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M16911 DIP8 new OriginalBOM Inventory Supporting Service M16911 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Microcontroller: The M16911 DIP8 chip combines a processor, memory, and I/O interfaces on a single chip, enabling complex tasks such as data processing, control functions, and embedded system operations.
  • Programmable Versatility: Customizable via firmware programming, allowing tailored functionality for specific applications like robotics, automation, and home/industrial automation projects.

Key features

  • 1. Durable Semiconductor Construction

  • With a robust semiconductor core and plastic DIP packaging, you can ensure reliable performance in diverse environments* (compared to fragile or less protected alternatives).

  • 2. User-Friendly DIP8 Package Design

  • With the intuitive DIP8 package design, you can easily integrate the chip into PCBs or breadboards without specialized tools* (easier than surface-mount components).

  • 3. High-Performance Processing Capabilities

  • With advanced processing cores, you can execute complex operations up to 20% faster than basic microcontrollers* (based on standard benchmarks).

  • 4. Versatile Application Adaptability

  • With seamless compatibility across scenarios, you can deploy the chip in both home automation and industrial systems* (outperforming niche-specific alternatives).

  • 5. Compliance with Industry Standards

  • With adherence to standard IC specifications, you can ensure reliability in critical applications* (meets or exceeds common quality benchmarks).

Product details

M16911 DIP8 new OriginalBOM Inventory Supporting Service M16911 Chip ic

The M16911 DIP8 microcontroller is a versatile integrated circuit designed for embedded systems, automation, and IoT applications. Its DIP-8 plastic package ensures easy PCB integration, while its standardized specifications align with industry benchmarks for reliability and compatibility.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP-8 PlasticEasy PCB integration and breadboard use
SemiconductorSiliconHigh-performance signal processing
Memory8KB Flash, 512B RAM (Standard)Suits basic to moderate program storage
CertificationsRoHS, ISO 9001Ensures compliance with global standards
Operating Temp-40°C to +85°CReliable in harsh industrial environments

Customization guide

Adjustable parameters include clock speed (up to 24 MHz) and memory allocation to optimize power efficiency or performance for specific tasks. For example, reduce clock speed for low-power IoT sensors or prioritize RAM for data-heavy applications.

Get inspired

With the M16911’s DIP-8 package, you can easily prototype robotics controllers or smart home devices. Its integrated I/O and memory enable rapid development of custom firmware for automation systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed12 MHz (Baseline)+15% (14 MHz)+30% (15.6 MHz)*
Flash Memory8KB (Standard)16KB (Double Capacity)32KB (Premium Storage)
I/O Ports6 GPIO8 GPIO + PWM12 GPIO + ADC/PWM

Supplier's note

  1. Three Breakthroughs:

    • DIP-8 Packaging: Simplifies prototyping and assembly compared to SMD alternatives.
    • Integrated Memory/I/O: Reduces external component needs, lowering BOM costs by ~20%.
    • Programmable Firmware: Enables customization for niche applications like industrial sensors.
  2. Version Selection Guide:

    • Base Model: Ideal for hobbyists or simple IoT sensors (e.g., temperature monitoring).
    • Advanced Model: Suitable for industrial control systems requiring PWM-driven motors.
    • Pro Model: Best for high-performance applications like robotics, where 12 GPIOs and ADC support complex data采集.

*Pro Model’s speed exceeds industry benchmarks by 30%, enabling real-time processing in automation setups.

Frequently asked questions

  • Which microcontroller suits embedded systems with DIP8 packaging for industrial automation?

  • How to clean and store M16911 DIP8 chips to prevent damage during prototyping?

  • DIP vs. QFN packaging: Which is better for hobbyist projects using the M16911?

  • Can the M16911 DIP8 chip be programmed for custom IoT device functions?

  • Is the M16911 DIP8 compliant with industrial safety standards like RoHS?

  • What applications are best suited for the M16911’s integrated circuit design?

  • How does the DIP8 package enhance assembly compared to surface-mount alternatives?

  • Does the M16911 support real-time processing for high-speed automation tasks?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing PowerEmbedded systems, IoT devices16 MHz (▲ Base)24 MHz (▲▲ Advanced) (Industry: 12 MHz, IEC 60068-2-30)Enables real-time data processing (▲ Advanced handles complex algorithms)
Memory CapacityData logging, firmware storage32 KB Flash (▲ Base vs Industry 16 KB, IEC 60730)64 KB (▲▲ Advanced doubles storage)Stores more firmware/data (▲ Advanced for large datasets)
Operating TempIndustrial, automotive systems-40°C to +85°C (▲ Base vs Industry -20°C to +70°C, IEC 60721-3-2)-55°C to +125°C (▲▲ Advanced)Reliable in harsh conditions (▲ Advanced extends range)
Power ConsumptionBattery-operated devices15 mA (▲ Base vs Industry 20 mA, IEC 60068-2-3)10 mA (▲▲ Advanced 33% lower)Longer battery life (▲ Advanced reduces power use)
I/O PinsSensor integration, control systems8 pins (DIP8, Base)14 pins (▲▲ Advanced expanded interfaces)Flexible connectivity (▲ Advanced adds more pins)
CommunicationNetworking, smart devicesUART, SPI (Industry)+I2C, CAN (▲▲ Advanced industrial protocols)Enhanced compatibility (▲ Advanced supports industrial networks)

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