse IC package requirements
DesignSquare shape, compact, robust buildOptimizes space and stability during testing
FunctionalitySupports burn-in, programming, and testingStreamlines IC validation workflows
ProtectionAnti-static shielding, thermal resistanceSafeguards ICs from damage during high-stress use

Customization guide

Adjustable contact arrangement and pin count to accommodate specific IC pinouts. For high-volume testing, customize thermal dissipation features to match environmental conditions.

Get inspired

Use this socket for prototyping, quality assurance, or mass production testing. Its compatibility with BGA, DIP, and surface-mount packages makes it ideal for electronics manufacturing and R&D labs.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Contact Density50 pins/mm²+15% (57.5 pins/mm²)+30% (65 pins/mm²)*
Max Voltage30V45V60V
Thermal Resistance1.2°C/W0.9°C/W0.6°C/W*
Pin Count50-100 pins100-150 pins150-200 pins

Supplier's note

  1. Breakthroughs:

    • Gold-plated contacts: 20% lower contact resistance than standard nickel-plated sockets, reducing signal loss.
    • Pro Model Thermal Resistance: 50% better than industry benchmarks, enabling safe testing of high-power ICs.
    • Customizable pin arrangement: Adapts to 90% of common IC packages without requiring redesign.

  2. Version Selection Guide:

    • Base Model: Ideal for small-scale prototyping or low-pin-count testing (e.g., SOP/QFN).
    • Advanced Model: Suitable for medium-volume production lines requiring higher voltage tolerance (e.g., automotive ICs).
    • Pro Model: Best for high-pin-count, high-power applications (e.g., BGA GPUs or FPGAs). With its triple-industry-standard thermal resistance, the Pro Model ensures stable operation even under prolonged burn-in cycles. Pair its gold contacts with anti-static shielding to minimize failure risks during mass production.
    • indicates improvement over industry benchmarks.

Frequently asked questions

  • Which IC test socket model suits TQFP or QFN packages for small electronics projects?

  • How do I clean the contacts of a burn-in socket for BGA ICs?

  • What material is the socket body made of, and why?

  • Can this socket be customized for non-standard DIP IC pinouts?

  • Is the socket’s material compliant with electronics safety standards?

  • What makes this burn-in socket suitable for high-volume SOP IC testing?

  • Does the adapter work with legacy TO252 or PLCC packages?

  • How does the socket prevent damage during BGA IC programming?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Standard IC Test SocketsGeneral IC testing in labs/manufacturingContacts: Gold-plated (ASTM B499) ▲
Material: Durable plastic (ISO 9001)		Cost-effective, reliable for routine testingLimited to standard packages (e.g., SOP, TSSOP), lower durability for high-volume use
High-Density Burn-in SocketsBurn-in testing of high-pin ICsContact density: 500+ pins/cm² (IEC 61180)
Thermal resistance: 125°C (MIL-STD-810)		Handles dense ICs, withstands burn-in heatComplex installation, higher cost
High-Temperature SocketsExtreme-temperature testingOperating temp: 150°C (MIL-STD-810)
Thermal expansion compensation		Ideal for aerospace/automotive testingFragile, requires specialized handling
Zero-Insertion Force (ZIF) SocketsDelicate IC handlingLever mechanism (IEC 61130)
Pin stress reduction: 0.2N force (ASTM F2035)		Protects fragile pins, reduces wearSlower insertion/removal, bulkier design
BGA SocketsTesting BGA packagesSolderless contact (IEC 61180)
Pitch compatibility: 0.5mm (ISO 9328)		No soldering required, precise alignmentExpensive, limited to specific BGA sizes
Customizable Pin SocketsR&D for custom ICsAdjustable pin config (ISO 9001)
10+ pin variations (ASTM E29)		Versatile for prototyping, supports non-standard ICsLonger lead times, higher cost, requires expertise

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