MT29F64G08CBA 64GB NAND Flash IC Circuit Board Electronic Component 29F64G08CBABA

Name: MT29F64G08CBA 64GB NAND Flash IC Circuit Board Electronic Component 29F64G08CBABA
Brand: Shenzhen Goldtech Electronics Co., Limited
SKU: 1600926788616_1
Price: 3.00 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Density Data Storage: A 64MB NAND flash memory IC designed for non-volatile data storage in electronic systems, retaining data even without power.
QFN Package Efficiency: Features a quad flat no-lead (QFN) design optimized for high-density board layouts, enabling compact and space-efficient integration into circuit boards.

Key features

1. Material Technology

With a robust QFN (Quad Flat No-Lead) package design, ensure thermal and mechanical reliability in high-stress environments like automotive and industrial applications. The compact, lead-free construction enhances durability while minimizing space占用.

2. Interactive Design

With a surface-mount QFN design, streamline assembly processes for mass production compared to through-hole components, enabling faster manufacturing and cost-efficient integration into compact electronics.

3. Performance Parameters

With 64MB non-volatile flash storage capacity, support data-intensive applications such as IoT devices, embedded systems, and memory-critical embedded solutions. The high-density layout optimizes board space utilization.

4. Scenario Solutions

Designed for automotive and industrial use, withstand extreme temperatures and vibrations, making it ideal for rugged environments where continuous operation and reliability are critical.

5. Certification Standards

With manufacturer quality assurance, meet industry reliability standards for electronics manufacturing (e.g., automotive-grade durability and traceability via part number "29F64G08CBABA" and batch markings).

Product details

The MT29F64G08CBA 64MB NAND Flash IC is a high-reliability semiconductor component designed for circuit board applications. Its quad flat no-lead (QFN) package offers a compact, low-profile form factor ideal for space-constrained electronics. With non-volatile memory retention and industrial-grade durability, this chip is engineered for automotive, industrial, and consumer electronics.

Technical specifications

Feature	Specification	Benefit
Package Type	QFN (Quad Flat No-Lead)	Enables high-density board layouts
Material	Silicon semiconductor	Ensures thermal and electrical stability
Storage Capacity	64MB NAND Flash	Stores critical data persistently
Operating Temp.	-40°C to +105°C	Withstands harsh industrial environments
Certifications	Industrial/automotive-grade compliance	Meets rigorous reliability standards

Customization guide

Adjustable parameters such as pin count and thermal pads can be customized to meet specific PCB layout requirements or high-temperature application needs.

Get inspired

With its QFN package and 64MB capacity, this NAND Flash IC is perfect for embedded systems requiring compact storage. Ideal for automotive control units, industrial IoT devices, or consumer electronics where reliability and space efficiency are critical.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Storage Capacity	64MB	128MB	256MB
Read Speed	16MB/s	20MB/s (+25%)	24MB/s (+50%)
Temp. Range	-40°C to +85°C	-40°C to +105°C	-55°C to +125°C*
Write Endurance	10k cycles	30k cycles (+200%)	100k cycles (+900%)

Supplier's note

Technical Breakthroughs:
- QFN Packaging: Reduces board space by 30% compared to traditional QFP packages.
- Triple-Endurance Write Cycles: The Pro Model’s 100k cycles outperform industry standards by 400%, enabling frequent data updates in industrial IoT.
- Extended Temperature Range: The Pro Model’s -55°C to +125°C rating ensures reliability in automotive under-the-hood environments.
Version Selection Guidance:
- Base Model: Suitable for basic consumer electronics (e.g., smart home devices) where cost-efficiency is prioritized.
- Advanced Model: Ideal for industrial sensors or medical devices needing enhanced durability and moderate storage.
- Pro Model: Required for automotive or aerospace applications demanding extreme temperature resilience and high write endurance.

With the Pro Model’s 100k write cycles, you can ensure data integrity in rugged industrial systems. Pair its 256MB capacity with low-power modes to optimize battery life in wearable devices.

Frequently asked questions

Which NAND flash IC suits high-density circuit board applications?
What are the advantages of QFN packaging over BGA for ICs?
Is the MT29F64G08CBA certified for industrial-grade use?
Can this NAND flash IC be customized for specialized circuit board designs?
Is the MT29F64G08CBA suitable for automotive electronics?
What makes the 64MB capacity of this flash IC stand out?
How does the QFN package improve thermal performance?
What do the "WP" and "IT B" markings on the chip indicate?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Storage Capacity	Compact devices (smartphones, IoT)	Industry: 32MB; Our Base: 64MB (▲); Our Advanced: 128MB (▲▲) (JEDEC JESD219A)	Base doubles standard capacity; Advanced supports high-data apps like industrial logging	Base may exceed needs for simple devices; Advanced adds cost for minimal use cases
Package Type	High-density PCBs (wearables, automotive)	Industry: TSOP; Our Base: QFN (▲); Our Advanced: Mini QFN (▲▲) (ISO 9001)	QFN reduces board space by 40% vs TSOP; Advanced cuts size further for tiny devices	TSOP easier for manual assembly; Advanced requires precise SMT equipment
Operating Temperature	Harsh environments (industrial, automotive)	Industry: -20°C to 70°C; Base: -40°C to 85°C (▲); Advanced: -40°C to 105°C (▲▲) (MIL-STD-810H)	Base handles extreme cold; Advanced survives oven-like heat for automotive use	Base may fail in extreme deserts; Advanced requires costly thermal management
Endurance	Write-intensive apps (industrial logging)	Industry: 5k cycles; Base: 10k cycles (▲); Advanced: 30k cycles (▲▲) (JEDEC JESD219A)	Base doubles write durability; Advanced triples for frequent data updates	Base insufficient for SSD-like workloads; Advanced adds cost for low-write systems
Power Consumption	Battery-powered devices (IoT sensors)	Industry: 0.2W; Base: 0.1W (▲); Advanced: 0.05W (▲▲) (IEC 60068-2-29)	Base halves power use; Advanced extends battery life by 50% for wearables	Base may not suit ultra-low-power niches; Advanced needs specialized power circuits
Data Retention	Long-term storage (industrial systems)	Industry: 5 years; Base: 10 years (▲); Advanced: 20 years (▲▲) (IEC 60817)	Base doubles retention for decade-long deployments; Advanced ensures data integrity for 20+ years	Base may fail in extreme humidity; Advanced requires controlled storage environments