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  • Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine
  • Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine
  • Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine
  • Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine
  • Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine
  • Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine
Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine

Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine

  • >= 1 Pieces
    $8,300

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
View product details

Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Wire Bonding: Designed for manual wire bonding in small-scale production, enabling secure electrical connections in electronics assembly and microelectronics research.
  • Modular Customization: Adjustable components allow adaptation to different wire materials (e.g., gold, aluminum) and bonding requirements, ideal for prototyping and educational experiments.

Key features

  • 1. Durable Material Construction

    • With a sturdy corrosion-resistant metal body, ensure long-lasting durability in laboratory environments compared to all-plastic alternatives*.

  • 2. User-Friendly Interactive Design

    • With an ergonomic control panel featuring programmable presets, customize bonding parameters for precise research applications compared to basic manual controls*.

  • 3. Precision Performance

    • With precision bonding accuracy within ±0.1mm, achieve consistent results in small-scale production compared to traditional manual methods*.

  • 4. Versatile Modular Design

    • With a modular design, adapt to diverse research or educational projects, ideal for small quantity production compared to bulky industrial machines*.

  • 5. Compliance with Safety Standards

    • With CE certification, ensure compliance with EU safety standards for institutional and research use.

Product details

Manual Wire Bonder for for Small Quantity Production School Institution Research Department Wire Bonding Machine

The Manual Wire Bonder is a precision-engineered machine designed for small-scale production, research, and educational use. Built with a sturdy metal-and-plastic composite frame, it combines durability with portability. Its ergonomic design and programmable control panel enable precise wire bonding for electronics components, making it ideal for academic labs, prototyping, and quality control tasks.

Technical specifications

FeatureSpecificationBenefit
MaterialMetal (base) + durable plastic (panel)Lightweight yet rugged for lab environments
Precision±50μm bond placement accuracyEnsures reliable connections in miniaturized circuits
Control SystemManual operation with digital displayUser-friendly setup for educational use
CertificationCE-compliant safety standardsMeets EU safety requirements for institutions
Work Surface200x150mm adjustable platformAccommodates varied component sizes

Customization guide

Adjustable work surface dimensions (150-200mm width) and modular tool attachments allow customization for specific wire gauges or material types. Schools can pair it with basic probes for teaching, while research teams may add high-temperature nozzles for advanced material bonding.

Get inspired

Explore how this machine bridges theory and practice: prototype new sensor arrays, test microelectronics joints, or demonstrate wire bonding techniques in a classroom. Its compact design and open architecture make it a versatile tool for innovation.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
AutomationManual operationSemi-automated loopsFully automated
Precision±50μm±30μm (+40% improvement)±20μm (+150% over base)
CustomizationBasic tool setAdd-on module slotsFull API integration
Load Capacity50g components200g (+300%)500g (+900%)

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s ±20μm precision (triple the base version) enables bonding in MEMS devices.
    • CE certification ensures compliance with EU safety standards, critical for institutional procurement.
    • Modular design allows swapping of ultrasonic/nozzle heads to handle gold, aluminum, or copper wires.

  2. Version Selection Guide:

    • Educators: Base Model suffices for teaching fundamentals with its intuitive controls and cost-effectiveness.
    • Research Labs: Advanced Model’s semi-automation and 200g load capacity suit prototyping stress-tested components.
    • Industry Partners: Pro Model’s full automation and API compatibility integrate seamlessly into R&D workflows, reducing setup time by 30% compared to legacy systems.

With the Pro’s ultra-precise bonding, you can create high-reliability sensors for aerospace applications. Pair its API with CAD software to automate batch production, cutting errors by 50% versus manual setups.

Frequently asked questions

  • Which Manual Wire Bonder model is best suited for small quantity production in school labs?

  • How do I maintain the bonding head of a Manual Wire Bonder for longevity?

  • What materials are used in the construction of the Manual Wire Bonder?

  • Can the Manual Wire Bonder be customized for different wire types in research projects?

  • Is the Manual Wire Bonder CE-certified for safe use in institutional settings?

  • How does the Manual Wire Bonder compare to automated models for educational purposes?

  • What wire materials are compatible with this Manual Wire Bonder?

  • Does the Manual Wire Bonder support adjustable bonding parameters for research experiments?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionLab Equipment, Research FacilitiesIndustry Standard: Carbon Steel (ASTM A36)
Our Base: Stainless Steel & Polycarbonate (ISO 9001)
Our Advanced: Aerospace-grade Aluminum (MIL-A-8625)		▲▲ Corrosion resistance in Base; ▲▲ Lighter, durable Advanced for harsh environmentsBase: Moderate cost; Advanced: Higher price due to premium materials
Noise LevelAcademic Labs, Quiet WorkspacesIndustry Standard: 50 dBA (louder than a quiet room)
Our Base: 45 dBA (comparable to a library)
Our Advanced: 40 dBA (quieter than a refrigerator hum)		▲ Reduced disturbance in Base; ▲▲ Ideal for sensitive research in AdvancedAdvanced requires acoustic shielding for extreme quietness
WeightPortable Use, Classroom SetupIndustry Standard: 85 kg (ISO 3801)
Our Base: 65 kg (ISO 3801)
Our Advanced: 50 kg (ISO 3801)		▲▲ Easier mobility in Base; ▲▲ Ultra-light Advanced for frequent relocationAdvanced may sacrifice some structural rigidity
CertificationGlobal Academic InstitutionsIndustry Standard: Basic Compliance
Our Base: CE Certified (EMC Directive 2014/30/EU)
Our Advanced: CE + UL + RoHS (IEC 60950-1)		▲ Base meets EU standards; ▲▲ Advanced ensures global regulatory complianceAdvanced certification adds to production costs
Automation LevelR&D Prototyping, Small-Batch ProductionIndustry Standard: Fully Manual
Our Base: Semi-Automatic (ISO 13849)
Our Advanced: Fully Programmable (ISO 10218-1)		▲ Base reduces operator fatigue; ▲▲ Advanced enables precise, repeatable workflowsBase requires skilled labor; Advanced needs software expertise
CustomizationMulti-Disciplinary ResearchIndustry Standard: Fixed Parameters
Our Base: Modular Components (ISO 13399)
Our Advanced: Parameter-Tunable Software (IEC 61131-3)		▲ Base supports basic adjustments; ▲▲ Advanced adapts to diverse material typesBase lacks advanced scripting; Advanced requires training

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