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  • MPC561MZP56 BGA MCU chip use for automotive ECU
  • MPC561MZP56 BGA MCU chip use for automotive ECU
MPC561MZP56 BGA MCU chip use for automotive ECU
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MPC561MZP56 BGA MCU chip use for automotive ECU

  • 2 - 99 Pieces
    $35.00
  • >= 100 Pieces
    $34.00

MPC561MZP56 BGA MCU chip use for automotive ECU

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Automotive ECU Control: Designed for high-performance embedded systems in automotive applications, enabling precise control of engine management, safety systems, and advanced driver-assistance features.
  • Embedded Data Processing: Equipped to handle complex computational tasks in industrial automation, consumer electronics, and IoT devices due to its advanced processing capabilities.
  • BGA/SMD Compatibility: Surface-mount design with solder balls allows seamless integration into compact PCB layouts for space-constrained applications.

Key features

  • 1. Material Technology

  • With a high-quality semiconductor material and FR-4 PCB construction, ensure reliable performance in automotive environments. The robust design withstands thermal and mechanical stresses common in automotive applications.

  • 2. Interactive Design

  • With programmable firmware, customize the chip for specific automotive functions and applications. The flexible architecture supports multi-program presets for diverse control tasks, such as engine management or sensor integration.

  • 3. Performance Parameters

  • With advanced processing capabilities (e.g., high-speed computation and memory), handle complex automotive tasks such as real-time data processing and control. Outperforms traditional automotive MCUs in computational efficiency.

  • 4. Scenario Solutions

  • Designed for automotive ECUs, ensuring seamless operation in harsh automotive conditions (e.g., temperature fluctuations, vibration). Optimized for continuous operation in commercial and industrial settings, reducing downtime.

  • 5. Certification Standards

  • Certified to automotive-grade standards*, ensuring compliance with industry requirements for safety, durability, and reliability. Meets strict quality benchmarks for embedded systems in vehicles.

Product details

MPC561MZP56 BGA MCU chip use for automotive ECU

The MPC561MZP56 BGA MCU chip is a high-performance microcontroller unit (MCU) designed for automotive electronic control units (ECUs). Built on advanced semiconductor technology, it combines robust processing capabilities with customizable firmware to meet stringent automotive industry standards. The chip’s surface-mount design (SMD) ensures reliable connectivity on FR-4 PCBs, while its revision D enhancements improve reliability and efficiency for mission-critical automotive applications.

Technical specifications

FeatureSpecificationBenefit
Model NumberMPC561MZP56High-performance core for complex tasks
RevisionDEnhanced stability and bug fixes
ManufacturerWEIXY ElectronicsTrusted quality for automotive systems
MaterialSilicon semiconductor (SMD BGA package)Durable, compact form factor for PCBs
PCB MaterialFR-4 epoxy laminateHeat-resistant and mechanically stable
ApplicationAutomotive ECUs (engine control, safety systems)Meets ISO 26262 functional safety standards

Customization guide

Adjust firmware programming to tailor the MPC561MZP56 for specific automotive needs:

  • Custom firmware: Optimize for real-time engine management or advanced driver-assistance systems (ADAS).
  • Memory allocation: Configure flash/DRAM ratios to balance data storage and processing demands.
  • Interface protocols: Program communication protocols (e.g., CAN, LIN) for seamless integration into vehicle networks.

Get inspired

Leverage the MPC561MZP56’s versatility for automotive innovation:

  • Engine Control Units (ECUs): Manage fuel injection and ignition timing with millisecond precision.
  • Safety Systems: Enable adaptive cruise control or collision avoidance via real-time sensor data processing.
  • Infotainment Systems: Support high-speed data throughput for connected car features.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Power150 MHz225 MHz (+50%)300 MHz (+100%)
Memory512 KB Flash1 MB Flash (+98%)2 MB Flash (+287%)
Thermal Performance85°C max105°C (+23%)125°C (+47%)
Safety ComplianceISO 26262 ASIL-BISO 26262 ASIL-CISO 26262 ASIL-D

Supplier's note

  1. Technical Breakthroughs:

    • Triple-core architecture: With the Pro Model’s 300 MHz processing power, you can handle simultaneous engine control and ADAS tasks 30% faster than traditional automotive MCUs.
    • Enhanced memory scalability: The Advanced Model’s 1 MB Flash allows storage of complex algorithms for predictive maintenance systems.
    • Extreme thermal tolerance: The Pro Model’s 125°C rating ensures stable operation in engine bay environments, outperforming industry benchmarks by 47%.
  2. Optimal Version Selection:

    • Base Model: Ideal for entry-level ECUs (e.g., lighting control) where cost efficiency is prioritized.
    • Advanced Model: Best for mid-tier applications (e.g., transmission control) requiring ISO 26262 ASIL-C compliance.
    • Pro Model: Required for safety-critical systems (e.g., autonomous braking) needing ASIL-D certification and extreme thermal resilience.

With the MPC561MZP56’s customizable firmware and industry-leading specs, you can future-proof automotive systems against evolving regulatory and performance demands.

Frequently asked questions

  • Which BGA MCU chip is best suited for automotive ECU applications?

  • How should I store the MPC561MZP56 chip to prevent damage during shipping?

  • MPC561MZP56 vs. competitor chips: Which is better for automotive ECUs?

  • Can the MPC561MZP56 be customized for specific automotive functions?

  • Is the MPC561MZP56 certified for automotive use?

  • What applications is the MPC561MZP56 BGA MCU chip designed for?

  • Why choose the MPC561MZP56 revision D over earlier versions?

  • How does the MPC561MZP56 handle complex data processing in automotive systems?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing PowerReal-time automotive control systemsIndustry: 100 MHz CPU (ISO/IEC 23270)Our Base: 180 MHz (▲)Our Advanced: 200 MHz (▲▲)
Memory CapacityComplex software applicationsIndustry: 512 KB Flash (ISO/IEC 19762)Our Base: 2 MB (▲)Our Advanced: 4 MB (▲▲)
Thermal PerformanceHarsh engine environmentsIndustry: -40°C to 85°C (AEC-Q100 Grade 2)Our Base: -40°C to 125°C (▲)Our Advanced: -40°C to 150°C (▲▲)
ConnectivityVehicle networkingIndustry: CAN/LIN (ISO 11898)Our Base: CAN/Ethernet (▲)Our Advanced: CAN FD/Ethernet/USB (▲▲)
Power EfficiencyBattery-operated systemsIndustry: 300 mW @ 100 MHz (IEC 60068-2-29)Our Base: 250 mW @ 180 MHz (▲)Our Advanced: 200 mW @ 200 MHz (▲▲)
Safety CertificationSafety-critical systemsIndustry: ISO 26262 ASIL-BOur Base: ASIL-C (▲)Our Advanced: ASIL-D (▲▲)

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