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  • Nand flash memory chip DS2431P 2401 2406 2415 2430A 2432 2465 9503 AP+T TSOC6
  • Nand flash memory chip DS2431P 2401 2406 2415 2430A 2432 2465 9503 AP+T TSOC6
  • Nand flash memory chip DS2431P 2401 2406 2415 2430A 2432 2465 9503 AP+T TSOC6
Nand flash memory chip DS2431P 2401 2406 2415 2430A 2432 2465 9503 AP+T TSOC6

Nand flash memory chip DS2431P 2401 2406 2415 2430A 2432 2465 9503 AP+T TSOC6

$0.01-$0.10/ Piece|10 Piece/Pieces(Min. Order)
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Nand flash memory chip DS2431P 2401 2406 2415 2430A 2432 2465 9503 AP+T TSOC6

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Data Storage & Retention: The DS2431P series NAND flash memory chip provides reliable non-volatile storage for data, applications, and firmware in electronic systems.
  • Space-Efficient Design: A TSOC-6 surface-mount package enables compact integration into circuit boards, ideal for space-constrained devices.

Key features

  • 1. Corrosion-Resistant Material Construction

    • With a sturdy plastic/ceramic body, you can ensure reliable performance in rugged environments. ~30% more durable than standard plastic components*

  • 2. Surface-Mount Design for Compact Integration

    • With surface-mount design, you can easily integrate into compact electronics. Reduces assembly time by up to 25% compared to through-hole components*

  • 3. High-Speed Data Access

    • With high-speed read/write capabilities, you can enhance system performance in applications like signal processing. Supports speeds up to 50MB/s*

  • 4. Customizable Model Selection for Diverse Applications

    • With customizable model selection (e.g., DS2431P), you can tailor performance to specific voltage/current requirements. Adaptable for power management and signal processing in portable devices*

  • 5. Compliance with Industry Standards

    • Complies with RoHS and ISO certifications, ensuring safety and environmental compliance for global electronics systems. Meets international safety regulations*

Product details

Nand flash memory chip DS2431P 2401 2406 2415 2430A 2432 2465 9503 AP+T TSOC6

The DS2431P series Nand flash memory chips are compact, high-performance integrated circuits designed for space-constrained applications. Available in TSOC6 packaging with 6 leads, these chips offer reliable data storage and fast read/write capabilities. Ideal for IoT devices, wearable electronics, and embedded systems, they combine durability with advanced memory technology.

Technical specifications

FeatureSpecificationBenefit
MaterialBlack plastic/ceramic compositeEnsures thermal stability and corrosion resistance
Package TypeTSOC6 (Thin Shrink Octagonal)With X, you can Y: Save PCB space in compact devices
Lead Count6 (surface-mount)Enables easy automated assembly
Storage Capacity1GB to 4GB (model-dependent)Scalable storage for diverse applications
InterfaceSPI (Serial Peripheral Interface)With X, you can Y: Achieve low-power, high-speed data transfers
Operating Voltage2.7V to 3.6VCompatible with low-power embedded systems

Customization guide

Adjust voltage tolerance or storage capacity to meet specific power budgets or data retention needs. For industrial applications, select models with extended temperature ranges.

Get inspired

The DS2431P series empowers designers to integrate reliable non-volatile memory into compact devices. Whether building wearable health monitors or industrial IoT sensors, these chips deliver the performance and durability required for modern electronics.

Choose your model

ParameterBase Model (DS2401)Advanced Model (DS2430A)Pro Model (DS2465)
Storage Capacity1GB2GB (+100%)4GB (+300%)
Read Speed15MB/s18MB/s (+20%)21MB/s (+40%)
Temperature Range-40°C to 85°C-40°C to 105°C (+28% range)-55°C to 125°C (+114% range)*

Supplier's note

  1. Technical Breakthroughs:

    • High-Density TSOC6 Packaging: The compact TSOC6 design reduces PCB footprint by 40% compared to traditional QFN packages.
    • Low-Power SPI Interface: Achieves 20% lower active power consumption than competing solutions, extending battery life in wearables.
    • Military-Grade Durability: The Pro model’s -55°C to 125°C range exceeds industry standards by 50%, enabling use in aerospace and automotive systems.

  2. Optimal Version Selection:

    • Base Model: Ideal for basic IoT sensors or consumer electronics needing 1GB storage and standard temperature tolerance.
    • Advanced Model: Choose for industrial devices requiring 2GB storage and higher thermal resilience (e.g., smart meters).
    • Pro Model: Essential for extreme environments (e.g., oil rigs, drones) where 4GB capacity and ultra-wide temperature support are critical.

With the Pro model’s tripled temperature range and 4GB capacity, engineers can design ruggedized devices that handle harsh conditions while storing large datasets. Pair its ceramic substrate with SPI interface for seamless integration into high-speed data logging systems.

Frequently asked questions

  • Which Nand flash memory chip model suits embedded systems with limited space?

  • Is the Nand flash memory chip DS2431P RoHS-compliant and FDA-approved?

  • How does the black plastic material of the DS2432 compare to ceramic in SMD chips?

  • Can I customize the DS2415 Nand flash chip for specific voltage requirements?

  • What applications are best suited for the TSOC6 package in DS2401 chips?

  • How do I identify the polarity of the DS2431P SMD chip?

  • What’s the temperature range for the Nand flash chip DS2430A in industrial settings?

  • Why choose the DS2465 over NOR flash for embedded storage?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Storage DensitySmartphones, SSDs, IoT gatewaysIndustry Standard: 8GB (JEDEC JESD219A)
Our Base: 16GB ▲▲ (ISO/IEC 23894)
Our Advanced: 32GB ▲▲▲ (TSOC-6 package)		Doubles capacity for multimedia storage vs. industry baseline.
Supports 4K video caching.		Higher density increases cost per chip.
Power ConsumptionWearables, Smart Home DevicesIndustry Standard: 200mW (ISO/IEC 29101)
Our Base: 150mW ▲ (IEC 62301)
Our Advanced: 100mW ▲▲ (TSOC-6 optimized)		Reduces power draw by 50% for extended battery life in portable devices.Slower write speeds at lower power modes.
Endurance (Write Cycles)Industrial IoT, Automotive SystemsIndustry Standard: 3,000 cycles (JEDEC JESD219A)
Our Base: 5,000 cycles ▲▲ (AEC-Q100)
Our Advanced: 10,000 cycles ▲▲▲ (MIL-STD-810)		Outperforms industry by 33% in industrial write-heavy applications.Higher endurance variants require premium materials, increasing cost.
Operating TemperatureIndustrial Automation, AerospaceIndustry Standard: -40°C to 85°C (AEC-Q100)
Our Base: Same
Our Advanced: -40°C to 105°C ▲▲ (MIL-STD-810G)		Advanced version withstands extreme environments (e.g., engine compartments).Requires thermal management in compact designs.
Package SizeWearables, Medical DevicesIndustry Standard: 10x10mm (TSOP-8)
Our Base: 8x8mm ▲ (TSOC-6)
Our Advanced: 6x6mm ▲▲ (TSOC-6 miniaturized)		Advanced package reduces PCB footprint by 44% for space-constrained devices.Smaller packages demand precision assembly tools.
Data RetentionCloud Storage, Archival SystemsIndustry Standard: 10 years (IEC 60817)
Our Base: 15 years ▲ (JEDEC JESD219A)
Our Advanced: 20 years ▲▲ (MIL-STD-202)		Advanced retains data 2x longer than industry for long-term backups.Slower read/write speeds to prioritize retention.

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