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Multilayer PCB
  • Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing
  • Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing
  • Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing
  • Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing
  • Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing
  • Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing
Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing

Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing

  • 2 - 49 Pieces
    $6
  • 50 - 799 Pieces
    $3.60
  • >= 800 Pieces
    $0.50

Customization:

Customized logo（Min.Order: 10 pieces）
Customized packaging（Min.Order: 10 pieces）
Graphic customization（Min.Order: 10 pieces）
View product details

Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Data Processing: Equipped with multi-layer architecture and advanced ICs, the PCB supports complex tasks such as signal processing, communication, and power management.
  • Connectivity & Customization: Features USB, Ethernet, and modular connectors for seamless integration into devices requiring network and data transfer capabilities.

Key features

  • 1. Material Technology

    • With UL-certified FR-4 material, ensure reliable thermal and electrical performance for stable operation in demanding environments. The green solder mask enhances visibility during assembly and maintenance.

  • 2. Interactive Design

    • With integrated USB and Ethernet connectors, enable seamless connectivity for data transfer and networking in industrial, consumer electronics, or IoT applications. The customizable layout accommodates diverse component configurations.

  • 3. Performance Parameters

    • With multilayer PCB construction and high-density component placement (e.g., dual ICs, capacitors), achieve advanced signal processing and power management for complex devices like smartphones or control systems.

  • 4. Scenario Solutions

    • With CE certification and PCE branding, deploy in EU markets for applications ranging from industrial control systems to consumer electronics. The modular design supports rapid customization for specific use cases.

  • 5. Certification Standards

    • With REACH compliance and EPR certifications for France/Germany, meet stringent environmental and safety regulations—ensuring sustainable production and responsible waste management.

Product details

Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service China PCBA manufacturing

The Mobile Phone PCB Circuit Board Multilayer PCBA Assembly Service offers a robust foundation for electronic devices, combining high-performance materials with global compliance certifications. Designed for compact, high-density applications, this PCB supports connectivity via USB and Ethernet ports while meeting stringent environmental and safety standards.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialFR-4 epoxy laminate (green)Ensures thermal stability and electrical reliability in mobile devices and industrial systems.
CertificationsUL, REACH, EPR (France/Germany Packing)Meets global safety, environmental, and packaging regulations for EU and international markets.
ConnectorsUSB Type-C, Ethernet (RJ45)Enables seamless data transfer and networking in IoT devices and consumer electronics.
Component DensityHigh-density assembly (up to 200+ components/in²)Optimized for compact mobile phone designs requiring advanced functionality.
Layer Count4–8 layersSupports complex circuit routing for multi-functional electronics.

Customization guide

Adjustable component placement and connector configurations to meet specific space, connectivity, or regulatory requirements (e.g., adding IoT-specific ports or adjusting layer thickness for thermal management).

Get inspired

This PCB is engineered for innovation. Its FR-4 material and high-density layout enable sleek, powerful devices, while certifications like REACH ensure environmental responsibility. Whether designing a smartphone or an industrial controller, this board adapts to your vision.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
CertificationsULUL + REACHUL + REACH + EPR
Component DensityStandard (150 components/in²)+30% density+50% density*
Layer Count4 layers6 layers8 layers
Thermal ResistanceStandard FR-4Enhanced via copper thicknessMilitary-grade

Supplier's note

  1. Technical Breakthroughs:

    • FR-4 Material: With thermal conductivity 20% higher than standard PCB materials, it ensures stable operation in high-power environments.
    • EPR Compliance: The Pro model’s triple-layer packaging meets EU’s strictest waste management standards, reducing environmental impact.
    • High-Density Assembly: The Pro’s 50% denser component layout enables thinner, more powerful mobile devices than traditional designs.

  2. Version Selection Guide:

    • Base Model: Ideal for basic IoT devices or prototypes requiring minimal certifications.
    • Advanced Model: Suitable for EU-bound consumer electronics needing REACH compliance and moderate performance.
    • Pro Model: Best for premium smartphones or industrial systems demanding extreme durability, full EU/EPR compliance, and ultra-high component density.

    Example: With the Pro’s 8-layer design and military-grade thermal resistance, you can safely integrate high-power ICs for 5G modules—outperforming industry benchmarks by 40%. Pair this with EPR certification to streamline EU market entry.

Frequently asked questions

  • Which multilayer PCB model is best for high-frequency mobile phone applications?

  • FR-4 vs Rogers: Which material is better for high-speed mobile phone PCBs?

  • Can this mobile phone PCB be customized with additional USB/Ethernet connectors?

  • Is the mobile phone PCB assembly REACH and UL certified?

  • Why choose a 4-layer PCB for mobile phone assemblies?

  • Does the mobile phone PCB support USB 3.0 and Ethernet for high-speed data?

  • What’s the typical lead time for custom mobile phone PCB assemblies?

  • How does the PCB’s thermal design ensure stability in mobile devices?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionHigh-temperature industrial devicesIndustry: FR-4 (0.2 W/m·K)
Base: FR-4 (0.25 W/m·K ▲25% improvement)
Advanced: Aluminum-backed FR-4 (0.5 W/m·K ▲100% improvement)
(Thermal conductivity metrics per ASTM D5470)		Advanced handles extreme thermal loadsBase/Standard may underperform in harsh environments
Certifications & ComplianceEU/North American exportsIndustry: CE (Basic EU safety)
Base: CE + UL + REACH (Adds North American/EU chemical safety)
Advanced: CE + UL + EPR France/Germany + REACH (Full environmental compliance)
(EPR ensures recycling obligations)		Advanced meets stricter regional regulationsBase lacks EPR for certain regions
Connectivity OptionsHigh-speed data transfer systemsIndustry: USB 2.0 (480 Mbps)
Base: USB 3.0 (5 Gbps ▲10x faster)
Advanced: USB 3.2 Gen 2x2 (20 Gbps ▲4x faster than Base)
(Data rates per USB-IF standards)		Advanced supports ultra-fast data transfersBase may bottleneck in 5G/HD applications
Thermal PerformanceAutomotive/Industrial control systemsIndustry: FR-4 (-40°C to 140°C)
Base: Enhanced FR-4 (-40°C to 150°C ▲10°C improvement)
Advanced: Aluminum-backed (-40°C to 160°C ▲20°C improvement)
(Operating temp range per IEC 60068)		Advanced operates in extreme thermal rangesBase limited to moderate environments
Signal Integrity5G/radar communication devicesIndustry: Impedance tolerance ±15%
Base: ±10% (▲33% tighter tolerance)
Advanced: ±5% (▲67% tighter tolerance)
(Tolerance measured via TDR per IPC-2141)		Advanced minimizes signal loss/noiseBase may introduce latency in high-frequency apps
Customization FlexibilityMedical/defense specialized equipmentIndustry: Limited standard layouts
Base: Minor adjustments (2-4 layers)
Advanced: Full custom (up to 16 layers ▲8x layers) + component placement
(Layer count per IPC-2221)		Advanced supports niche design requirementsBase restricts complex configurations

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