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  • MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH
  • MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH
  • MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH
  • MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH
  • MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH
  • MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH
MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH

MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH

$0.10-$0.50/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 10000 pieces）
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MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Power Management: Efficient voltage regulation, current control, and power conversion for electronic devices, supporting buck, boost, and other modes.
  • Versatile Design: Optimized for compact integration into circuits while maintaining high performance in signal processing and energy efficiency.

Key features

  • 1. Material Technology

    • With semiconductor-grade silicon and heat-resistant plastic packaging, ensure reliable operation in high-temperature environments.

  • 2. Interactive Design

    • With surface-mount technology (SMT), enable compact PCB layouts and automated assembly processes, reducing manufacturing costs compared to through-hole alternatives*

  • 3. Performance Parameters

    • Delivering high-efficiency power conversion, reduce energy loss by up to 15% compared to conventional power ICs*

  • 4. Scenario Solutions

    • Optimized for both consumer electronics (e.g., smartphones) and industrial systems (e.g., IoT devices), offering adaptable power management for diverse applications.

  • 5. Design Flexibility

    • The SOP14 package provides a standardized form factor, ensuring seamless integration into existing circuit designs without requiring layout modifications.

Product details

MAP3516 MAP3516R1 SOP14 Power management IC chip bom list service MAP3516M MAP3516SIRH

The MAP3516 series power management ICs are designed for compact, high-efficiency power solutions in consumer electronics, industrial equipment, and IoT devices. Available in SOP14 surface-mount packaging, these chips offer scalable performance across three variants (MAP3516, MAP3516R1, MAP3516SIRH) to meet diverse power management needs.

Technical specifications

FeatureSpecificationBenefit
Package TypeSOP14 (Small Outline Package)Compact design for space-constrained PCBs
Mounting TypeSurface Mount (SMT)Easy automated assembly
Operating Voltage2.5V to 28VWide compatibility with power sources
EfficiencyUp to 95% (MAP3516SIRH variant)Reduced heat generation and energy waste
Operating Temp-40°C to +85°CReliable performance in harsh environments

Customization guide

Adjustable parameters include input voltage tolerance and thermal shutdown thresholds to meet specific power density or thermal management requirements.

Get inspired

The MAP3516 series enables sleek, high-efficiency power solutions for devices like smartphones, wearable tech, and smart home appliances. With its SOP14 package, you can optimize board space while maintaining robust power delivery.

Choose your model

ParameterBase Model (MAP3516)Advanced Model (MAP3516R1)Pro Model (MAP3516SIRH)
Peak Efficiency88%+15% (91%)+30% (95%)
Output Current1.5A2.0A2.5A
Voltage Range2.5V-20V2.5V-24V2.5V-28V

Supplier's note

  1. Technical Breakthroughs:

    • The Pro model’s 95% peak efficiency (vs. industry standard 85-90%) minimizes energy loss in high-power applications.
    • Wider voltage range (2.5V-28V) in the Advanced/Pro models supports compatibility with lithium-ion and industrial power sources.
    • Thermal shutdown thresholds are adjustable, enabling tailored protection against overheating.

  2. Optimal Version Selection:

    • Base Model: Ideal for low-power consumer devices (e.g., IoT sensors) where cost efficiency is prioritized.
    • Advanced Model: Suitable for mid-range applications like wearable devices, balancing power output and thermal performance.
    • Pro Model: Designed for industrial systems or high-current devices (e.g., drones, robotics) requiring extreme efficiency and voltage flexibility.

With the MAP3516SIRH’s 95% efficiency, you can reduce cooling requirements in compact devices. Its 28V rating ensures compatibility with rugged industrial setups, while the SOP14 package simplifies integration into dense PCB layouts.

Frequently asked questions

  • Which MAP3516 power management IC model suits compact IoT devices?

  • How does the SOP14 packaging of the MAP3516 compare to DIP for space-constrained projects?

  • Is the MAP3516 IC RoHS-compliant and suitable for automotive use?

  • Can the MAP3516 handle 3.3V systems in wearable devices?

  • What materials ensure the MAP3516’s durability in industrial settings?

  • Can I customize the MAP3516’s pin configuration for a custom PCB layout?

  • How do I prevent thermal damage when soldering the MAP3516?

  • Are there certifications for the MAP3516’s compliance with medical device standards?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Packaging TypeHigh-density PCB designsSOP14 (14-pin small outline) ▲ vs Industry DIP16 (ISO 9126)Smaller footprint, automated assembly compatibilityRequires precise soldering equipment
Power EfficiencyMobile/IoT devices95% peak efficiency (▲ Advanced vs Base 90%, ▲▲ vs Industry 85%) (IEC 61000-3-2)Longer battery life, reduced power wasteHigher cost vs standard ICs
Operating TemperatureIndustrial automation-55°C to +125°C (▲ Advanced vs Base -40°C to +105°C) (JEDEC JESD22-A108)Reliable in extreme environmentsAdvanced versions may have longer lead times
Input Voltage RangeAutomotive systems1.8V-6V (▲ Advanced vs Base 2.5V-5.5V) (IEC 60068-2-38)Flexibility with fluctuating power sourcesComplex circuit design for wide range
Output Current CapacityServer power supplies2A max (▲ Advanced vs Base 1.5A) (IEC 61000-4-5)Supports high-power loadsHigher thermal dissipation requirements
Thermal PerformanceHigh-power LED lighting105°C junction (▲ Advanced with thermal pad vs Base 85°C) (JEDEC JESD51-2)Better heat management for dense circuitsAdvanced versions require heatsinks

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