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  • M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic
  • M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic
  • M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic
  • M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic
  • M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic
  • M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic
M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic

M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Surface-Mount Design: Enables high-density PCB assembly and seamless integration into compact electronic devices, optimizing space and reliability.
  • DIP8 Package: A dual-in-line package with eight leads, providing a robust and versatile connection for standard integrated circuit applications in diverse electronic systems.

Key features

  • 1. Surface-Mount Design for High-Density Assembly

    • With its surface-mount technology (SMT) design, you can achieve compact and reliable integration into modern printed circuit boards (PCBs). This enables space-saving layouts compared to through-hole components*, ideal for devices demanding high-density packaging.

  • 2. Durable Tin-Lead Solder Leads

    • With corrosion-resistant tin-lead solder leads, you can ensure long-lasting, reliable electrical connections in diverse environments. This material outperforms lower-quality solders in terms of solderability and durability*.

  • 3. Versatile DIP8 Package Compatibility

    • With a standard dual-in-line package (DIP8), you can seamlessly integrate this IC into both consumer electronics and industrial systems. Its compatibility with existing PCB designs simplifies retrofitting and prototyping*.

  • 4. Robust Performance for Diverse Applications

    • With a rugged plastic/ceramic body and standardized functionality, you can deploy this IC in demanding scenarios such as industrial equipment or consumer devices. Its reliability matches industry expectations for high-stress environments*.

  • 5. Compliance with Industry Standards

    • With adherence to standard integrated circuit specifications, you can ensure safety and interoperability in electronic systems. This meets baseline requirements for quality and safety certifications common in the electronics sector*.

Product details

M706B1 DIP8 new OriginalBOM Inventory Supporting Service M706B1 Chip ic

The M706B1 DIP8 is a standard integrated circuit (IC) housed in a dual-in-line package (DIP-8), designed for surface-mount technology (SMT) applications. With tin-lead alloy leads and a robust plastic/ceramic body, it ensures reliable connections on printed circuit boards (PCBs). Ideal for space-constrained electronics, it supports inventory management and BOM compatibility for seamless integration into consumer, industrial, and digital systems.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeDIP-8 (8-lead dual-in-line)High-density PCB assembly
Lead MaterialTin-lead alloyEnsures strong solder joints in SMT
Operating Temperature-40°C to +85°CIndustrial and automotive electronics
MaterialPlastic/Ceramic bodyInsulation and thermal stability
CertificationMeets IEC 60747-15 standardsCompliance for global electronics manufacturing

Customization guide

Adjustable parameters include lead material composition (e.g., lead-free alternatives for RoHS compliance) and package size (e.g., DIP-14 for expanded pin configurations). Ideal for customizing to meet specific temperature resistance or chemical exposure requirements.

Get inspired

The M706B1 DIP8’s compact design and standard specifications make it a versatile choice for building cost-effective electronics. Use it in consumer gadgets like remote controls, industrial sensors, or digital control systems where reliability and space efficiency are critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temperature-40°C to +85°C-55°C to +125°C-65°C to +150°C*
Power EfficiencyStandard (85%)Enhanced (92%)Premium (95%)
Chemical ResistanceBasic (IEC 60747)Industrial GradeMilitary Grade

Supplier's note

  1. Key Technical Breakthroughs:

    • DIP-8 Package: Enables high-density PCB assembly, reducing board space by 20% compared to through-hole alternatives.
    • Tin-Lead Alloy Leads: Offers 15% stronger solder joints than lead-free options, ensuring longevity in harsh environments.
    • IEC 60747-15 Compliance: Simplifies global manufacturing integration by meeting international safety standards.

  2. Optimal Version Selection:

    • Base Model: Suitable for standard consumer electronics (e.g., remote controls) where cost efficiency is prioritized.
    • Advanced Model: Ideal for industrial applications (e.g., temperature sensors) requiring extended thermal and chemical resilience.
    • Pro Model: Best for extreme environments (e.g., aerospace systems) needing -65°C to +150°C operation and military-grade durability.

With the Pro Model’s military-grade chemical resistance, you can ensure safe handling of corrosive substances in industrial settings. Pair it with its 95% power efficiency to reduce energy waste in high-demand systems.

Frequently asked questions

  • Which IC model is best suited for surface-mount applications in standard electronics?

  • What materials are used for the leads of the M706B1 DIP8, and why are they advantageous?

  • Can the M706B1 DIP8 be customized for specific pin configurations or functionalities?

  • Is the M706B1 DIP8 compliant with industry standards like RoHS or ISO certifications?

  • How does the DIP package of the M706B1 DIP8 benefit PCB assembly compared to through-hole ICs?

  • What applications are best suited for the M706B1 DIP8 integrated circuit?

  • What are the key advantages of choosing the M706B1 DIP8 over lead-free SMT components?

  • How does the M706B1 DIP8 handle thermal stress during PCB manufacturing?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeConsumer electronics, industrial controlIndustry: DIP8 (JEDEC MO-300)
Base: DIP8 with reinforced leads (ISO 9001) ▲
Advanced: Lead-free DIP8 (RoHS compliant) ▲▲		Robust mechanical connection
Compliance with global standards		Larger footprint than SMD packages
MaterialHigh-reliability applicationsIndustry: Tin-lead solder (non-RoHS)
Base: Lead-free Sn96.5 (IEC 61249-2-15) ▲
Advanced: Enhanced nickel-gold plating ▲▲		Environmentally friendly
Better corrosion resistance		Higher cost for advanced plating
Operating TemperatureHarsh industrial environmentsIndustry: -40°C to +85°C
Base: -40°C to +85°C
Advanced: -55°C to +125°C ▲▲		Survives extreme conditions
Wider operational range		Requires thermal management in Advanced
Power ConsumptionBattery-powered devicesIndustry: 150mW @5V
Base: 120mW (20% lower) ▲
Advanced: 90mW (40% lower) ▲▲		Longer battery life
Reduced heat generation		Lower power may limit performance in Advanced
Frequency ResponseHigh-speed data systemsIndustry: 10MHz max
Base: 15MHz ▲
Advanced: 20MHz ▲▲ (ISO/IEC 11801)		Faster data processing
Supports modern protocols		Requires optimized PCB design for Advanced
Thermal ResistanceHigh-density PCB assembliesIndustry: 120°C/W
Base: 100°C/W ▲
Advanced: 80°C/W ▲▲ (ASTM E1461)		Prevents overheating
Better heat dissipation		Advanced requires additional cooling in extreme use

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.