Category | Usage Scenarios | Characteristics | Advantages | Disadvantages |
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Material Composition | Consumer electronics, industrial devices | Industry: FR-4 (1.4mm thickness, ISO 178) | Our Base: FR-4 (1.6mm ▲, ISO 178) | Our Advanced: FR-4 (1.8mm ▲▲, ISO 178) |
| | | Enhanced mechanical strength (Base) | Superior thermal stability (Advanced) |
| | | Cost-effective for standard use cases | Higher cost for thicker Advanced variants |
| Surface Finishing | High-reliability applications (e.g., medical devices) | Industry: HASL (ASTM B201) | Our Base: OSP (IEC 60068 ▲) | Our Advanced: Immersion Gold (IPC-4552 ▲▲) |
| | | | Corrosion resistance (Base) | Superior solderability (Advanced) |
| | | | Lower cost | Higher cost for advanced finishes |
| Certifications | Global markets requiring compliance | Industry: RoHS, UL | Our Base: RoHS, UL, CQC ▲ | Our Advanced: RoHS, UL, CQC, REACH, EPR_Germany_Packing ▲▲ |
| | | | Meets basic regulatory standards | Full compliance with EU and Asia-Pacific regulations |
| | | | Simplified certification process | Requires additional testing for Advanced variants |
| Thermal Performance | High-power devices (e.g., servers) | Industry: Tg 140°C (ASTM D648) | Our Base: Tg 150°C ▲ (ASTM D648) | Our Advanced: Tg 170°C ▲▲ (ASTM D648) |
| | | | Improved heat resistance (Base) | Enhanced durability under extreme conditions (Advanced) |
| | | | Standard thermal tolerance | Higher cost for advanced materials |
| Design Flexibility | Prototyping, customization | Industry: Fixed layouts | Our Base: Modular design ▲ (ISO 9001) | Our Advanced: Hybrid SMT + Through-Hole ▲▲ (IPC-A-610) |
| | | | Easy component swaps (Base) | Supports complex assemblies (Advanced) |
| | | | Limited scalability | Requires advanced soldering skills for SMT |
| Connectivity Options | IoT, data acquisition systems | Industry: 5 connectors (IEC 60603) | Our Base: 8 connectors ▲ (IEC 60603) | Our Advanced: 12 connectors ▲▲ (IEC 60603) |
| | | | Expanded interface flexibility (Base) | Supports multi-device integration (Advanced) |
| | | | Moderate wiring complexity | Higher design complexity for Advanced variants |