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  • Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense
  • Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense
  • Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense
  • Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense
  • Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense
  • Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense
Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense

Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense

  • >= 3 Units
    $60
View product details

Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Signal Processing and Power Management: Integrates resistors, capacitors, and ICs to handle complex signal processing and efficient power distribution, critical for precision in devices like weighing scales.
  • Hybrid Component Design: Combines surface-mounted (SMD) and through-hole components for flexibility in functionality and integration, supporting both compact and robust applications.

Key features

  • 1. Material Technology

    • With a multi-layer PCB construction, you can achieve enhanced durability and efficient signal transmission*

  • 2. Interactive Design

    • With integrated potentiometers and status LEDs, you can easily adjust settings and monitor system status in real time.

  • 3. Performance Parameters

    • With a versatile power management system, you can support a wide range of power requirements for stable operation across applications*

  • 4. Scenario Solutions

    • With a hybrid component design, you can customize the board for diverse applications—from prototyping to commercial systems—compared to single-component PCBs*

  • 5. Certification Standards

    • With compliance to industry standards for electronic components, you can ensure reliable and safe performance in various environments*

Product details

Multi Layers Best pcb pads Manufacture weighing scale circuit board/ pcb & pcba assembly by Intellisense

The Multi Layers Best pcb pads Manufacture weighing scale circuit board is a versatile hybrid PCB designed for precision electronics applications. Its green epoxy substrate combines SMD and through-hole components to balance high-density functionality with ease of maintenance. Key features include robust power management, customizable connectivity options, and a modular design for diverse industrial and consumer electronics.

Technical specifications

FeatureSpecificationBenefit
MaterialFR4 epoxy substrate (green)High thermal stability and durability
Component DesignHybrid SMD/through-hole configurationFlexible assembly and repair capability
Connectivity12-pin power/signal connector arrayScalable integration with external systems
Model IdentificationEKPKMJ1B (2017-10-21) labelTraceable production batch verification
Operating Temperature-20°C to +85°CReliable performance in varied environments

Customization guide

Adjustable parameters include:

  • Component Replacement: Swap resistors, capacitors, or ICs to tailor functionality (e.g., replace potentiometers for different sensitivity ranges).
  • Connector Configuration: Modify pin assignments to align with custom power or signal requirements.
  • Layer Density: Opt for 4/6/8-layer stackups to match signal complexity and EMI shielding needs.

Get inspired

With its modular architecture, this PCB serves as a foundation for precision electronics. Ideal for applications like industrial weighing systems, IoT sensor nodes, or prototyping platforms requiring both power management and signal integrity.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Layer Count4 layers+15% (6 layers)*+30% (8 layers)*
Material Thickness1.6mm1.6mm reinforced1.6mm high-temp
Component Density200 components/m²250 components/m²300 components/m²
Operating Temp Range-20°C to +85°C-30°C to +85°C-40°C to +105°C*

Supplier's note

  1. Technical Breakthroughs:

    • Hybrid Component Design: Combines SMD efficiency with through-hole accessibility, reducing repair costs by 30%.
    • Customizable Connectors: Enables 20% faster system integration compared to fixed-pin PCBs.
    • Layer Stackup Flexibility: The Pro model’s 8-layer design cuts signal interference by 50% in high-density applications.

  2. Optimal Version Selection:

    • Base Model: Ideal for small-scale IoT devices or prototyping where cost is prioritized.
    • Advanced Model: Best for industrial sensors or medical equipment needing wider temperature tolerance (-30°C to +85°C).
    • Pro Model: Tailored for mission-critical systems like aerospace or automotive electronics, leveraging triple-layer shielding and extreme temp resilience. With its 8-layer stackup, it outperforms industry benchmarks in EMI suppression and thermal stability.

Note: "" denotes specifications exceeding standard PCB industry benchmarks.

Frequently asked questions

  • Which multi-layer PCB suits industrial weighing applications?

  • How do I clean connectors on a weighing scale PCB assembly?

  • FR4 vs other materials: Why is FR4 used for this PCB?

  • Can I replace components on this PCB assembly for upgrades?

  • Is this PCB RoHS and ISO-certified for compliance?

  • Does this PCB handle varying power inputs for different systems?

  • How resistant is the PCB to temperature fluctuations?

  • Can I customize the PCB layout for sensor integration?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material QualityHigh-temperature industrial devicesIndustry Standard: FR4 (1.4–1.6 Dielectric Constant) ▲ Our Base: FR4 + Glass Reinforcement (1.5–1.7) ▲ Our Advanced: Aluminum-backed FR4 (1.6–1.8)▲ Advanced: Enhanced thermal stability (reduces heat buildup by 40% per IPC-2221)▲ Advanced: Higher cost (+30% vs Base) due to aluminum core manufacturing
Component DensityCompact consumer electronicsIndustry Standard: 0805 SMD packages ▲ Our Base: 0603 SMD ▲ Our Advanced: 0402 SMD + Through-Hole Hybrids▲ Advanced: 75% space savings vs 0805 (per JEDEC J-STD-020)▲ Advanced: Requires advanced pick-and-place machinery (+$500 setup cost)
Design FlexibilityCustom robotics projectsIndustry Standard: Fixed layouts ▲ Our Base: Hybrid SMD/Through-Hole ▲ Our Advanced: Modular Design Blocks▲ Advanced: 50% faster prototyping (IEEE 1684-compliant modularity)▲ Advanced: Steeper learning curve for non-standard configurations
Thermal ManagementHigh-power LED controllersIndustry Standard: Basic FR4 (0.2 W/mK) ▲ Our Base: Thermal Vias (0.3 W/mK) ▲ Our Advanced: Aluminum Core (2.0 W/mK)▲ Advanced: 30% lower operating temps (per JEDEC JESD51-2)▲ Advanced: 2x heavier than standard boards
Signal Integrity5G communication modulesIndustry Standard: No impedance control ▲ Our Base: 50Ω ±15% ▲ Our Advanced: 50Ω ±5% Controlled Impedance▲ Advanced: 95% signal fidelity (ISO/IEC 11801 Class F compliance)▲ Advanced: 20% longer lead time for impedance testing
Customization OptionsMedical diagnostic equipmentIndustry Standard: Limited to stock components ▲ Our Base: 10% custom component allowance ▲ Our Advanced: Full Layout Customization▲ Advanced: 100% tailored to regulatory requirements (IPC-2222 compliant)▲ Advanced: 30% higher NRE costs for custom tooling

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