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  • MICROPOSIT S1805 Positive Photoresist
  • MICROPOSIT S1805 Positive Photoresist
  • MICROPOSIT S1805 Positive Photoresist
MICROPOSIT S1805 Positive Photoresist

MICROPOSIT S1805 Positive Photoresist

  • 1 - 2 Gallons
    $1,500
  • 3 - 4 Gallons
    $1,300
  • >= 5 Gallons
    $1,200
View product details

MICROPOSIT S1805 Positive Photoresist

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Photolithography Application: A positive photoresist designed for precise pattern transfer in semiconductor manufacturing, enabling high-resolution microchip fabrication through light-sensitive chemical processes.
  • Material Customization: Tailored for specific applications (Material No. 11127) to optimize performance in specialized photolithography workflows, ensuring compatibility with diverse semiconductor device requirements.

Key features

  • 1. Material Technology: Specialized Positive Photoresist Formula

    • With the advanced positive photoresist material (Material 11127), you can achieve precise photolithography patterning for high-resolution semiconductor manufacturing. This specialized formulation ensures compatibility with demanding microchip fabrication processes, outperforming generic photoresists in precision and consistency*.

  • 2. Performance Parameters: Enhanced Coating Uniformity

    • With surfactant-based technology, you can achieve uniform thin-film coating across substrates, reducing defects compared to non-surfactant alternatives. This improves yield rates in semiconductor production by minimizing surface tension-related imperfections*.

  • 3. Scenario Solutions: Tailored for Critical Semiconductor Applications

    • Designed for photolithography in semiconductor manufacturing, this photoresist enables reliable pattern transfer for microchip fabrication. Its customization (Material 11127) ensures optimal performance in high-precision industrial workflows, unlike one-size-fits-all solutions*.

  • 4. Certification Standards: UN-Regulated Safety Compliance

    • With UN Number 1866 certification, you can ensure safe global transportation and handling, meeting strict hazardous material regulations. This guarantees compliance with international safety standards for industrial chemical use*.

  • 5. Reliability Through Traceability: Batch and Expiration Tracking

    • With batch-specific tracking (Batch A016F98008) and clear expiration dates (e.g., 03.09.2016), you can maintain consistent performance and quality. This minimizes production risks linked to material degradation compared to unlabeled or untracked chemicals*.

Product details

MICROPOSIT S1805 Positive Photoresist

MICROPOSIT S1805 Positive Photoresist is a specialized surfactant-based chemical auxiliary agent designed for precision photolithography in semiconductor manufacturing. With a net quantity of 3.785 L (1 GAL) and UN 1866 classification, it ensures safe, compliant handling while delivering high-resolution patterning for microchip fabrication.

Technical specifications

FeatureSpecificationBenefit
Material TypePositive photoresist (Material #11127)Enables precise light-sensitive patterning
ApplicationPhotolithography for semiconductorsCritical for microchip and nano-device manufacturing
Chemical ResistanceStable under standard etching processesMaintains integrity during fabrication steps
Viscosity12-15 cP at 25°CEnsures uniform coating on substrates
CertificationUN 1866 (Hazardous material compliant)Meets global transportation safety standards

Customization guide

Adjustable parameters include viscosity (±10% range) and pH level (3.0–5.0) to meet specific substrate compatibility or process requirements.

Get inspired

Optimize your photolithography workflows with MICROPOSIT S1805. Its tailored surfactant properties reduce defects in high-precision patterning, while its stability ensures consistent performance across batch runs (e.g., batch A016F98008).

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Resolution (µm)0.5+15% (0.43 µm)+30% (0.35 µm)*
**Sensitivity (mJ/cm²)200Enhanced (170)Premium (150)
Chemical ResistanceStandard+20% durabilityTriple industry benchmark
Viscosity Range12-15 cPAdjustable (10-18 cP)Customizable (8-20 cP)

Supplier's note

  1. Key Breakthroughs:

    • Enhanced Sensitivity: The Advanced Model’s 170 mJ/cm² requirement reduces exposure time by 15% compared to legacy systems.
    • Triple Chemical Resistance: The Pro Model’s formulation withstands harsh etching agents 3× longer than industry standards.
    • Custom Viscosity: The Pro’s 8-20 cP range accommodates both thin-film and thick-layer applications.

  2. Optimal Selection:

    • Base Model: Ideal for standard semiconductor lines requiring cost-effective, proven performance.
    • Advanced Model: Suited for R&D labs prioritizing faster patterning (e.g., 0.43 µm resolution) without full Pro-tier investment.
    • Pro Model: Essential for high-volume production of advanced chips (e.g., 7nm nodes) where ultra-fine resolution and extreme durability are critical.

With the Pro Model’s tripled chemical resistance, you can safely process aggressive etching chemicals, extending tool uptime by 40%. Pair its low viscosity with precision coaters to achieve defect-free 3D NAND structures.

Frequently asked questions

  • Which positive photoresist model suits small-scale semiconductor manufacturing?

  • How to clean and maintain the frothing nozzle of the MICROPOSIT S1805 G2?

  • Positive vs. Negative Photoresist: Which is better for microchip fabrication?

  • Can the MICROPOSIT S1805 G2 be customized for specific semiconductor applications?

  • Is the MICROPOSIT S1805 G2 compliant with semiconductor industry safety standards?

  • How should I store the MICROPOSIT S1805 G2 to ensure longevity?

  • What safety precautions are required for handling this photoresist?

  • Does the surfactant type in MICROPOSIT S1805 G2 improve coating uniformity?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Industry Standard Positive PhotoresistGeneral semiconductor fabrication- Chemical Resistance: Withstands 20+ chemical exposures (ASTM D543)
- Resolution: 0.5 µm (ISO 9362)
- Sensitivity: 100 mJ/cm² (ISO 10878)		- Widely compatible with existing processes
- Cost-effective		- Limited resolution for advanced nodes
- Lower chemical resistance ▼
Our Base Positive Photoresist (G1)Standard semiconductor fabrication- Chemical Resistance: Withstands 30+ exposures (ASTM D543)
- Surfactant-based formulation (enhances coating uniformity)
- Resolution: 0.4 µm (ISO 9362)		- Improved chemical resistance over industry standard
- Better coating consistency		- Still suboptimal for high-precision applications ▼
- Requires controlled storage (shelf life: 12 months)
Our Advanced Positive Photoresist (G2)High-precision semiconductor manufacturing- Chemical Resistance: Withstands 50+ exposures (ASTM D543) ▲
- Resolution: 0.3 µm (ISO 9362) ▲
- Sensitivity: 60 mJ/cm² (ISO 10878) ▲
- Shelf Life: 18 months (ASTM D3232) ▲		- Enables submicron patterning
- Faster exposure times
- Extended shelf life ▲		- Higher cost ▲
- Requires advanced lithography tools ▲
- Hazardous material (UN 1866) ▲
Negative PhotoresistSpecialty reverse-pattern applications- Chemical Resistance: Withstands 25+ exposures (ASTM D543)
- Resolution: 0.6 µm (ISO 9362)
- Sensitivity: 120 mJ/cm² (ISO 10878)		- Ideal for reverse patterning in niche applications
- Stable under harsh conditions		- Lower resolution than positive resists ▼
- Higher cost ▲
- Less compatible with standard workflows ▼
Photoresist DeveloperPost-exposure development step- Development Time: 30 seconds (ISO 10252)
- Uniformity: ±5% (ASTM F2133)		- Ensures consistent pattern transfer
- Reduces defects in critical layers		- Requires precise temperature control (25°C ±1°C)
- Short shelf life (6 months) ▼
Etching ChemicalsSubstrate etching in photolithography- Etch Rate: 1.2 µm/min (ASTM B568)
- Selectivity: 10:1 (ISO 10715)		- High selectivity for precise feature definition
- Rapid etching for efficiency		- Hazardous handling (UN 2810) ▲
- Corrosive to equipment ▲
- Environmental disposal challenges ▲

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