Main Control Unit Board SLF1CSHO 03021UDH for HuaWei Wireless Microwave Host IDU RTN950A RTN 950A

Technical specifications

Customization guide

Adjustable parameters include memory capacity expansion (via additional SDRAM modules) and interface configuration (custom PCIe/SFP port layouts) to meet specialized telecom infrastructure needs.

Get inspired

With its modular design and high-speed interfaces, this board is ideal for building scalable telecom solutions. For instance, its PCIe slot enables seamless integration with high-throughput networking devices, while the DSP chip ensures low-latency signal processing in 5G base stations or data centers.

Choose your model

Supplier's note

1. Key Breakthroughs:

   • The DSP chip enables real-time signal processing at 1.8 GHz in Pro models, outperforming industry-standard 1.2 GHz designs.
   • Thermal efficiency improvements (e.g., Pro model’s 70°C max temp) reduce downtime in high-heat telecom environments.
   • Modular interfaces allow users to mix SFP+/QSFP28 ports, adapting to evolving networking demands.

2. Version Selection Guide:

   • Base Model: Ideal for basic 4G/5G backhaul systems requiring 2GB memory and standard SFP ports.
   • Advanced Model: Best for mid-tier data centers needing 4GB memory and SFP+ expansion for faster data transfers.
   • Pro Model: Choose for high-throughput 5G core networks, where 8GB memory and 8x QSFP28 ports ensure 20% faster data processing than competitors.

*Pro model’s thermal efficiency surpasses industry benchmarks by 14% due to advanced heat sink design.